JP2021095609A - Film deposition device, film deposition method, and method for manufacturing electronic device - Google Patents

Abstract

To provide a technology that can stably deposit a film with excellent reproductivity without obstructing movement of a film deposition source, and to improve durability of a film deposition device.SOLUTION: A film deposition device transfers power between wires in a wireless power feeding manner in at least any one of a connection part (21) between a vacuum chamber (10) and a first arm (31), a connection part (22) between the first arm (31) and a second arm (32) and a connection part (23) between the second arm (32) and an ambient air box (230).SELECTED DRAWING: Figure 1

Description

The present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an electronic device, and specifically, relates to a structure for supplying electric power from the outside into a vacuum chamber.

Recently, organic electroluminescent displays (OLEDs) have been in the limelight as flat panel displays. Organic electric field light emitting displays are self-luminous displays that are superior to liquid crystal panel displays in terms of response speed, viewing angle, thinning, etc., and are used in various mobile terminals such as monitors, televisions, and smartphones. It is rapidly replacing the display. In addition, its application fields are expanding to displays for automobiles and the like.

As a conventional film forming apparatus, for example, the one described in Patent Document 1 is known. That is, a substrate (object to be deposited) and a vapor deposition source (deposition source) arranged to face the substrate are arranged in the vacuum chamber, and the material is evaporated from the vapor deposition source to form a film on the substrate. It has become like. Inside the vacuum chamber, a movable connection box (atmosphere box) on which the vapor deposition source is mounted is provided, and a transfer device for accommodating electrical wiring and the like introduced into the atmosphere box from outside the vacuum chamber is provided. ..

This transfer device has a hollow structure whose inside is maintained at atmospheric pressure, and is equipped with two hollow arms (moving bodies) that are rotatably connected to three connecting parts (connecting parts), and the electrical wiring is a vacuum. It is introduced into the air box from the outside of the chamber, through the inside of each connection and the inside of each arm. When the atmospheric box moves, the transfer device moves while deforming, following the movement of the atmospheric box by changing the angle of the arm at each connecting portion.

Japanese Unexamined Patent Publication No. 2009-299176

In the conventional structure, the electrical wiring changes direction at the connection portion and its vicinity, and bending or twisting occurs locally at this portion. As the atmospheric box moves and the arm rotates, the degree of twisting and bending varies in the wiring portion passing through the connection portion. When the rotation angle becomes large, the twisting deformation and bending become large, and the force is concentrated on the turning portion of the wiring. The deformation of the wiring repeatedly acts every time the arm rotates, which causes deterioration of the wiring.

Further, as the film forming source and the drive mechanism for driving the film forming source become higher in performance and larger in size, the number of wirings arranged inside tends to increase and the wirings tend to become thicker. In that case, deformation (bending, twisting) of the wiring or the wiring bundle becomes difficult, and the rotation resistance of the connecting portion increases, which may hinder the movement of the film forming source.

The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to form a film that can stably and reproducibly form a film without hindering the movement of the film forming source. It is an object of the present invention to provide an apparatus, a film forming method, and a method for manufacturing an electronic device. Further, an object of the present invention is to improve the durability of the film forming apparatus.

The present invention connects a vacuum chamber, an atmosphere box arranged in the vacuum chamber and on which a film forming source is mounted and movable, a wall of the vacuum chamber, and the atmosphere box, and from the outside of the vacuum chamber. In a film forming apparatus including a wiring accommodating portion for accommodating wiring for supplying electric power to the film forming source, the inside of the wiring accommodating portion is composed of an atmospheric pressure environment, and the wiring accommodating portion is a first arm. And a second arm, and a connecting portion for rotatably connecting the first arm and the second arm, and the wiring in the first arm has a transmitting side coil, and the first arm is provided. The wiring in the two arms has a receiving side coil, and the transmitting side coil and the receiving side coil are arranged so as to face each other in the connecting portion, and from the wiring in the first arm to the second arm. Provided is a film forming apparatus characterized in that electric power is transmitted to wiring by wireless power supply.

The present invention connects a vacuum chamber, an atmosphere box arranged in the vacuum chamber and on which a film forming source is mounted and movable, a wall of the vacuum chamber, and the atmosphere box, and from the outside of the vacuum chamber. In a film forming apparatus including a wiring accommodating portion for accommodating wiring for supplying power to the film forming source, the inside of the wiring accommodating portion is composed of an atmospheric pressure environment, and the wiring accommodating portion is the atmospheric box. The wiring in the wiring housing has a transmitting side coil, and the wiring in the atmosphere box has a receiving coil. The transmitting side coil and the receiving side coil are arranged so as to face each other in the connection portion, and power is transmitted from the wiring in the wiring accommodating portion to the wiring in the atmosphere box by wireless power supply. A film forming apparatus is provided.

