KR101968801B1

KR101968801B1 - Film formation device

Info

Publication number: KR101968801B1
Application number: KR1020157017934A
Authority: KR
Inventors: 히로유키 다무라; 마사나오 후지츠카; 데이지 다카하시; 다카시 시부야; 노부아키 시오이리; 사토시 다카하시; 게이지 우치다
Original assignee: 캐논 톡키 가부시키가이샤
Priority date: 2012-12-18
Filing date: 2013-12-03
Publication date: 2019-04-12
Also published as: JP6008731B2; WO2014097879A1; TW201430156A; JP2014118611A; KR20150096438A; TWI593817B

Abstract

SUMMARY OF THE INVENTION An object of the present invention is to provide a film-forming apparatus capable of satisfactorily maintaining the positional relationship between a substrate and a film-forming source (film-forming source), and capable of film formation at low cost, light weight and high precision. The film forming apparatus according to the present invention is a film forming apparatus having a vacuum chamber 3 in which a thin film is formed on a substrate 2 by depositing a film forming material injected from a film forming source 1, Is guided by a guide post (7) which is provided outside the vacuum chamber (3) and passes through a through hole (6) formed in the wall surface of the vacuum chamber (3) And the film forming source 1 is constituted by a base portion 11 supported on a base support 10 which is provided outside the vacuum chamber 3 and penetrates a through hole 9 formed in the wall surface of the vacuum chamber 3 So that the positional relationship between the film forming source 1 and the substrate 2 is maintained without being influenced by the deformation of the wall surface due to the depressurization of the vacuum chamber 3 by the transport mechanism and the film forming source 1 .

Description

[0001] FILM FORMATION DEVICE [0002]

The present invention relates to a film forming apparatus.

2. Description of the Related Art In recent years, organic EL display devices using organic electroluminescence devices have attracted attention as display devices replacing CRTs and LCDs.

This organic EL display device has a structure in which an electrode layer and a plurality of organic luminescent layers are laminated on a substrate and a sealing layer is formed on the luminescent layer and is self-luminescent. The organic EL display device has excellent high- It can be realized.

Such an organic EL device is generally manufactured by a vacuum deposition method, and a deposition mask is aligned by aligning a substrate with a deposition mask in a vacuum chamber, and a deposition film of a desired film formation pattern is formed on the substrate .

As a manufacturing method for mass-producing an organic EL device inexpensively and efficiently, there is a method in which a film is formed on a flexible substrate using a sheet-like plastic film while the flexible substrate is continuously transported by a roll-to-roll method.

However, in manufacturing such an organic EL device, it is necessary to increase the size of the vacuum furnace as the substrate size increases. Further, since an evaporation source, a transport mechanism, and the like are disposed in the vacuum chamber, it is necessary to suppress the warpage of the vacuum chamber wall by the vacuum exhaust to a minimum.

Therefore, it is necessary to increase the wall thickness of the vacuum chamber by increasing the size of the vacuum chamber, and to increase the number of ribs arranged on the outer wall of the vacuum chamber to increase the plate thickness and height. It is becoming more and more expensive.

For example, Patent Document 1 proposes a film-forming apparatus for depositing an evaporation material ejected from an evaporation source disposed below while conveying a substrate to be coated. However, in such a configuration, since the evaporation source is supported on the bottom surface of the vacuum container and the substrate transporting roller is supported on the side surface of the vacuum container, the positional relationship between the substrate and the evaporation source The film thickness distribution is deteriorated due to displacement. Therefore, the warpage of the vacuum container after vacuum evacuation must be suppressed by the above-mentioned technique, and the weight of the vacuum container becomes remarkable.

Patent Document 2 proposes a vacuum deposition apparatus capable of performing a stable scanning operation of an evaporation source without depending on the pressure state inside the vacuum chamber. However, the supporting position of the substrate and the mask is not specified, It is not clear whether or not the positional relationship between the substrate and the mask and the evaporation source after the substrate can be maintained. In the method of performing the scan film formation in a state in which the substrate and the mask are separated from each other in which the positional accuracy of the evaporation source including the substrate and the mask is strictly required, It is difficult to form a desired film-forming pattern on the substrate.

