1377259 九、發明說明 【發明所屬之技術領域】 本發明是關於一種真空蒸鍍用對準裝置。 【先前技術】 習知，擬製造半導體基板等之際，在真空容器內半導 體材料被蒸發，同時蒸鍍於基板表面而形成有所定的導體 圖案。 通常，擬形成該導體圖案時，將形成有導體圖案的罩 幕配置於基板表面，而藉由曝光被塗佈於該表面的光阻劑 所進行（例如，參照日本特開平5- 1 59997號公報）。 【發明內容】 然而，在真空容器內，對於罩幕須將基板配置於所定 位置，而設有供該對位用的對準裝置。 該對準裝置是成爲配置於真空容器內，惟擬將高對位 精度的對準裝置配置於真空容器內時，必須使用由氣體放 出較少的特種材料所成的零件及潤滑劑，而且也必須作成 政熱對策等，因此裝置本身成爲極高成本者。 另一方面，爲了避免此種事態，考量將對準裝置配置 於真空容器的外部。 擬將對準裝置配置於真空容器的外部時，變成需要有 對準裝置的基板保持構件對於真空容器內的插入部分的真 空維持機構’因此必須要有特殊密閉機構、或加工，使得 -5- 1377259 裝置仍成爲高成本者^ 又’在基板保持構件對於真空容器內的插入部分，藉 由真空力’換言之，接受由大氣壓產生的較大外力，有產 生應變而降低對位精度之虞》 如此，爲了解決上述課題，本發明的目的是在於提供 一種裝置本體的製造成本低且可維持高精度對位的真空蒸 鍍用對準裝置。 爲了解決上述課題，本發明的一種真空蒸鍍用對準裝 置，屬於對於使用於將蒸鏟材料以所定圖案進行被保持在 真空容器內的基板表面之際的罩幕進行該基板的對位的對 準裝置，其特徵爲具備：在被保持於上述真空容器內的罩 幕上方，經由插通形成於該真空容器的壁體的貫通穴的吊 持構件所保持的基板保持具；設於上述真空容器的外方， 而且被連結的上述吊持構件的連結用板；移動該連結用板 而可調整被保持在基板保持具的蒸鍍室內的基板對於罩幕 的位置的位置調整裝置；外嵌於上述吊持構件，而且設在 壁體的貫通穴的外周與上述連結用板之間而進行遮斷真空 側與大氣側的伸縮式筒狀遮斷構件；及與藉由上述筒狀遮 斷構件內側成爲真空狀態所發生的對於連結用板的推壓力 發生反方向的彈推力的彈推裝置。 又，上述位置調整裝置是構成經由吊持構件及基板保 持具被保持於連結用板的基板與罩幕表面可平行地移動。 又，在上述位置調整裝置，具備在與基板表面正交的 軸心方向可移動連結用板的功能。 -6- 1377259 又，上述彈推裝置的彈推力構成可調整。 依照上述的構成，在所定真空下進行對於罩幕的基板 的對位之際，於真空容器的外部配置有基板的位置調整裝 置之故，因而不必需要考慮真空下的材料等，而且也不需 要特殊密閉機構，因此，使得裝置本體的製造成本》 又，具備可賦予在真空下可對抗於由大氣壓產生的推 壓力的彈推力的彈推裝置之故，因而可防止多餘外力作用 於位置調整裝置，因此可將對於罩幕的基板的對位維持在 闻精度。 【實施方式】 針對於本發明的實施形態的真空蒸鑛用對準裝置加以 說明。 該真空蒸鍍用對準裝置，是設於用以製造如有機EL 顯示器的顯示部的真空蒸鍍裝置者，使用罩幕而將有機材 φ 料（爲蒸鍍材料）以所定圖案蒸鍍於玻璃基板之表面而得 到導體圖案之際，用以保持罩幕，同時進行對於玻璃基板 的該罩幕的對位者。 實施形態1 以下，依據第1圖至第6圖說明實施形態1的真空蒸 - 鍍用對準裝置。 如第1圖所示地，該對準裝置1，是經由安裝用板（ 爲壁體的一例）設置於在真空下具有用以蒸鍍有機材料於 1377259 玻璃基板的表面的蒸鍍室2的真空容器3的上壁3a。又 ，未經由安裝用板’直接安裝於設在所有真空容器上面整 體的上壁也可以。 在上述真空容器3的蒸鍍室2下部配置有蒸發源4, 而且在真空容器3的蒸鍍室2內的上方位置，經由對準裝 置1保持者玻璃基板（以下稱爲基板）5，又，在該基板5 的下方，形成所定導體圖案所用的罩幕6經由其安裝框7 而利用罩幕保持具8被保持著。又，在真空容器3的側壁 3b，設有基板5及罩幕6的搬入出用開口 9，而針對於基 板5及罩幕6的搬入及搬出，使用機器手（未圖示）。 如第2圖至第4圖所示地，在上述對準裝置1，具備 :將可吸附基板5的片狀靜電吸盤lib設於板狀保持具本 體11a所成的如平面視呈矩形狀的基板保持具11;及在 該基板保持具11的左右兩部位連結有下端部，而且上端 部插通形成於安裝用板la的貫通穴lb而朝真空容器3外 部突出的兩支圓筒狀吊持構件12;及設於真空容器3外 部而在上述兩支吊持構件12的上端部且其上端開口部朝 上面開口般地貫通而被連結的如平面視呈矩形狀的連結用 板13;及配置於上述安裝用板la上面而可使連結用板13 移動來調整被保持在基板保持具Π的蒸鍍室2內的基板 5對於罩幕6的位置調整裝置14;及外嵌於上述各吊持構 件12，而且設於安裝用板la的貫通穴lb的外周與上述 連結用板1 3之間，遮斷真空側與大氣側的伸縮式筒狀遮 斷構件（例如使用真空伸縮管）15 ;及發生（賦予）與因該筒 -8 - 1377259 狀遮斷構件1 5的內側成爲真空狀態所發生的對於連結用 板13的推壓力（壓住力）爲反方向的彈推力的彈推裝置16 。又，上述筒狀遮斷構件15與安裝用板la側及連結用板 側，是分別經由所定內徑的下環狀安裝座17及上環狀 安裝座18而相連結，以筒狀遮斷構件15對於設在連結用 板13側的上環狀安裝座18的安裝部開口面積（接觸面積） 作用因真空所產生的力（因大氣壓產生的推壓力）。 φ 上述位置調整位置14是由：可使連結用板13在與罩 . 幕6的表面平行的平面內進行平行移動、旋轉（以板的中 心作爲旋轉中心的旋轉）、及迴旋（以與板的中心不同的位 置作爲中心的旋轉）的平面內移動裝置21;及可以與罩幕 6 (或是連結用板）正交的垂直方向（軸心方向）移動的垂直移 動裝置22所構成。 如第4圖及第5圖所示地，上述平面內移動裝置21 是由：平面視呈矩形狀的支持板31;及在該支持板31上 φ 的四角隅中，配置於三部位的驅動用支持機構32及配置 於剩下的一部位的引導用支持機構33;及經由設於此些 各支持機構32、33的連結具34所支持的移動板35所構 成，又，該移動板35與連結用板13是構成爲容許經由昇 降用引導機構36在垂直方向的移動，而且連動（追隨）在 水平面內的移動。 . 如第5圖所示地，上述驅動用支持機構32是公知技 • 術，可在水平面內，亦即在X-Y軸方向經由線性引導機 構37進行移動，而且可藉由伺服馬達38沿著一方的軸方 -9- 1377259 向（X軸或Y軸方向）進行強制移動，又，引導用支持機構 33是可作成經由與上述同樣的線性引導機構39在X-Y軸 方向自由地移動者。 又，三個驅動用支持機構32中，對於兩個是配置成 可以同一方向強制移動，而且對於剩下的一個，可配置成 在與上述兩個強制移動方向正交的方向強制移動，此些三 個之中，藉由驅動所定（一個、兩個或三個）的驅動用支持 機構32的伺服馬達38，可以X軸方向[參照第5(b)圖]、 Y軸方向[參照第5(c)圖] '對於X軸及Y軸呈傾斜方向[ 參照第5(d)圖]、以及以移動板35的中心作爲旋轉軸的旋 轉方向[參照第5(e)圖]、或是以任意的支持機構32側作 爲中心進行迴旋的迴旋方向[參照第5(f)圖]，使移動板35 在水平面內以任意方向及任意旋轉角或迴旋角移動者。 如第3圖及第4圖所示地，上述昇降用引導機構36 是由：一體地設於移動板35上面的平面視呈矩形狀的安 裝用板41;及豎設在該安裝用板41的前後且左右位置的 四支導軸42;及設於連結用板13側而外嵌於此些各導軸 42並被移動自如地引導在上下方向的四個導筒43所構成 。又’在圖式上，僅表示前部或後部的左右導軸42及導 筒43 〇 又’作爲鉛直移動裝置22，使用電動缸（藉由伺服馬 達所驅動者），該電動缸的進退用桿22a被連結於上述安 裝用板41，而藉由使該進退用桿22a作進退，經由連結 用板13使得基板保持具η進行昇降，俾調整基板5對於 -10- 1377259 罩幕6的間隔。 上述彈推裝置16是用以抵銷（或是減輕）經由貫通穴 lb連通於蒸鍍室2而作用於成爲真空狀態的筒狀遮斷構 件15內的端面側的大氣壓所引起的推壓力者。 亦即，該彈推裝置16是由：跨越連結用板13般地豎 設於安裝用板la上的側面視呈門形狀的安裝用框51;設 在上述連結用板13的左右位置所設置的台座52上面的所 定內徑的下環狀安裝座53與設於上述安裝用框51的水平 部51a下面的所定內徑的上環狀安裝座54;及遍及此些 上下環狀安裝座53、54彼此間所連接的伸縮式筒狀遮斷 構件（如使用真空用伸縮管）55所構成。此些左右的各筒狀 遮斷構件55內，是經由形成於安裝用框51內的連通用穴 56而被連通於真空容器3內，因此，該連通用穴56的基 端側是經由形成於安裝用板la的連通穴lc而被連通於真 空容器3內，而且另一端是在對應於設於安裝用框51的 水平部51a的上環狀安裝座54的位置形成開口。 又，至少設於連結用板13的上面（實際上爲台座52 的上面）的下環狀安裝座53、與設於其下面的上環狀安裝 座1 8的開口面積彼此間成爲相等。亦即，在連結用板1 3 的上下面，成爲設有同一面積的真空接觸部，而起因於真 空所發生的推壓力從連結用板13的上下面均等地作用’ 因此可防止多餘外力作用於連結用板13。 