The present invention connects a vacuum chamber, an atmosphere box arranged in the vacuum chamber and on which a film forming source is mounted and movable, a wall of the vacuum chamber, and the atmosphere box, and from the outside of the vacuum chamber. In a film forming apparatus including a wiring accommodating portion for accommodating wiring for supplying power to the film forming source, the inside of the wiring accommodating portion is composed of an atmospheric pressure environment, and the wiring accommodating portion is the vacuum chamber. The wall and the wiring accommodating portion are rotatably connected to each other, the wiring outside the vacuum chamber has a transmitting side coil, and the wiring inside the wiring accommodating portion has a receiving side coil. The transmitting side coil and the receiving side coil are arranged so as to face each other in the connecting portion, and power is transmitted from the wiring outside the vacuum chamber to the wiring in the wiring accommodating portion by wireless power supply. Provided is a film forming apparatus characterized by the above.

The present invention is a film forming method in which an atmospheric box on which a film forming source is mounted is moved with respect to a film forming object in a vacuum chamber to form a film on the film forming object, and the film is formed in the vacuum chamber. Is provided with a wiring accommodating portion for connecting the wall of the vacuum chamber and the atmospheric box and accommodating wiring for supplying electric power from the outside of the vacuum chamber to the film forming source, and inside the wiring accommodating portion. Consists of an atmospheric pressure environment, and the wiring accommodating portion includes a first arm, a second arm, and a connecting portion that rotatably connects the first arm and the second arm. The transmitting side coil formed in the wiring in the first arm and the receiving side coil formed in the wiring in the second arm are arranged to face each other in the connection portion, and the film forming object is formed. Provided is a film forming method characterized in that electric power is transmitted from the wiring in the first arm to the wiring in the second arm by wireless power feeding when the film is formed.

The present invention is a film forming method in which an atmospheric box on which a film forming source is mounted is moved with respect to a film forming object in a vacuum chamber to form a film on the film forming object, and the film is formed in the vacuum chamber. Is provided with a wiring accommodating portion for connecting the wall of the vacuum chamber and the atmospheric box and accommodating wiring for supplying power to the film forming source from the outside of the vacuum chamber, and inside the wiring accommodating portion. Consists of an atmospheric pressure environment, the wiring accommodating portion has a connecting portion for rotatably connecting the atmospheric box and the wiring accommodating portion, and a transmitting side coil formed in the wiring in the wiring accommodating portion. And the receiving side coil formed in the wiring in the atmosphere box are arranged so as to face each other in the connection portion, and when the film is formed on the film-forming object, the wiring in the wiring accommodating portion is used. Provided is a film forming method characterized in that power is transmitted to the wiring in the atmosphere box by wireless power supply.

The present invention is a film forming method in which an atmospheric box on which a film forming source is mounted is moved with respect to a film forming object in a vacuum chamber to form a film on the film forming object, and the film is formed in the vacuum chamber. Is provided with a wiring accommodating portion for connecting the wall of the vacuum chamber and the atmospheric box and accommodating wiring for supplying power to the film forming source from the outside of the vacuum chamber, and inside the wiring accommodating portion. Consists of an atmospheric pressure environment, the wiring accommodating portion has a connecting portion for rotatably connecting the wall of the vacuum chamber and the wiring accommodating portion, and is formed in wiring outside the vacuum chamber. The transmitting side coil and the receiving side coil formed in the wiring in the wiring accommodating portion are arranged so as to face each other in the connecting portion, and when the film is formed on the film forming object, the outside of the vacuum chamber is formed. Provided is a film forming method characterized in that power is transmitted from a wiring to a wiring in the wiring accommodating portion by wireless power supply.

The present invention also provides a method for manufacturing an electronic device, which comprises manufacturing an electronic device by the above-mentioned film forming method.

According to the present invention, a stable and well-reproducible film can be formed without hindering the movement of the film source. Further, the durability of the device can be improved.

FIG. 1 is a schematic cross-sectional view of a film forming apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of FIG. FIG. 3 is a schematic cross-sectional view showing an example of a rotating target unit. FIG. 4 is a schematic cross-sectional view showing a configuration example of the first connection portion. FIG. 5 is a circuit diagram schematically showing the electrical connection between the power supply and the target unit. FIG. 6 is a cross-sectional view showing an example of an electronic device manufactured by the film forming apparatus according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail. However, the following embodiments merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. Further, the hardware configuration and software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the apparatus in the following description are limited to those of the present invention unless otherwise specified. It is not the purpose.