Japanese Patent Application Laid-Open No. 2002-348659 Japanese Patent Application Laid-Open No. 2010-248584

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to solve the above-described problems, and it is an object of the present invention to solve the above- Which is capable of satisfactorily maintaining the positional relationship between them and capable of forming a film at a low cost, a light weight and a high accuracy.

The gist of the present invention will be described with reference to the accompanying drawings.

A film forming apparatus having a vacuum chamber (3) in which a film forming material injected from a film forming source (1) is deposited to form a thin film on a substrate (2), characterized in that the substrate (2) The transporting mechanism is composed of a moving part 4 and a guide part 5 for guiding the movement of the moving part 4. The guide part 5 is provided in a vacuum tank 3 and is supported by a guide post 7 passing through a through hole 6 formed in a wall surface of the vacuum chamber 3. The guide post 7 or the guide post 7 is supported by the guide post 7, And the wall surface of the perimeter of the through hole 6 is hermetically connected via the stretching member 8. When the substrate 2 is transported by the transporting mechanism, Is supported on a base support (10) provided outside the vacuum chamber (3) and passing through a through hole (9) formed in the wall surface of the vacuum chamber (3) The mounting portion of the base support 10 or the base support 10 and the wall surface around the through hole 9 are hermetically sealed through the stretching member 12 A holding portion for holding the substrate 2 is provided on the outside of the vacuum chamber 3 and is provided on the wall surface of the vacuum chamber 3, And is held by the base portion 11 supported by the base support 10 which penetrates the formed through hole 9. The mounting portion of the base support 10 or the base support 10 and the through hole 9 is hermetically connected through the elastic member 12 so that the transport mechanism and the film forming source 1 or the substrate 2 are deformed by deformation of the wall surface of the vacuum tank 3 And the positional relationship between the film forming source (1) and the substrate (2) is maintained without being affected by the characteristics It relates to a film forming apparatus as.

A film forming apparatus having a vacuum chamber 3 in which a film forming material ejected from a film forming source 1 is deposited on a substrate 2 through a mask opening of a deposition mask 20 to form a thin film on the substrate 2 And a transporting mechanism for transporting the substrate 2 or the film formation source 1. The transporting mechanism includes a moving part 4 and a guide part 5 for guiding the movement of the moving part 4 The guide portion 5 is supported by a guide post 7 provided outside the vacuum chamber 3 and passing through a through hole 6 formed in the wall surface of the vacuum chamber 3 And the mounting portion of the guide post 7 or the guide post 7 and the wall surface around the through hole 6 are hermetically connected through the elastic member 8, The film forming source 1 is provided outside the vacuum chamber 3 and is provided on the wall surface of the vacuum chamber 3 The mounting portion of the base post 10 or the base post 10 and the through hole 9 are held by the base portion 11 supported by the base post 10 penetrating the through hole 9, When the film forming source 1 is transported by the transport mechanism, the holding portion for holding the substrate 2 is connected to the vacuum tank 3 Is held in a base part (11) which is provided outside the vacuum chamber (3) and is supported by a base support (10) passing through a through hole (9) formed in the wall surface of the vacuum chamber (3) Or the mounting portion of the base support 10 and the wall surface around the through hole 9 are hermetically connected via the elastic member 12 so that the substrate 1 Is not influenced by the deformation of the wall surface due to the reduced pressure of the vacuum chamber (3), the film forming source (1) and the substrate So that the positional relationship between the substrate (2) is maintained.

The guide portion 5 for guiding the movement of the moving portion 4 in which the substrate 2 of the transport mechanism is held is supported by the guide post 7, 1) is supported by the base pillars (10). The film forming apparatus according to claim 1, wherein the base pillars (11) are held by the base pillars (10).

The guide portion 5 for guiding the movement of the moving portion 4 in which the substrate 2 of the transport mechanism is held is supported by the guide post 7, 1) is supported by the base pillars (10). The film forming apparatus according to claim 2, wherein the base pillars (11) are held by the base pillars (10).