又，如第4圖所示地，使用筒狀者作爲上述吊持構件 12，而且在基板保持具11設有連接於兩吊持構件12內的 -11 - 1377259 連通用穴12a的通路（爲穴部）lie，藉由從吊持構件 上端開口供給水等冷卻流體，可冷卻基板5，又，從 連通用穴12a的上端進行對於靜電吸盤lib的電性配 又，如第1圖及第3圖所示地，爲了對於被保持 幕保持具8的罩幕6進行基板5的對位，而即如第6 示地，以設在基板5側的點狀基板側標誌M2進入至 罩幕6的對角線上的角隅部的圓形罩幕側標誌Ml內 進行對位所用的CCD攝影機裝置57設於連結用板1 ，當然，在安裝用板1 a側，設有視窗5 8。又，各標 狀若爲畫像認識爲容易者，則十字形狀等任何者都可 在上述構成，說明針對於在真空容器3內對於罩 的基板5的對位作業。 首先，如第1圖所示地，由形成於真空容器3的 3b的搬入出用開口 9,使用機器手，將基板5插入於 罩幕保持具8所保持的罩幕6上方，而且以靜電吸盤 保持基板5之後，從真空容器3伸出機器手等，之後 搬入出用開口 9。 在該真空下，如上所述地，在連結用板1 3的上 ，藉由筒狀遮斷構件15、55(正確爲環狀安裝座18 ，設有同一面積的真空接觸部，因此，在該連結用枝 ，不會作用因真空所產生的多餘的外力》 之後，對於藉由罩幕保持具8被保持於蒸鍍室2 罩幕6，進行藉由上述基板保持具11所保持的基板 對位。 12的 此些 線。 於罩 圖所 設於 般地 丨3側 誌形 以。 幕6 側壁 利用 lib 關閉 下面 ，53) I 13 內的 5的 -12- 1377259 在對於該罩幕6的基板5的對位，使用配置於對角線 上的兩台CCD攝影機裝置57。 亦即，如第6圖所示地，以設於基板5側的點狀的基 板側標誌M2進入至設於罩幕6側的圓形罩幕側標誌Μ 1 內般地，驅動位置調整裝置14的平面內移動裝置21之後 ，藉由垂直移動裝置22，以幾乎接觸罩幕6表面般地移 動基板5。 當完成對於罩幕6的基板5的對位，則藉由蒸發源4 的加熱，有機材料（蒸鍍材料）因應於罩幕6的圖案，附著 於基板5的表面而形成有所定的導體圖案。 當形成有所定導體圖案，則藉由機器手從搬入出用開 口 9取出基板5之後，將新基板5插入在真空容器3內而 被保持在基板保持具11，又，如上所述地，進行對位而 形成導體圖案就可以。 如此地，在特定的真空下，進行對於罩幕6的基板5 的對位之際，在真空容器3外部配置基板5的位置調整裝 置14之故，因而可將裝置本體的構成作成低成本者》 又，在形成將該對準裝置1的基板5的吊持構件12 引導至真空容器3外部所用的貫通穴lb之際，在將該貫 通穴1 b與大氣側遮斷所用的筒狀遮斷構件1 5對於連結用 板體13安裝部分的相反側，連接具有與該筒狀遮斷構件 15同一斷面積而且連通於真空容器3的真空下的筒狀遮 斷構件55(環狀安裝座18的開口面積），亦即具備在真空 下可頂抗因大氣壓所產生的推壓力的彈推裝置16，因此 -13- 1377259 可防止多餘的外力作用於對準裝置1的情形，故在裝置不 會發生應變，而可以高精度進行對於罩幕的基板的對位。 詳細說明，則可得如下的效果。 1. 將使基板5在水平面內移動的平面內移動裝置21 及在垂直方向移動的垂直移動裝置22配置於真空容器3 的外部（大氣壓下），不需要特殊的真空用機械要素、或馬 達的冷卻裝置，因此可提供低成本且高精度的對準裝置。 2. 將各移動裝置21、22配置在真空容器3的外部（大 氣壓下），而且，具備可賦予頂抗於在真空下作用的推壓 力的彈推力的彈推裝置16，因此可減輕作用於因真空所 產生的各移動裝置21、22的力量，因此，作爲移動裝置 的馬達等驅動機器，可使用小容量者，故可得到更低成本 的構成。 3. 又，將各移動裝置21、22配置於真空容器3的外 部（大氣壓下），而且具備可賦予頂抗於在真空下作用的推 壓力的彈推力的彈推裝置16，因此可抑制在裝置本體發 生應變的情形，而且可防止基板5的對位用攝影機裝置 57的視野偏差，因此可進行高精度的對位。 4. 由於藉由靜電吸盤lib來保持基板5，因此可維持 基板5的平面度，因此，可使與罩幕6的距離極小，而可 進行高精度的對位。 5. 又，由於藉由靜電吸盤lib來保持基板5，成爲可 維持基板的平面度而將基板5以均等的面壓接觸於罩幕6 ，因此，可進行更高精度的對位。 -14- 1377259 6·在支持基板保持具11的吊持構件12及保持具本體 11a內形成連通用穴12a及通路lie而且藉由將此些連通 用穴12a及通路lie內形成爲大氣壓下，不會妨礙到對準 而可容易地進行基板保持具11的冷卻，而且針對於對於 靜電吸盤lib的電性配線也可容易地進行。又，若欲使用 真空用軟管等來供給冷卻流體時，則須以金屬製伸縮管等 來覆蓋軟管，因此，軟管側的剛性變高，而成爲需要數微 米左右精度的對準的妨礙主要原因。 實施形態2 以下，依照第7圖說明實施形態2的真空蒸鍍用對準 裝置。 在上述實施形態1中，作爲彈推裝置1 6，作爲利用 真空容器3內的真空（真空力）者加以說明，惟本實施形態 2中，係利用彈力者》 又，實施形態1與實施形態2不同處，是該彈推裝置 的部分，因此在本實施形態2中，著重於該部分加以說明 ’而且針對於其他構成構件，與實施形態1賦予同一號碼 而加以進行說明者（下述的實施形態3也作成同樣）。 亦即，如第7圖所示地，在設於連結用板13左右的 台座52與安裝用框51之間，作爲可發揮與因真空所產生 的推壓力同等的抗拉力的彈推裝置，設有如螺旋彈簧61 者。 依該彈推裝置的螺旋彈簧61，則與將真空用連通用 -15- 1377259 穴56形成於安裝用框51內的情形相比較’其構成變成簡 單，因此可提供一種更低成本的對準裝置。 又，如第8圖所示地，代替螺旋彈簧，使用空氣彈簧 71的情形，也可得到與上述實施形態2同樣的效果。 又，如第9圖所示地，代替螺旋彈簧，也可使用配重 8 1 〇 亦即，一端部被連接於配重81的索體（例如金屬線、 繩索等）82的另一端部，經由配置於安裝用框51的水平 部51a的複數個（例如兩個）的引導用滑車83被連結於設 於連結用板13的各端部側的台座52者。 當然，上述配重81的合計重量，是作成可頂抗於因 真空所產生的推壓力。 對於該構成，也可得到與上述實施形態2的同樣效果 實施形態3 以下’依據第10圖說明實施形態3的真空蒸鍍用對 準裝置。 在上述實施形態1中，係利用真空容器3內的真空（ 真空力）者來作爲彈推裝置16而進行說明，惟在本實施形 態3中，使用空氣壓缸者β 亦即，如第10圖所示地，在設於連結用板13左右的 台座52與安裝用框51之間配置有空氣壓缸91，又，作 爲空氣壓缸91，例如使用一方桿式者，而且在該桿側缸 -16- 1377259 室92的空氣供給口 93，經由於中途具有j| 的空氣配管95而連接有空氣供給泵96者。 因此’在將蒸鍍室2內作成真空下之際 給泵96作動，而在空氣壓缸91，發生可頂 生的推壓力的抗拉力就可以。 這時候，得到與實施形態1同樣的效果 整供給於空氣壓缸91的空氣壓，可調整可 的抗拉力的大小。 又’在本實施形態3中，在將連結用板 推時，藉由配置於該連結用板13上方的空窝 行，惟如第Π圖所示地，構成在連結用板 la之間配置空氣壓缸91，而從下方朝上方 1 3也可以。 依照該構成，成爲不需要安裝用框及台 置的精緻小型化、輕量化及製作成本的減低 又，作爲實施形態3的變形例，在表示 對準裝置中，在將基板保持在基板保持具時 吸盤，惟如第12圖所示地，以具有爪101 102來保持基扳5也可以。當然，爪101是 周圍4處（設於在基板不會產生應變的位置 於6處或8處）般地設置複數個。 又，在罩幕保持具103側，將基板5載 之際，爪101不會接觸於罩幕保持具103般 部 1 03a。 藝力調整器94 ，則使空氣供 抗因真空所產 ，又，藉由調 頂抗於推壓力 ! 1 3朝上方彈 I壓缸91來進 13與安裝用板 彈推連結用板 座，可謀求裝 化。 於第1 1圖的 ，係使用靜電 的基板保持具 保持基板5的 ，視需要，設 置於罩幕6上 地，形成有凹 -17- 1377259 又，作爲表示於第12圖的位置調整裝置14的昇降用 引導機構，代替在實施形態1(第4圖）所說明的四支導軸 42及被此些各導軸42所引導的四個導筒43，採用線性導 軸111及外嵌於該線性導軸111的一側方並被引導的移動 構件112所成的線性引導機構。又，在罩幕保持具103的 支柱部l〇3b內，形成有水等冷卻流體等的通路103c。 藉由該構成，不必使用靜電吸盤，就可將基板5保持 在蒸鍍室2內。 又，對於表示於第10圖至第12圖的空氣壓缸91， 係配置在連結用板13的台座52與安裝用框51之間，或 配置於連結用板13與安裝用板la之間，但是由於連結用 板13側至少可朝水平方向移動，因而在空氣壓缸91的兩 端部介設可自由伸縮的接頭。又，在第11圖及第12圖中 ，將空氣壓缸91的下端的缸本體固定於安裝用板la側， 而且在上側的桿部前端配置轉動用球（滾珠軸承），作成僅 從下方支持連結用板13的構成也可以。 然而，以配置於三處的驅動用支持機構32、及配置 於一處的引導用支持機構33來構成上述各實施形態的平 面內移動裝置21’惟以驅動用支持機構32構成所有也可 以。 又’在上述的各實施形態中，說明作爲將有機EL材 料蒸鍍於玻璃基板的真空蒸鍍裝置中的對準裝置，惟當然 ’作爲真空蒸鍍的對象’並不被限定於該有機EL材料， 例如製造半導體裝置之際’若在真空容器內使用罩幕而在 "18- 1377259 基板上形成導體圖案所用的裝置，作成任何真空蒸鍍裝置 也可適用。 本發明是可對於配設於真空容器的罩幕，以低成本的 構成，進行被蒸鑛構件的玻璃基板的對位，因此最適於形 成如有機EL顯示器等的顯示部。 