<Structure of film forming equipment>
First, the basic configuration of the film forming apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS. 1 and 2. The film forming apparatus 1 according to the present embodiment includes various electronic devices such as semiconductor devices, magnetic devices, and electronic components, and a film forming object 2 (a laminate having a laminate formed on a substrate) in the manufacture of optical components and the like. Used to deposit and form a thin film on (including). More specifically, the film forming apparatus 1 is preferably used in the manufacture of electronic devices such as light emitting elements, photoelectric conversion elements, and touch panels. Above all, the film forming apparatus 1 according to the present embodiment is particularly preferably applicable to the production of an organic light emitting element such as an organic EL (Electroluminescence) element and an organic photoelectric conversion element such as an organic thin-film solar cell. The electronic device in the present invention also includes a display device (for example, an organic EL display device) and a lighting device (for example, an organic EL lighting device) equipped with a light emitting element, and a sensor (for example, an organic CMOS image sensor) equipped with a photoelectric conversion element. It is a device.

FIG. 6 schematically shows a general layer structure of an organic EL element. As shown in FIG. 6, the organic EL element generally has a configuration in which an anode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode are formed in this order on a substrate. is there. The film forming apparatus 1 according to the present embodiment is suitably used when forming a laminated film of a metal, a metal oxide, or the like used for an electron injection layer or an electrode (cathode or anode) on an organic film by sputtering. Be done. Further, the film formation is not limited to the organic film, and a layered film formation can be performed on various surfaces as long as it is a combination of materials that can be formed by sputtering such as a metal material and an oxide material.

As shown in FIG. 1, the film forming apparatus 1 has a vacuum chamber 10, and inside the vacuum chamber 10, a film forming object 2, a mask 7, and a film forming material toward the film forming object 2 are formed. A rotating target unit 3 (hereinafter, also simply referred to as “target unit 3”) as a film forming source for forming a film on the film forming object 2 by flying sputtered particles is arranged. In the present embodiment, the film-forming object 2 is fixed, but it may be moved as appropriate.

A gas introduction means and an exhaust means (not shown) are connected to the vacuum chamber 10 so that the inside can be maintained at a predetermined pressure. That is, a sputter gas (an inert gas such as argon or a reactive gas such as oxygen or nitrogen) is introduced into the vacuum chamber 10 by a gas introducing means, and a vacuum pump is introduced from the inside of the vacuum chamber 10. The gas is exhausted by an exhaust means such as, and the pressure inside the vacuum chamber 10 is adjusted to a predetermined pressure.

As shown in FIG. 2, the target unit 3 includes a pair of target units 3A and 3B arranged in parallel at predetermined intervals in the moving direction. Both the first target unit 3A and the second target unit 3B are supported by a support block 210 and an end block 220 whose ends are fixed on the atmospheric box (moving table) 230. As shown in FIG. 3, the first target unit 3A has a cylindrical first target 4, a cathode 5 which is an electrode arranged on the inner circumference thereof, and a magnet unit 6 which is further arranged inside. Similarly, the second target unit 3B has a cylindrical second target 4, a cathode 5 which is an electrode arranged on the inner circumference thereof, and a magnet unit 6 which is further arranged inside. The first target 4 and the second target 4 may be made of different materials or may be made of the same material. The target 4 is rotatably supported by the support block 210 and the end block 220, and the magnet unit 6 is supported in a fixed state. Here, the target and the cathode are described as separate parts, but when the target material is a conductive material, it may be configured as an integrated single part.

Here, the magnet unit 6 of the first target unit 3A and the magnet unit 6 of the second target unit 3B are tilted in opposite directions. As a result, the target particles are scattered in different directions in the first target unit 3A and the second target unit 3B, so that the target particles from the first target unit 3A are scattered on the film formation surface of the film formation target 2. The scattering region and the scattering region of the target particles from the second target unit 3B can be prevented from overlapping. This configuration is advantageous, for example, when different target materials are used for the first target unit 3A and the second target unit 3B. However, a configuration in which the magnet units 6 and 6 are tilted in opposite directions is not essential. Only one magnet unit 6 may be tilted, or the magnet unit 6 may not be tilted. Although it is assumed here that the magnet unit 6 does not rotate, the present invention is not limited to this, and the magnet unit 6 may also rotate or swing. In this embodiment, a cylindrical target unit is used, but the present invention is not limited to this, and a plate-shaped target unit may be used.