The substrate 2 and the deposition mask 20 are spaced apart from each other and the substrate 2 is configured to be movable relative to the deposition mask 20, And a thin film having a film forming pattern determined by the deposition mask (20) is formed on the substrate (2) in a wider range than the substrate (20).

The guide post 7 or the base post 10 is installed upright on a frame 13 provided outside the bottom of the vacuum chamber 3 so that the guide post 7 penetrates Wherein the through hole (6) or the through hole (9) through which the base post (10) penetrates is formed on the bottom surface of the vacuum tank (3) .

Further, the present invention relates to a film forming apparatus according to claim 1 or 2, wherein a linear motor for moving the moving section (4) is provided in the transport mechanism.

The moving part 4 is provided with a receiving part 14 filled in the atmosphere in the vacuum chamber 3 and an atmospheric pressure space outside the receiving chamber 14 and the vacuum chamber 3, A joint part 15 formed with a hollow introduction part for introducing a power supply wiring and a cooling pipe into the accommodating part 14 and a suction part 16 for sucking and holding the substrate 2 To the film forming apparatus according to claim 1 or 2.

The substrate aligning mechanism includes a substrate aligning mechanism for aligning the substrate 2 with respect to the guide portion 5. The substrate aligning mechanism includes a substrate aligning mechanism which is disposed in the accommodating portion 14 and moves the sucking portion 16 A reference mark display section (17) arranged in parallel with the guide section (5) and in which a reference mark is formed; a substrate marking section (17) for picking up an image of the substrate mark formed on the substrate An operation means for operating the substrate moving means 29 based on the image pickup result and an image pickup means receiving portion 18 for receiving the image pickup means. .

The image pickup means and the reference mark display section 17 are provided on either the guide section 5 or the guide post 7 and are provided mechanically independent of the vacuum chamber 3 To a film forming apparatus according to claim 9.

The film forming apparatus according to claim 1 or 2, further comprising a film forming source alignment mechanism (19) for aligning the film forming source (1) with respect to the substrate (2).

Further, the present invention relates to a film forming apparatus according to claim 1 or 2, wherein the film forming material is an organic material.

Since the present invention is constructed as described above, even if the vacuum chamber is enlarged due to enlargement of the substrate, the deformation of the wall due to the pressure fluctuation of the vacuum chamber does not affect the positional relationship between the substrate and the film formation source, It is possible to maintain the relationship satisfactorily, and to achieve a film forming apparatus capable of forming a film at a low cost, a light weight, and a high accuracy.

In particular, in the production of an organic EL device, it becomes a film-forming apparatus for manufacturing an organic EL device capable of coping with the enlargement of a substrate, depositing an organic layer with high precision, and realizing high-precision deposition.

In addition, in the invention according to claims 2 to 5, it is necessary to maintain the position of the substrate and the deposition mask at a high precision, and the film forming apparatus in which the functions and effects of the present invention are excellently exhibited.

In addition, according to the invention described in claim 6, a film-forming apparatus excellent in practicality can be realized easily with a simple structure.

Further, in the invention described in claim 7, by using a linear motor as the driving source, the positioning accuracy is high and the carrying stroke can be made long.

According to the eighth aspect of the present invention, since the movable portion is provided with the accommodating portion, the joint portion, and the attracting portion, when the substrate is conveyed while being adsorbed, the power supply wiring and the cooling pipe are repeatedly moved from the atmospheric side to the attracting portion The film forming apparatus can be continuously operated without raising the temperature of the substrate.

According to the invention of claim 9, since the substrate can be aligned parallel to the guide, it is possible to prevent the deposition pattern width from becoming larger than the desired film formation pattern width at the time of substrate transportation.

In the invention according to Claim 10, the imaging means and the reference mark display portion are arranged mechanically independently from the vacuum chamber, so that even if the vacuum chamber is deformed by vacuum evacuation, the alignment of the substrate is not affected.

According to the invention as set forth in claim 11, it is possible to position the film formation source with respect to the substrate with high accuracy in succession, and a desired film formation pattern can be formed at a desired position over the entire surface of the substrate.