【圖式簡單說明】 第1圖是表示設有本發明的實施形態1的對準裝置的 真空蒸鍍裝置的槪略構成的斷面圖。 第2圖是表示同一對準裝置的基板保持具及基板的槪 略立體圖。 第3圖是表示同一對準裝置的槪略立體圖。 第4圖是表示同一對準裝置的斷面圖。 第5圖是表示同一對準裝置的平面內移動裝置的俯視 圖； 第5 (a)圖是表示在平面內移動裝置的構成者，而第 5(b)至（f)圖表示說明其動作者。 第6圖是表示說明同對準裝置的基板與罩幕之定位動 作的俯視圖。 第7圖是表示本發明的實施形態2的對準裝置的斷面 圖。 第8圖表示同實施形態2的對準裝置的變形例的斷面 圖。 第9圖表示同實施形態2的對準裝置的其他變形例的 -19- 1377259 斷面圖。 第10圖是表示本發明的實施形態3的對準裝置的斷 面圖。 第11圖是表示同實施形態3的對準裝置的變形例的 斷面圖。 第12圖是表示同實施形態3的對準裝置的其他變形 例的斷面圖。 【主要元件符號說明】 1 對 準 裝 置 2 蒸 鍍 室 3 真 空 容 器 4 蒸 發 源 5 基 板 6 罩 幕 7 安 裝 框 8 罩 幕 保 持 具 9 搬 入 出 用 開口 11 基 板 保 持 具 11a 保 持 具 本 體 lib 靜 電 吸 盤 12 吊 持 構 件 13 連 結 用 板 14 位 置 遮 斷 裝置 -20- 筒狀遮斷構件 彈推裝置 下環狀安裝座 上環狀安裝座 平面內移動裝置 垂直內移動裝置 支持板 驅動用支持機構 引導用支持機構 連結具 移動板 昇降用引導機構 線性用引導機構 伺服馬達 安裝用板 導軸 導筒 安裝用框 台座 下環狀安裝座 上環狀安裝座 伸縮式筒狀 連通用穴 CCD攝影機裝置 -21 - 視窗 螺旋彈簧 空氣彈簧 配重 空氣壓缸 桿側缸 空氣供給口 壓力調整器 空氣配管 空氣供給泵 爪 基板保持具 罩幕保持具 導軸 移動構件 -22-1377259 IX. Description of the Invention [Technical Field] The present invention relates to an alignment device for vacuum evaporation. [Prior Art] Conventionally, when a semiconductor substrate or the like is to be produced, a semiconductor material is evaporated in a vacuum container and vapor-deposited on the surface of the substrate to form a predetermined conductor pattern. In general, when the conductor pattern is to be formed, a mask having a conductor pattern formed thereon is disposed on the surface of the substrate, and is exposed by exposure of a photoresist applied to the surface (for example, refer to Japanese Patent Laid-Open No. Hei 5-159997 Bulletin). SUMMARY OF THE INVENTION However, in a vacuum container, the substrate must be placed at a predetermined position for the mask, and an alignment device for the alignment is provided. The alignment device is disposed in a vacuum container, but when the alignment device with high alignment accuracy is to be disposed in the vacuum container, it is necessary to use a part and a lubricant formed by a special material that emits less gas, and also It must be made into a political heat countermeasure, etc., so the device itself becomes a very high cost. On the other hand, in order to avoid such a situation, it is considered to arrange the aligning device outside the vacuum vessel. When the alignment device is to be disposed outside the vacuum container, it becomes a vacuum holding mechanism for the insertion portion of the substrate holding member in the vacuum container, which is required to have an alignment device. Therefore, it is necessary to have a special sealing mechanism or processing so that -5- 1377259 The device is still a high cost. ^In the insertion part of the substrate holding member to the vacuum container, by vacuum force, in other words, it receives a large external force generated by atmospheric pressure, and strain is generated to reduce the accuracy of the alignment. In order to solve the above problems, an object of the present invention is to provide an alignment device for vacuum vapor deposition which is low in manufacturing cost of a device body and can maintain high-precision alignment. In order to solve the above problems, an alignment device for vacuum vapor deposition according to the present invention is directed to the alignment of the substrate for a mask used for holding a surface of a substrate held in a vacuum container in a predetermined pattern. An alignment device comprising: a substrate holder that is held by a suspension member that is inserted into a through hole formed in a wall of the vacuum container, above the mask that is held in the vacuum container; a connecting plate for the hanging member connected to the outside of the vacuum container; and a position adjusting device for adjusting the position of the substrate held in the vapor deposition chamber of the substrate holder with respect to the cover by moving the connecting plate; a telescopic tubular blocking member that is disposed between the outer periphery of the through hole of the wall and the connecting plate to block the vacuum side and the atmosphere side; and