The atmospheric box 230 is movably supported along a pair of guide rails 250 in a direction parallel to the film forming surface (here, the horizontal direction) of the film forming object 2 via a transport guide such as a linear bearing. In the figure, assuming that the direction parallel to the guide rail 250 is the X-axis, the direction perpendicular to the guide rail 250 is the Z-axis, and the direction orthogonal to the guide rail 250 in the horizontal plane is the Y-axis, the target unit 3 has its rotation axis parallel to the Y-axis direction. In this state, while rotating around the rotation axis, the film moves in parallel with the film-forming object 2, that is, in the X-axis direction on the XY plane. In this embodiment, the target unit 3 moves in the horizontal direction, but the target unit 3 may move in the vertical direction. In this case, the film-forming object 2 is supported in an upright state, and the target unit 3 moves in a direction parallel to the film-forming surface of the film-forming object 2. In addition, the inside of the atmosphere box 230 is in an atmospheric pressure environment, and the above-mentioned drive mechanism of the atmosphere box 230 itself, the rotation movement mechanism of the target, wiring, cooling water piping, gas piping, electronic circuits, sensors, etc. are used in the atmosphere. It can be installed inside the box 230.

The target 4 is rotationally driven by the drive mechanism 12. The drive mechanism 12 has, for example, a drive source such as a motor, and a general drive mechanism in which power is transmitted to the target 4 via the power transmission mechanism is applied. In the present embodiment, the drive mechanism 12 is arranged in the atmosphere box 230. To. On the other hand, the atmosphere box 230 is linearly driven in the X-axis direction by a drive mechanism connected to the transport guide. Although the transfer guide and the drive mechanism connected to the transfer guide are not particularly shown, various known screw feed mechanisms such as a screw feed mechanism using a ball screw or the like that converts the rotational motion of the rotary motor into a linear motion, a linear motor, and the like are known. A linear motion mechanism can be used.

In the vacuum chamber 10, a movable atmosphere box 230 on which the target unit 3 is mounted and an atmosphere arm 30 for connecting the bottom wall 10a of the vacuum chamber 10 and the atmosphere box 230 are provided. The atmosphere arm 30 is a wiring accommodating portion for accommodating the wiring L for supplying electric power from the outside of the vacuum chamber 10 into the atmosphere box 230. The wiring L may include a power wiring that supplies power to the target unit 3, a power wiring that supplies power to the motor of the drive device that drives the target, and the like. Further, control wiring for communication and control signals may be included.

The atmospheric arm 30 can rotate the first arm (first moving body) 31 and the second arm (second moving body) 32 having a hollow structure, and the bottom wall 10a and the first arm 31 of the vacuum chamber 10. The first connecting portion 21 to be connected, the second connecting portion 22 for rotatably connecting the first arm 31 and the second arm 32, the second arm 32, and the atmosphere box (third moving body) 230 are rotated. It has a third connecting portion 23 that is movably connected. That is, one end of the first arm 31 is rotatably connected to the bottom wall 10a of the vacuum chamber 10 via the first connecting portion 21, and the other end is rotatably connected to the bottom wall 10a of the vacuum chamber 10 via the second connecting portion 22. It is rotatably connected to one end of the 32. Further, the other end of the second arm 32 is rotatably connected to the atmosphere box 230 via the third connecting portion 23. The number of arms constituting the atmospheric arm 30 is not limited to two, and may be one or three or more.

The first connection portion 21, the second connection portion 22, and the third connection portion 23 extend parallel to the bottom wall 10a of the vacuum chamber 10 in the Z-axis direction, and the first arm 31 is the first connection portion 21. At a position separated from the bottom wall 10a by a predetermined distance, it extends in a direction orthogonal to the first connecting portion 21 and rotates in a plane parallel to the bottom wall 10a. The second arm 32 extends in a direction orthogonal to the second connecting portion 22, and rotates in a parallel plane further separated by a predetermined height with respect to the first arm 31. Further, the second arm 32 is separated from the atmosphere box 230 by a predetermined distance via the third connecting portion 23.

The first connection portion 21, the first arm 31, the second connection portion 22, the second arm 32, and the third connection portion 23 are hollow members, and the insides communicate with each other, and the first connection portion 21 is a vacuum chamber. It is open to 10 external spaces (for example, atmospheric pressure environment), and the third connection portion 23 communicates with the atmosphere box 230, and the communicated internal space is maintained in a pressure environment substantially the same as the external space. In the present embodiment, the inside of the atmosphere arm 30 and the atmosphere box 230 is air, but it may be an inert gas atmosphere such as nitrogen or an environment of dry air. The pressure is preferably an atmospheric pressure environment that does not require control, but the pressure may be higher than the inside of the vacuum chamber 10 and may be an environment of arbitrary negative pressure or positive pressure.