According to the invention as set forth in claim 12, an apparatus for film formation of an organic material is provided, and further excellent practicality is obtained.

1 is a schematic explanatory side view of this embodiment.
2 is a schematic explanatory side view of the main part of this embodiment.
3 is a schematic explanatory side view of the film forming source of this embodiment.
4 is a schematic front view of the main part of this embodiment.
5 is a schematic explanatory plan view of the transport mechanism of this embodiment.
6 is a schematic front view of the moving part of the embodiment.
7 is a schematic front view of the transport mechanism of the present embodiment.
8 is a schematic front view of the imaging means of the present embodiment.

The operation of the present invention will be briefly described with reference to the drawings.

The film forming material ejected from the film forming source 1 is deposited on the substrate 2 through the mask opening of the deposition mask 20 and the thin film of the film forming pattern determined by the deposition mask 20 is transferred onto the substrate 2. [ As shown in FIG. At this time, for example, the substrate 2 and the deposition mask 20 are spaced apart from each other, and the substrate 2 is configured to be movable relative to the deposition mask 20 while being kept apart from the deposition mask 20, The thin film of the film formation pattern determined by the deposition mask 20 can be formed on the substrate 2 over a wider range than the deposition mask itself.

The present invention is also applicable to a case where both the transport mechanism for transporting the substrate 2 and both the film forming source 1 (or the transport mechanism for transporting the film forming source 1 and the substrate 2) The positional relationship between the substrate 2 and the film forming source 1 is not changed by being supported by the support pillars 7 and 10 provided so as not to be influenced by the pressure state in the vacuum chamber 3, I can do the tabernacle.

That is, the positional relationship between the substrate 2, the deposition mask 20, and the film formation source 1 is adjusted in the atmospheric pressure space to change the pressure in the vacuum chamber 3, Even if the wall surface of the vacuum chamber 3 is deformed, the conveying mechanism and the film formation source 1 are not provided on the wall surface of the vacuum chamber 3 but on a support provided on the outside of the vacuum chamber 3, The transport mechanism and the film forming source 1 are not affected by the deformation of the wall surface of the vacuum chamber 3 and the substrate 2 is not affected by the deformation of the wall surface of the vacuum chamber 3, Of the substrate 2 and the film formation source 1 in the direction orthogonal to the film formation surface of the substrate 2 does not change due to the deformation and the positional relationship between the substrate 2 and the film formation source 1 is maintained .

Therefore, according to the present invention, in order to prevent deformation of the wall surface of the vacuum chamber 3, it is not necessary to increase the wall surface or to provide a large number of ribs, that is, without increasing the size and weight of the vacuum chamber 3, It is possible to prevent a change in the positional relationship between the substrate 2 and the film formation source 1 due to the deformation of the wall surface of the bath 3. [

Further, by using, for example, a linear motor as a driving source for moving the moving part 4 of the transport mechanism, it is possible to transport the substrate with high accuracy.

For example, the moving section 4 may include a receiving section 14 filled with the atmosphere in the vacuum chamber 3 and an atmospheric pressure space outside the receiving chamber 14 and the vacuum chamber 3, A joint part 15 formed with a hollow introduction part for introducing power supply wiring and cooling piping into the accommodating part 14 and a suction part 16 for sucking the substrate 2, , A power feeding mechanism, a cooling mechanism, and a substrate attaching / detaching mechanism.

Since the substrate 2 sucked to the adsorption section 16 must be aligned parallel to the guide section 5 after the adsorption, the substrate 2, which is positioned parallel to the guide section 5 The reference marks formed on the reference mark display section 17 are arranged in the carrying direction of the substrate 2 and the reference marks and the substrate marks formed on the substrate 2 are photographed by the image pickup means so that the positional deviation is appropriately corrected It is good. At this time, the imaging means is accommodated, for example, in the imaging means accommodating portion 18, which is an atmospheric pressure space, and is photographed over a window provided on the wall portion of the imaging means accommodating portion 18. [

The image capturing means accommodating section 18 and the reference mark display section 17 are arranged in either one of the guide section 5 and the guide post 7 to be affected by the deformation of the vacuum tank 3 And the positions of the image sensing means and the reference mark display portion 17 adjusted in the atmosphere do not change in vacuum.