the cylindrical covering member The inside of the breaking member is a spring pushing device that generates a spring force in a direction opposite to the pressing force of the connecting plate, which occurs in a vacuum state. Further, the position adjusting device is configured such that the substrate held by the connecting plate via the holding member and the substrate holder moves parallel to the surface of the mask. Further, the position adjusting device has a function of moving the connecting plate in the axial direction orthogonal to the surface of the substrate. -6- 1377259 Further, the elastic thrust of the above-described elastic pushing device can be adjusted. According to the configuration described above, when the alignment of the substrate of the mask is performed under a predetermined vacuum, the position adjusting device of the substrate is disposed outside the vacuum container, so that it is not necessary to consider the material under vacuum, and it is not necessary. Since the special sealing mechanism is such that the manufacturing cost of the apparatus main body is provided with a spring pushing device that can impart a spring force against the pressing force generated by the atmospheric pressure under vacuum, it is possible to prevent excess external force from acting on the position adjusting device. Therefore, the alignment of the substrate for the mask can be maintained at an accurate level. [Embodiment] An alignment device for vacuum distillation according to an embodiment of the present invention will be described. The vacuum vapor deposition alignment device is a vacuum vapor deposition device provided for manufacturing a display portion such as an organic EL display, and uses an overcoat to deposit an organic material φ material (which is a vapor deposition material) in a predetermined pattern. When the conductor pattern is obtained on the surface of the glass substrate, the mask is held while the alignment of the mask for the glass substrate is performed. (Embodiment 1) Hereinafter, an alignment device for vacuum evaporation-plating according to Embodiment 1 will be described with reference to Figs. 1 to 6 . As shown in Fig. 1, the alignment device 1 is provided through a mounting plate (an example of a wall) to a vapor deposition chamber 2 having a surface for vapor-depositing an organic material on a 1377259 glass substrate under vacuum. The upper wall 3a of the vacuum vessel 3. Further, it may be directly attached to the upper wall of the entire vacuum container without passing through the mounting plate'. An evaporation source 4 is disposed in a lower portion of the vapor deposition chamber 2 of the vacuum container 3, and a glass substrate (hereinafter referred to as a substrate) 5 is held by the alignment device 1 at an upper position in the vapor deposition chamber 2 of the vacuum container 3, and Below the substrate 5, the mask 6 for forming a predetermined conductor pattern is held by the mask holder 8 via the mounting frame 7. Further, in the side wall 3b of the vacuum container 3, the substrate 5 and the opening and exit opening 9 of the mask 6 are provided, and a robot hand (not shown) is used for loading and unloading the substrate 5 and the mask 6. As shown in FIG. 2 to FIG. 4, the alignment device 1 includes a sheet-shaped electrostatic chuck lib that can adsorb the substrate 5, and is formed in a rectangular shape as viewed in plan view from the plate-shaped holder main body 11a. a substrate holder 11; and a lower end portion is coupled to the right and left portions of the substrate holder 11, and the upper end portion is inserted into two cylindrical hangers that are formed in the through hole lb of the mounting plate 1a and protrude toward the outside of the vacuum container 3. a holding member 12; and a connecting plate 13 which is provided on the outside of the vacuum container 3 and which is connected to the upper end portion of the two holding members 12 and whose