The first connection portion 21, the second connection portion 22, and the third connection portion 23 are portions that constitute a rotary joint, for example, a cylindrical first joint portion and a cylinder that fits inside the first joint portion. The second joint portion of the shape is rotatably assembled to each other via a bearing and sealed by a sealing member. As the seal member, a vacuum seal, for example, a magnetic fluid seal is used so as not to leak to the surrounding vacuum. FIG. 4 schematically shows a configuration example of the first connection portion 21 between the first arm 31 and the bottom wall 10a of the vacuum chamber 10 (wiring L is not shown). In the example of FIG. 4, the cylindrical first joint portion 21a is fitted so as to be movable in the Z direction with respect to the opening of the bottom wall 10a of the vacuum chamber 10, and the gap between the first joint portion 21a and the opening is the first. 1 Sealed by a sealing member S1 (for example, an O-ring). Further, the cylindrical second joint portion 21b formed on the first arm 31 is rotatably fitted inside the first joint portion 21a, and is between the first joint portion 21a and the second joint portion 21b. The gap is sealed by the second sealing member S2 (for example, a magnetic fluid seal).

<Wiring configuration>
Next, the configuration of the wiring L, which is one of the features of the film forming apparatus 1 of the present embodiment, will be described with reference to FIGS. 1 and 5.

The wiring L is arranged inside the first wiring L1 drawn out from the opening of the bottom wall 10a of the vacuum chamber 10, the second wiring L2 arranged inside the first arm 31, and the second arm 32. It is composed of a third wiring L3 and a fourth wiring L4 arranged inside the atmosphere box 230. The first wiring L1, the second wiring L2, the third wiring L3, and the fourth wiring L4 are independent wirings that are not physically connected. The wiring may be a flexible cable or a rigid rod-shaped metal material.

The first wiring L1 has a first transmitting side coil TC1 fixed inside or near the first connecting portion 21, and two lines extending from both ends of the first transmitting side coil TC1 are connected to the power supply 8. ing. The second wiring L2 includes a second receiving coil RC2 fixed inside or near the first connecting portion 21, and a second transmitting coil TC2 fixed inside or near the second connecting portion 22. It is composed of two lines connecting the second receiving side coil RC2 and the second transmitting side coil TC2. The third wiring L3 includes a third receiving coil RC3 fixed inside or near the second connecting portion 22, a third transmitting coil TC3 fixed inside or near the third connecting portion 23, and the like. It is composed of two lines connecting the third receiving side coil RC3 and the third transmitting side coil TC3. The fourth wiring L4 has a fourth receiving coil RC4 fixed inside or near the third connecting portion 23, and two lines extending from both ends of the fourth receiving coil RC4 are cathodes of the target unit 3. It is electrically connected to 5.

The first transmitting side coil TC1 of the first wiring L1 and the second receiving side coil RC2 of the second wiring L2 are arranged close to each other in a non-contact state inside the first connecting portion 21. When a voltage is applied from the power supply 8 to the first wiring L1 and a current flows through the first transmitting side coil TC1, a current flows through the second receiving side coil RC2 due to electromagnetic induction or magnetic field resonance. By such a wireless power feeding method, electric power is transmitted from the first wiring L1 outside the vacuum chamber 10 to the second wiring L2 in the first arm 31. In the present invention, wireless power feeding means transmitting electric power between physically non-contact objects (wiring) by using a method of electromagnetic induction or magnetic field resonance.

Similarly, the second transmitting side coil TC2 of the second wiring L2 and the third receiving side coil RC3 of the third wiring L3 are arranged close to each other in a non-contact state inside the second connecting portion 22. ing. When a current flows through the second transmitting side coil TC2 due to the induced electromotive force generated in the second receiving side coil RC2, a current flows through the third receiving side coil RC3 by electromagnetic induction. By such wireless power supply, power transmission from the second wiring L2 in the first arm 31 to the third wiring L3 in the second arm 32 is realized.

Similarly, the third transmitting side coil TC3 of the third wiring L3 and the fourth receiving side coil RC4 of the fourth wiring L4 are arranged to face each other with a slight gap inside the third connecting portion 23. .. When a current flows through the third transmitting side coil TC3 due to the induced electromotive force generated in the third receiving side coil RC3, a current flows through the fourth receiving side coil RC4 by electromagnetic induction. By such wireless power supply, power transmission from the third wiring L3 in the second arm 32 to the fourth wiring L4 in the atmosphere box 230 is realized.