Example

A specific embodiment of the present invention will be described with reference to the drawings.

In this embodiment, a deposition material (for example, an organic material for manufacturing an organic EL device) vaporized from the deposition source 1 is deposited on the substrate 2 through the mask opening of the deposition mask 20 And a thin film having a film forming pattern defined by the vapor deposition mask 20 is formed on the substrate 2. The substrate 2 and the vapor deposition mask 20 are disposed apart from each other, The thin film of the film formation pattern determined by the deposition mask 20 in a range wider than the deposition mask 20 by the relative movement is formed on the substrate 2 The present invention has been made in view of the above problems.

That is, in the film forming apparatus of the above configuration, since the positional relationship between the substrate 2, the deposition mask 20, and the film forming source 1 is required to be extremely high, A guide portion 5 for guiding the movement of the moving portion 4 in which the film forming chamber 1 is held and a base portion 11 for holding the film forming chamber 1, 7 and the base support 10 so as to adjust the positional relationship between the substrate 2, the deposition mask 20 and the film formation source 1 in the atmospheric pressure space, Even if the wall surface of the vacuum chamber 3 is deformed by the pressure fluctuation caused by the vacuum state of the vacuum chamber 3, the substrate can be transported with high precision without changing the positional relationship between the substrate 2 and the film formation source 1 It is.

Explain each part in detail.

5 and 6, the guide section 5 includes a guide block 22 provided on the lower surface of the moving section 4 and a guide rail 23 into which the guide block 22 is fitted And a pair of guide bases 24 on which the guide rails 23 are disposed.

2, a guide post 7 for supporting the guide base 24 is fixed to a high rigidity member such as a steel plate provided on the outer bottom surface of the bottom of the vacuum chamber 3, And is provided so as to pass through the through hole 6 formed in the bottom surface of the vacuum chamber 3. [

The wall surfaces of the guide pillars 7 and the peripheries of the through holes 6 are hermetically connected by a stretchable member 8 (bellows 8) provided so as to cover the guide columns 7 . Concretely, the lower surface of the large diameter portion 7a of the guide post 7 and the wall surface around the through hole 6 opposed to the large diameter portion 7a are hermetically connected by the bellows 8. Instead of the guide post 7, the base 13, which is the mounting portion of the guide post 7, and the peripheral wall surface of the through hole 6 may be connected by the bellows 8.

Therefore, even if the outer wall of the vacuum chamber 3 is deformed by evacuating the inside of the vacuum chamber 3, the deformation is absorbed by the expansion and contraction of the bellows 8, so that the position of the guide post 7 and the guide base 24 It is possible to carry the substrate 2 with high accuracy without changing the substrate 2.

3, the film forming source 1 includes a base material 1 including a host material generating source 1a and a dopant material generating source 1b and a mask frame 21 having a deposition mask 20 laid thereon, (Base plate 11). The base pillars 10 supporting the base plate 11 are erected on the film forming source alignment mechanism 19 on the base 13 provided on the bottom surface of the bottom of the vacuum chamber 3, Through holes (9) formed in the bottom surface of the tank (3).

The base pillars 10 and the peripheral wall surfaces of the through holes 9 are hermetically connected using a stretching member 12 (bellows 12) provided so as to cover the base pillars 10 . Specifically, the bellows 12 hermetically connects the upper surface of the large diameter portion 10a of the base post 10 and the wall surface around the through hole 9 opposed thereto. The bellows 12 may be configured to connect not only the base column 10 but also the wall surface around the through hole 9 and the film forming source alignment mechanism 19 which is the installation portion of the base post 10.

Therefore, even if the outer wall of the vacuum chamber 3 is deformed by evacuating the inside of the vacuum chamber 3, the deformation is absorbed by the expansion and contraction of the bellows 12, so that the position of the base column 10 and the base plate 11 The film forming source 1 and the mask frame 21 provided with the deposition mask 20 can be aligned with respect to the substrate 2 at the time of transfer with high accuracy.