upper end opening portion is open to the upper surface, and is connected in a plan view; And a position adjusting device 14 for the cover 6 that is disposed on the upper surface of the mounting plate 1a to move the connecting plate 13 to adjust the substrate 5 held in the vapor deposition chamber 2 of the substrate holder ;; Each of the sling members 12 is provided between the outer periphery of the through hole lb of the mounting plate 1a and the connecting plate 13 to block the telescopic cylindrical blocking member on the vacuum side and the atmosphere side (for example, a vacuum bellows is used) ) 15 ; and occurrence (giving) and due to the barrel -8 - 1377259 The inside of the blocking member 15 is a spring pushing device 16 that generates a spring force in the opposite direction to the pressing force (pressing force) of the connecting plate 13 which is generated in a vacuum state. Further, the cylindrical blocking member 15 is connected to the mounting plate la side and the connecting plate side via the lower annular mounting seat 17 and the upper annular mounting seat 18 having a predetermined inner diameter, and is interrupted in a cylindrical shape. The member 15 has a force (a pressing force due to atmospheric pressure) acting on the opening area (contact area) of the mounting portion of the upper annular mount 18 provided on the side of the connecting plate 13 by the vacuum. φ The position adjustment position 14 is such that the connecting plate 13 can be moved in parallel in a plane parallel to the surface of the cover screen 6, and rotated (rotation with the center of the plate as a center of rotation) and swirling (with the plate) The in-plane moving device 21 having the center of different positions as the center of rotation; and the vertical moving device 22 movable in the vertical direction (axis direction) orthogonal to the mask 6 (or the connecting plate). As shown in FIGS. 4 and 5, the in-plane moving device 21 is a support plate 31 having a rectangular shape in plan view, and a drive disposed at three positions in a square corner of φ on the support plate 31. The support mechanism 32 and the guide support mechanism 33 disposed at the remaining portion; and the moving plate 35 supported by the connecting device 34 provided with each of the support mechanisms 32 and 33, and the moving plate 35 The connection plate 13 is configured to allow movement in the vertical direction via the elevation guide mechanism 36, and to interlock (follow) movement in the horizontal plane. As shown in Fig. 5, the above-described driving support mechanism 32 is known in the art and can be moved in the horizontal plane, that is, in the XY-axis direction via the linear guiding mechanism 37, and can be driven by the servo motor 38 along one side. The axial direction -9-1377259 is forcedly moved (in the X-axis or Y-axis direction), and the guiding support mechanism 33 can be freely moved in the XY-axis direction via the linear guiding mechanism 39 similar to the above. Further, among the three driving support mechanisms 32, two are configured to be forcibly movable in the same direction, and the remaining one may be configured to be forcibly moved in a direction orthogonal to the above two forced moving directions, such that Among the three, the servo motor 38 of the driving support mechanism 32 (one, two or three) can be driven in the X-axis direction [refer to FIG. 5(b)] and the Y-axis direction [refer to the fifth (c) Fig. 