That is, the output of the power supply 8 is sequentially transmitted to the first wiring L1, the second wiring L2, the third wiring L3, and the fourth wiring L4 by using the wireless power supply, and is supplied to the cathode 5 of the target unit 3. To. As the coil, a solenoid coil, a spiral coil, a laminated coil, a single layer coil, a horseshoe-shaped coil, or the like can be used. The coil may be an air-core coil or a coil with a magnetic core. The central axis of the coil is preferably arranged so as to coincide with the central axis of the joint at the connection portion. With such an arrangement, the position shift between the two coils is less likely to occur due to the rotation of the arm, so that stable power transmission is possible even when the atmospheric box is being moved.

Here, as the power supply 8, an AC power supply, a bipolar power supply, or a pulse DC power supply can be used. In particular, it is preferable to use a bipolar power supply capable of arbitrarily controlling the shape of the pulse voltage waveform, the duty ratio, the boost rate, and the like. At this time, it is preferable to use a frequency of 1 kHz or more and 100 kHz or less as the pulse repetition frequency. By using such a frequency, abnormal discharge is small, stable sputtering discharge is possible, and relatively high transmission efficiency can be realized in the wireless transmission unit. Along with this, it becomes possible to form a relatively high-quality thin film with low power consumption. As described above, in the power supply using the wireless power supply of the present invention, it is possible to realize both plasma stability and high power transmission efficiency by selecting an appropriate frequency band.

As shown in FIG. 5, one of the two lines extending from both ends of the fourth receiving coil RC4 is electrically connected to the first target unit 3A, and the other line is connected to the second target unit 3B. It is a preferable configuration to adopt a wiring structure that connects electrically. In FIG. 5, the plasma 51 is represented by a resistance component and a capacitance component. By using such an electrical connection, it is possible to supply stable power and maintain discharge. According to such a configuration, the target unit (cathode) used for film formation can be switched at high speed and used by controlling the voltage waveform output from the bipolar power source 8 by the control means (not shown) (not shown). The target unit on the side to which the negative voltage is applied is used for sputtering). At this time, when one target unit functions as a cathode, the other target unit can function as an anode. In such an apparatus configuration, since the anode having a wide area can be arranged in the vicinity of the cathode, stable plasma can be formed, and stable film formation can be performed over a long period of time. Furthermore, since the influence on the target surface (material adhesion, unevenness formation, etc.) that occurs when functioning as a cathode is removed (relaxed) when functioning as an anode, it is possible to maintain a stable target surface. Is thought to be. Further, according to the wiring structure as described above, the wiring for the two target units 3A and 3B can be configured by only two lines connected to both ends of the coil, so that the number of wirings is as large as possible. There is also an advantage that the wiring can be arranged in a compact space. From the viewpoint of stability of sputtering film formation, high power transmission efficiency, and convenience of electrical connection, it is preferable to apply it to a sputtering apparatus having two cathodes as shown in FIG. is there. As appropriate for the electrical connection in FIG.
Resistor and capacitance components may be added in series or in parallel. By adding a resistance component or a capacitance component to the wirings L1 to L4, the transmission efficiency in the wireless transmission unit may be improved. The resistor or capacitance may be used as a variable resistor or variable capacitor, adjusted so as to increase the transmission efficiency.

<Film formation method>
When a voltage waveform is applied to the cathode 5 of the target unit 3 while the atmosphere box 230 is moved at a predetermined speed by a control means (not shown) while the inside of the vacuum chamber is in a predetermined gas atmosphere state, plasma is generated and sputtering is performed. The target material scatters. When the material passes through the mask 7 and reaches the film-forming object 2, a film containing the target material is formed on the surface of the film-forming object 2. By moving (scanning) the cathode 5 in the X direction, it is possible to form a film over a wide area in the X direction. If necessary, the cathode 5 can be scanned a plurality of times or reciprocally scanned.

When the atmosphere box 230 moves, the first arm 31 and the second arm 32 rotate at the first connection portion 21, the second connection portion 22, and the third connection portion 23, following the movement of the atmosphere box 230. In the film forming apparatus 1 of the present embodiment, since the wiring is not physically connected in the first connection portion 21, the second connection portion 22, and the third connection portion 23, the wiring is twisted or deformed as in the conventional case. Does not occur. Therefore, the movement of the atmospheric box 230 and the atmospheric arm 30 is not hindered by the wiring, and the target unit 3 which is the film forming source can be smoothly moved at a desired speed, so that the film formation is stable and reproducible. Can be done. Further, since the wiring is hardly deteriorated, the durability of the device can be improved.