The base 13 supporting the transport mechanism and the film forming source 1 also supports the vacuum tank 3 at the same time. Concretely, as shown in Fig. 4, the vacuum tank 3 and the base 13 are connected to a spherical bearing 25 capable of receiving an axial load in both directions and a radial load So that the influence of the deformation of the vacuum chamber 3 by the vacuum exhaust does not reach the base 13.

A linear motor is used as the driving source of the transport mechanism. Therefore, a transport mechanism having high positioning accuracy, constant speed stability, cleanliness, and maintainability is achieved, and the stroke required for transporting the large-size substrate 2 can be made longer without restriction. When the rotational power of the drive motor provided outside the vacuum chamber 3 is transmitted to the ball screw in the vacuum chamber 3 via the magnetic fluid seal and rotated, The linear motor is structured such that the driving source is disposed inside the vacuum chamber 3 and is not affected by the deformation of the outer wall of the vacuum chamber 3 .

Specifically, the moving unit 4 holding the substrate 2 and moving together with the substrate 2 moves along the straight guide disposed on the guide base 24 as shown in Figs. 5 and 6 (Thrust force) between the plurality of magnets 27 disposed on the plate 26 attached to the inner side of the guide base 24 and the coil unit 28 attached to the moving unit 4 side, Is generated.

6 and 7, the moving part 4 includes a receiving part 14 which is an atmospheric pressure space in the vacuum chamber 3, and a holding part 14 which is an atmospheric pressure space. The holding part 14 and the outside of the vacuum chamber 3 A joint portion 15 which communicates the atmospheric pressure space of the substrate 2 and has a hollow introduction portion for introducing the power supply wiring and the cooling pipe into the accommodating portion 14 and a suction portion 16 for sucking and holding the substrate 2, .

A plurality of electrostatic chucks 31 are arranged in a flat stage base 30 and the adsorption unit 16 is configured to adsorb the substrate 2 on the surface of the electrostatic chuck 31. A support 32 for supporting the stage base 30 is provided through the through hole 34 in the bottom surface of the accommodating portion 14. The wall surface of the periphery of the through hole 34 of the stage base 30 and the accommodating portion 14 is sealed by the elastic member 33 (bellows 33) provided so as to cover the support pillars 32 To keep the atmosphere and vacuum in an airtight state. On the other hand, the support 32 and the wall surface around the through hole 34 may be connected by the bellows 33.

Since the substrate alignment mechanism has a servomotor and can not be placed under a vacuum environment, the substrate alignment mechanism is normally placed outside the vacuum chamber 3 (in the case of deposition down, So that the rigidity is increased so that the influence of deformation of the vacuum chamber 3 does not affect the alignment accuracy. However, in the present embodiment, by including the substrate moving means 29 for moving the stage base 30 by moving the column 32 of the substrate aligning mechanism in the accommodating portion 14, the deformation of the vacuum chamber 3 Since the influence does not affect the alignment accuracy of the substrate, the vacuum tank 3 does not need to have a high rigidity, and the weight can be reduced.

The accommodating portion 14 needs to have a high rigidity structure so that deformation caused by a pressure difference between atmosphere and vacuum does not affect the substrate alignment mechanism. However, the accommodating portion 14 has a small volume as compared with the vacuum chamber 3, It is possible to make a structure of a high rigidity without causing increase in size and weight and being light in weight and low in cost as a whole.

The electric power supply to the motor for the substrate aligning mechanism in the accommodating portion 14, the coil unit of the linear motor and the electrostatic chuck 31 is performed by supplying power from the power source in the standby space outside the vacuum chamber 3 to the joint portion 15 Through the hollow introduction portion. Specifically, the joint part 15 uses a link mechanism having a hollow structure that follows the movement of the accommodating part 14, and this hollow part serves as a hollow introduction part. Likewise, an air or water-cooled pipe is arranged from the atmospheric space outside the vacuum chamber 3 through the hollow introduction portion of the joint portion 15 in the motor, the coil unit and the stage base 30 that require cooling.