'The direction of the X-axis and the Y-axis is inclined [refer to Fig. 5(d)], and the direction of rotation of the center of the moving plate 35 as the axis of rotation [see Fig. 5(e)]), or The turning direction of the turning is centered on the side of the arbitrary support mechanism 32 [refer to FIG. 5(f)], and the moving plate 35 is moved in an arbitrary direction and an arbitrary rotation angle or a turning angle in the horizontal plane. As shown in FIGS. 3 and 4, the elevating guide mechanism 36 is a mounting plate 41 which is formed in a rectangular shape in a plan view integrally formed on the upper surface of the moving plate 35, and is vertically provided on the mounting plate 41. Four guide shafts 42 at the front and rear and left and right positions; and four guide tubes 43 that are provided on the side of the connecting plate 13 and that are externally fitted to the respective guide shafts 42 and are movably guided in the vertical direction. Further, in the drawings, only the front and rear guide shafts 42 and the guide bushes 43 are shown as the vertical moving device 22, and the electric cylinder (driven by the servo motor) is used, and the electric cylinder is used for advancement and retreat. The rod 22a is coupled to the mounting plate 41, and the advancement and retreat lever 22a is moved forward and backward, and the substrate holder η is lifted and lowered via the connecting plate 13, and the interval between the substrate 5 and the -10-1377259 mask 6 is adjusted. . The above-described spring pushing device 16 is used to offset (or reduce) the pressure caused by the atmospheric pressure acting on the end surface side of the cylindrical blocking member 15 in the vacuum state via the through hole lb communicating with the vapor deposition chamber 2 . In other words, the spring-loading device 16 is a door-shaped mounting frame 51 that is vertically erected on the mounting plate 1a across the connecting plate 13 and is provided at the left and right positions of the connecting plate 13. a lower annular mount 53 having a predetermined inner diameter on the upper surface of the pedestal 52, and an upper annular mount 54 having a predetermined inner diameter provided under the horizontal portion 51a of the mounting frame 51; and the upper and lower annular mounts 53 And a telescopic cylindrical blocking member (for example, a telescopic tube for vacuum) 55 that is connected to each other. The inside of each of the left and right cylindrical blocking members 55 is communicated with the inside of the vacuum container 3 via the communication hole 56 formed in the mounting frame 51. Therefore, the proximal end side of the communication hole 56 is formed. The communication hole lc of the mounting plate 1a is communicated with the inside of the vacuum container 3, and the other end is formed at a position corresponding to the upper annular mount 54 provided in the horizontal portion 51a of the mounting frame 51. Further, at least the lower annular mounts 53 provided on the upper surface of the connecting plate 13 (actually, the upper surface of the pedestal 52) and the upper annular mounts 18 provided on the lower surface thereof have the same opening area. In other words, the vacuum contact portions having the same area are provided on the upper and lower surfaces of the connecting plate 1 3, and the pressing force due to the vacuum acts equally from the upper and lower surfaces of the connecting plate 13 to prevent excessive external force. In the connection plate 13. Further, as shown in Fig. 4, a tubular member is used as the hanging member 12, and the substrate holder 11 is provided with a passage that is connected to the -11 - 1377259 communication hole 12a in the two holding members 12. The hole portion lie can supply the cooling liquid to the electrostatic chuck lib from the upper end of the communication hole 12a by supplying a cooling fluid such as water from the upper end opening of the suspension member, as shown in Fig. 1 and As shown in Fig. 3, in order to align the substrate 5 with respect to the mask 6 held by the curtain holder 8, as shown in Fig. 6, the dot substrate side mark M2 provided on the substrate 5 side enters the mask. The CCD camera device 57 for aligning the circular mask side mark M1 of the corner portion on the diagonal line of the sixth line is provided on the connecting plate 1, and of course, the window 508 is provided on the side of the mounting plate 1a. Further, in the case