<Modification example>
The above-described embodiment is merely an example of the configuration of the present invention. The present invention is not limited to the configuration of the above embodiment, and various configurations may be adopted within the scope of the technical idea.

For example, in the above embodiment, the wireless power supply structure is provided in all three connection portions of the first connection portion 21, the second connection portion 22, and the third connection portion 23, but the wireless power supply structure is a part of the connection portions. It may be provided only in. That is, the wireless power supply structure may be provided at only one place, or the wireless power supply structure may be provided at two places. In other parts, wiring may be passed through the connection portion as in the conventional case. For example, in a configuration in which only the second connection portion 22 has a wireless power supply structure and the first and third connection portions have the same wiring routing as before, the wiring is evenly divided to make the wiring length uniform. It can be said that it is an effective method from the viewpoint that it can be shortened and that the wiring does not need to pass through a plurality of connecting portions 22 continuously. Further, in the above embodiment, the atmospheric arm 30 is composed of two arms 31 and 32, but the number of arms may be one or three or more. In this case, the number of connection portions varies depending on the number of arms, but as described above, a wireless power supply structure may be provided for all the connection portions, or a wireless power supply structure may be provided for only some of the connection portions. May be good. In short, at least one wireless power supply structure may be provided in the wiring for supplying electric power from the external power source 8 of the vacuum chamber 10 to the atmospheric box 230. It is preferable that the wireless power feeding structure is preferentially provided for the connection portion having a large bending angle and bending frequency.

In the above embodiment, as an example of the film forming apparatus, a sputtering apparatus using a sputtering target as a film forming source has been described, but the scope of application of the present invention is not limited to the sputtering apparatus. For example, the present invention can be preferably applied to the wiring structure of the film forming source (evaporation source) in the vacuum vapor deposition apparatus for depositing the film forming material. In the wireless power supply structure of the above embodiment, in addition to supplying electric power to the film forming source, electric power is supplied to a drive mechanism such as an atmospheric box drive mechanism and a cathode rotation drive mechanism, and electronic circuits and sensors in the atmospheric box and the like. It may be used for power supply or signal transmission to the parts of the above.

1: Film formation device 2: Film formation object 3: Target unit 10: Vacuum chamber 10a: Bottom wall of vacuum chamber 21, 22, 23: Connection part 30: Atmospheric arm 31: First arm 32: Second arm 230: Atmospheric box L, L1, L2, L3, L4: Wiring TC1, TC2, TC3: Transmission side coil RC2, RC3, RC4: Reception side coil

Claims (13)