The joint part 15 connects the outer wall of the vacuum chamber 3 and the receiving part 14. When the vacuum chamber 3 is bent by the vacuum evacuation, the driving action and the air tightness of the joint part 15 are affected (Bellows 35) is provided between the vacuum chamber 3 and the joint portion 15 because a load is applied to the accommodating portion 14 and the high-precision conveyance of the substrate 2 is also affected. So that the influence of deformation of the vacuum chamber 3 is mitigated. Specifically, the wall surface around the through hole 36 of the vacuum tank 3 and one end of the joint portion 15 are hermetically connected by the bellows 35. On the other hand, the bellows 35 may be disposed between the other end of the joint part 15 and the accommodating part 14.

The linear pattern in which the substrate 2 and the deposition mask 20 are relatively moved while the substrate 2 is attracted to the adsorption section 16 is not parallel to the linear guide, , The substrate 2 after the adsorption must be aligned with respect to the linear guide.

Thus, in the present embodiment, the substrate alignment mechanism for aligning the substrate 2 with respect to the guide portion 5 is provided. The substrate aligning mechanism includes a substrate moving means 29 disposed in the accommodating portion 14 and moving the adsorbing portion 16 and a transparent portion 39 disposed parallel to the guide portion 5 An image pickup means for picking up a reference mark and a substrate mark formed on the substrate 2 and an operation means for operating the substrate moving means 29 based on the image pickup result, And an image pickup means accommodating portion (18) for accommodating the image pickup means.

More specifically, at least two reference marks formed on the reference mark display section 17 positioned parallel to the linear guide are arranged in the conveying direction of the substrate 2, and image pickup means such as a CCD camera 37 A reference mark and a substrate mark formed on the substrate 2 are photographed. At this time, since the imaging means can not be placed directly in the vacuum, it is accommodated in the imaging means accommodating portion 18, which is an atmospheric pressure space, and is photographed over the window 38 of the imaging means accommodating portion 18. [

The substrate 2 is inclined by moving the sucking portion 16 by the substrate moving means 29 so that the substrate mark of the sucked substrate 2 becomes a predetermined positional relation with respect to the reference mark And is conveyed parallel to the linear guide without losing.

The imaging means accommodating section 18 and the reference mark display section 17 are disposed at least on one of the guide base 24 and the guide support 7 so that they are mechanically independent from the vacuum chamber 3, The position of the image sensing means and the reference mark display portion 17 adjusted in the atmosphere is not influenced by the deformation of the lens barrel 3 and that the alignment accuracy is not deteriorated. In the present embodiment, it is arranged in the guide base 24.

In the present embodiment, the case where the substrate 2 is transported by the transport mechanism has been described, but the same applies to the case where the film formation source 1 is transported by the transport mechanism. In the present embodiment, the case of using the deposition mask 20 has been described, but the same is true of the case where the deposition mask is not used.

In the present embodiment, the pillars 7 and 10 are installed on the base 13, but if the rigidity can be ensured, the base 13 may not be provided, The support pillars 7 and 10 may be provided directly on the surface.

Further, in the present embodiment, it is possible to form the substrate 2 with high precision in the same manner when the substrate 2 is formed not only on the glass substrate 2 but also on the flexible substrate 2 (for example, a sheet-like plastic film) .

The present embodiment can be widely applied not only to vacuum deposition, but also to a CVD or sputtering apparatus having a vacuum chamber 3, or the like.