where the image is easily recognized as an image, any of the cross shape and the like can be described above, and the alignment operation for the substrate 5 of the cover in the vacuum container 3 can be explained. First, as shown in Fig. 1, the substrate 5 is inserted into the cover 6 held by the mask holder 8 by the robot hand opening/ejection opening 9 formed in the vacuum container 3, and is electrostatically charged. After the chuck holds the substrate 5, the robot hand or the like is extended from the vacuum container 3, and then the opening 9 is carried out. Under the vacuum, as described above, the cylindrical blocking members 15 and 55 are provided on the connecting plate 13 (the annular mounting seat 18 is correctly provided with the vacuum contact portion of the same area, and therefore, The connecting branch does not act on the excess external force generated by the vacuum. Then, the substrate held by the substrate holder 11 is held by the mask holder 6 held by the mask holder 6 The alignment of these lines of 12. The cover is set in the same way as the 丨3 志 形. The curtain 6 side wall uses lib to close the underside, 53) I 13 inside the 5 -12- 1377259 in the cover 6 The alignment of the substrate 5 uses two CCD camera devices 57 disposed on the diagonal. In other words, as shown in Fig. 6, the dot-shaped substrate-side mark M2 provided on the substrate 5 side enters the circular mask-side mark Μ 1 provided on the side of the mask 6 to drive the position adjusting device. After the in-plane moving device 21 of 14 is moved by the vertical moving device 22, the substrate 5 is moved almost in contact with the surface of the mask 6. When the alignment of the substrate 5 of the mask 6 is completed, the organic material (vapor deposition material) adheres to the surface of the substrate 5 in response to the pattern of the mask 6 to form a predetermined conductor pattern by heating of the evaporation source 4. . When the predetermined conductor pattern is formed, the substrate 5 is taken out from the loading/unloading opening 9 by the robot, and the new substrate 5 is inserted into the vacuum container 3 to be held by the substrate holder 11, and, as described above, It is sufficient to form a conductor pattern in alignment. In this manner, when the alignment of the substrate 5 of the mask 6 is performed under a specific vacuum, the position adjusting device 14 of the substrate 5 is disposed outside the vacuum container 3, so that the configuration of the device body can be made low-cost. Further, when the hanging member 12 for guiding the substrate 5 of the alignment device 1 is guided to the through hole lb for the outside of the vacuum container 3, the cylindrical cover for blocking the through hole 1 b and the atmosphere side is formed. The breaking member 15 is connected to the opposite side of the mounting portion of the connecting plate body 13 with a cylindrical blocking member 55 (annular mounting seat) having a same sectional area as the cylindrical blocking member 15 and communicating with the vacuum container 3 under vacuum. The opening area of 18), that is, the pushing device 16 capable of resisting the pressing force generated by the atmospheric pressure under vacuum, the-13-1377259 can prevent an excessive external force from acting on the aligning device 1, so the device The strain does not occur, and the alignment of the substrate of the mask can be performed with high precision. In detail, the following effects can be obtained. 1. The in-plane moving device 21 that moves the substrate 5 in the horizontal plane and the vertical moving device 22 that moves in the vertical direction are disposed outside the vacuum vessel 3 (at atmospheric pressure), and do not require special vacuum mechanical elements or motors. The cooling device thus provides a low cost and high precision alignment device. 