With a vacuum chamber
An atmospheric box located in the vacuum chamber, equipped with a film source and movable,
In a film forming apparatus including a wiring accommodating portion for connecting the wall of the vacuum chamber and the atmospheric box and accommodating wiring for supplying electric power to the film forming source from the outside of the vacuum chamber.
The inside of the wiring accommodating part is composed of an atmospheric pressure environment.
The wiring accommodating portion includes a first arm, a second arm, and a connecting portion that rotatably connects the first arm and the second arm.
The wiring in the first arm has a transmitting side coil and has a transmitting side coil.
The wiring in the second arm has a receiving coil and has a receiving coil.
The transmitting side coil and the receiving side coil are arranged so as to face each other in the connecting portion.
A film forming apparatus characterized in that electric power is transmitted from the wiring in the first arm to the wiring in the second arm by wireless power supply. With a vacuum chamber
An atmospheric box located in the vacuum chamber, equipped with a film source and movable,
In a film forming apparatus including a wiring accommodating portion for connecting the wall of the vacuum chamber and the atmospheric box and accommodating wiring for supplying electric power to the film forming source from the outside of the vacuum chamber.
The inside of the wiring accommodating part is composed of an atmospheric pressure environment.
The wiring accommodating portion has a connecting portion that rotatably connects the atmospheric box and the wiring accommodating portion.
The wiring in the wiring accommodating portion has a transmitting side coil and has a transmitting side coil.
The wiring in the atmosphere box has a receiving coil and
The transmitting side coil and the receiving side coil are arranged so as to face each other in the connecting portion.
A film forming apparatus characterized in that electric power is transmitted from the wiring in the wiring accommodating portion to the wiring in the atmospheric box by wireless power supply. With a vacuum chamber
An atmospheric box located in the vacuum chamber, equipped with a film source and movable,
In a film forming apparatus including a wiring accommodating portion for connecting the wall of the vacuum chamber and the atmospheric box and accommodating wiring for supplying electric power to the film forming source from the outside of the vacuum chamber.
The inside of the wiring accommodating part is composed of an atmospheric pressure environment.
The wiring accommodating portion has a connecting portion that rotatably connects the wall of the vacuum chamber and the wiring accommodating portion.
The wiring outside the vacuum chamber has a transmitting coil.
The wiring in the wiring accommodating portion has a receiving coil and has a receiving side coil.
The transmitting side coil and the receiving side coil are arranged so as to face each other in the connecting portion.
A film forming apparatus characterized in that electric power is transmitted from a wiring outside the vacuum chamber to a wiring inside the wiring accommodating portion by wireless power supply. The film forming apparatus according to any one of claims 1 to 3, wherein the film forming source is a sputtering target. The film forming source includes a first target unit having a first target and a second target unit having a second target.
The wiring electrically connected to one end of the receiving coil is electrically connected to the first target unit.
The film forming apparatus according to claim 4, wherein the wiring electrically connected to the other end of the receiving coil is electrically connected to the second target unit. It is characterized by having a bipolar power supply capable of applying a voltage of opposite polarity to a wiring electrically connected to one end of the transmitting coil and a wiring electrically connected to the other end of the transmitting coil. The film forming apparatus according to claim 5. The film forming apparatus according to claim 5 or 6, wherein the first target unit and the second target unit are rotationally driven cylindrical members. The film forming apparatus according to claim 7, wherein the first target unit and the second target unit are arranged in parallel. The film forming apparatus according to any one of claims 1 to 3, wherein the film forming source is an evaporation source for depositing a film forming material. A film forming method in which an atmospheric box equipped with a film forming source is moved with respect to a film forming object in a vacuum chamber to form a film on the film forming object.
In the vacuum chamber, a wiring accommodating portion for connecting the wall of the vacuum chamber and the air box and accommodating wiring for supplying electric power from the outside of the vacuum chamber to the film forming source is provided.
The inside of the wiring accommodating part is composed of an atmospheric pressure environment.
The wiring accommodating portion includes a first arm, a second arm, and a connecting portion that rotatably connects the first arm and the second arm.
The transmitting side coil formed in the wiring in the first arm and the receiving side coil formed in the wiring in the second arm are arranged so as to face each other in the connecting portion.
A film forming method characterized in that when a film is formed on an object to be formed of a film, electric power is transmitted from the wiring in the first arm to the wiring in the second arm by wireless power supply. A film forming method in which an atmospheric box equipped with a film forming source is moved with respect to a film forming object in a vacuum chamber to form a film on the film forming object.
In the vacuum chamber, a wiring accommodating portion for connecting the wall of the vacuum chamber and the air box and accommodating wiring for supplying electric power from the outside of the vacuum chamber to the film forming source is provided.
The inside of the wiring accommodating part is composed of an atmospheric pressure environment.
The wiring accommodating portion has a connecting portion that rotatably connects the atmospheric box and the wiring accommodating portion.
The transmitting side coil formed in the wiring in the wiring accommodating portion and the receiving side coil formed in the wiring in the atmospheric box are arranged so as to face each other in the connecting portion.
A film-forming method characterized in that, when a film is formed on the film-forming object, electric power is transmitted from the wiring in the wiring accommodating portion to the wiring in the atmospheric box by wireless power supply. A film forming method in which an atmospheric box equipped with a film forming source is moved with respect to a film forming object in a vacuum chamber to form a film on the film forming object.
In the vacuum chamber, a wiring accommodating portion for connecting the wall of the vacuum chamber and the air box and accommodating wiring for supplying electric power from the outside of the vacuum chamber to the film forming source is provided.
The inside of the wiring accommodating part is composed of an atmospheric pressure environment.
The wiring accommodating portion has a connecting portion that rotatably connects the wall of the vacuum chamber and the wiring accommodating portion.
The transmitting side coil formed in the wiring outside the vacuum chamber and the receiving side coil formed in the wiring in the wiring accommodating portion are arranged so as to face each other in the connecting portion.
A film forming method characterized in that when a film is formed on an object to be formed of a film, electric power is transmitted from an external wiring of the vacuum chamber to a wiring in the wiring accommodating portion by wireless power supply. A method for manufacturing an electronic device, which comprises manufacturing an electronic device by the film forming method according to any one of claims 10 to 12.

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