Claims

A film forming apparatus having a vacuum chamber in which a film forming material injected from a film forming source is deposited to form a thin film on a substrate, characterized in that the substrate or the film forming source is transported And a guide section for guiding the movement of the moving section. The guide section is provided on a guide post which is provided outside the vacuum chamber and passes through a through hole formed in the wall surface of the vacuum chamber And a wall surface of the periphery of the through hole is hermetically connected through the elastic member. When the substrate is transported by the transport mechanism, the film forming source Is held on a base portion which is supported by a base post which is provided outside the vacuum chamber and penetrates a through hole formed in the wall surface of the vacuum chamber And the mounting portion of the base post or the base post and the wall surface around the through hole are hermetically connected through the elastic member and when the film forming source is transported by the transport mechanism, Wherein the holding portion is held in a base portion provided on the outside of the vacuum chamber and supported by a base column passing through a through hole formed in the wall surface of the vacuum chamber, and the mounting portion of the base column or base column, So that the positional relationship between the film forming source and the substrate is maintained without being affected by the deformation of the wall surface due to the reduced pressure of the vacuum chamber And the guide portion extends in a moving direction of the moving portion, And a plurality of film forming units are provided along the moving direction of the moving unit.

And a vacuum chamber for depositing a film forming material ejected from a film forming source on a substrate through a mask opening of a deposition mask to form a thin film on the substrate, the film forming apparatus comprising a transport mechanism for transporting the substrate or the film forming source , The conveying mechanism is provided with a moving part and a guide part for guiding the movement of the moving part and the guide part is supported by a guide post which is provided outside the vacuum chamber and passes through the through hole formed in the wall surface of the vacuum chamber And the substrate is transported by the transport mechanism in the airtight state through the elastic member and the mounting portion of the guide post or guide post and the wall surface around the perforation hole are hermetically connected through the elastic member, And a base portion supported by a base post which penetrates a through hole formed in a wall surface of the vacuum chamber And the base of the base support and the wall surface of the perimeter of the through hole are hermetically connected through the elastic member and when the film forming source is transported by the transport mechanism, Is held in a base portion supported by a base support which is provided outside the vacuum chamber and penetrates a through hole formed in the wall surface of the vacuum chamber, The wall surface of the hole is hermetically connected through the elastic member so that the transport mechanism and the film forming source or the substrate are not influenced by the deformation of the wall surface due to the reduced pressure of the vacuum tank and the positional relationship between the film forming source and the substrate And the guide portion is configured to extend in a moving direction of the moving portion, And a plurality of struts are provided along the moving direction of the moving unit.

3. The image forming apparatus according to claim 1 or 2, wherein the guide portion for guiding the movement of the movable portion, in which the substrate of the transport mechanism is held, is supported by the guide post, And the support is supported by the base post.

3. The deposition mask according to claim 2, wherein the substrate and the deposition mask are spaced apart from each other, and the substrate is configured to be movable relative to the deposition mask, Wherein a thin film of the film forming pattern determined by the film forming device is formed on the substrate.

The vacuum cleaner according to claim 1 or 2, wherein the guide post or the base post is erected on a mount provided outside the bottom of the vacuum chamber, and the through hole or the base post Is formed on the bottom surface of the vacuum chamber.

The film forming apparatus according to claim 1 or 2, wherein a linear motor for moving the moving section is provided in the transport mechanism.

The vacuum cleaner according to any one of claims 1 to 3, wherein the moving unit comprises: a housing part filled with air in the vacuum tank; and an atmospheric pressure space outside the housing and the vacuum tank, A joint part formed with a hollow introduction part for introducing the pipe into the accommodating part; and an adsorption part for adsorbing and holding the substrate.

The substrate aligning apparatus according to claim 7, further comprising: a substrate aligning mechanism for aligning the substrate with respect to the guide portion, the substrate aligning mechanism including: substrate moving means disposed in the accommodating portion and moving the adsorbing portion; An image pickup means for picking up a reference mark and a substrate mark formed on the substrate; an operation means for operating the substrate moving means on the basis of the image pickup result; And an image capturing means accommodating portion for accommodating the image capturing means.

The film forming apparatus according to claim 8, wherein the imaging means and the reference mark display portion are disposed on either the guide portion or the guide post, and the vacuum trough is provided mechanically independent from the vacuum trough.

The film forming apparatus according to any one of claims 1 to 4, further comprising a film formation source alignment mechanism for aligning the film formation source with respect to the substrate.

The film forming apparatus according to claim 1 or 2, wherein the film forming material is an organic material.

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