2. Each of the moving devices 21 and 22 is disposed outside the vacuum container 3 (at atmospheric pressure), and is provided with a spring pushing device 16 that can impart a spring force against a pressing force acting under vacuum, thereby reducing the action Since the power of each of the moving devices 21 and 22 generated by the vacuum is used as a driving device such as a motor of the moving device, a small capacity can be used, so that a lower cost configuration can be obtained. 3. In addition, each of the moving devices 21 and 22 is disposed outside the vacuum container 3 (at atmospheric pressure), and is provided with a spring pushing device 16 that can impart a spring force against the pressing force acting under vacuum, thereby suppressing the When the apparatus body is strained, and the field of view of the alignment camera unit 57 of the substrate 5 is prevented from being deviated, high-precision alignment can be performed. 4. Since the substrate 5 is held by the electrostatic chuck lib, the flatness of the substrate 5 can be maintained, so that the distance from the mask 6 can be made extremely small, and high-precision alignment can be performed. 5. Further, since the substrate 5 is held by the electrostatic chuck lib, the flatness of the substrate can be maintained, and the substrate 5 is pressed into the mask 6 with a uniform surface. Therefore, alignment with higher precision can be performed. -14- 1377259 6) The communication hole 12a and the passage lie are formed in the suspension member 12 and the holder main body 11a of the support substrate holder 11, and the inside of the communication hole 12a and the passage lie are formed at atmospheric pressure. The cooling of the substrate holder 11 can be easily performed without hindering the alignment, and the electrical wiring for the electrostatic chuck lib can be easily performed. In addition, when a cooling fluid is to be supplied by a vacuum hose or the like, the hose must be covered with a metal telescopic tube or the like. Therefore, the rigidity on the side of the hose is increased, and alignment with an accuracy of several micrometers is required. The main reason is hindered. (Embodiment 2) Hereinafter, an alignment device for vacuum vapor deposition according to Embodiment 2 will be described with reference to Fig. 7. In the first embodiment, the elastic pushing device 1 6 is described as a vacuum (vacuum force) in the vacuum container 3, but in the second embodiment, the elastic force is used, and the first embodiment and the embodiment are also used. The difference between the two parts is the part of the ejecting device. Therefore, in the second embodiment, the description will be focused on the part, and the other components will be described with the same reference numerals as in the first embodiment (the following The third embodiment is also the same). In other words, as shown in Fig. 7, between the pedestal 52 provided on the left and right of the connecting plate 13 and the mounting frame 51, a pushing device capable of exerting the same tensile force as the pressing force generated by the vacuum is provided. , with a coil spring 61 as well. According to the coil spring 61 of the spring pushing device, the configuration is made simpler than the case where the vacuum communication -15-1377259 hole 56 is formed in the mounting frame 51, so that a lower cost alignment can be provided. Device. Further, as shown in Fig. 8, in the case where the air spring 71 is used instead of the coil spring, the same effects as those of the above-described second embodiment can be obtained. Further, as shown in Fig. 9, instead of the coil spring, a weight 8 1 〇, that is, the other end portion of the cable body (e.g., a metal wire, a rope, etc.) 82 whose one end is connected to the weight 81 may be used. A plurality of (for example, two) guide pulleys 83 disposed in the horizontal portion 51a of the mounting frame 51 are connected to the pedestal 52 provided on each end side of the connecting plate 13. Of course, the total weight of the above-mentioned counterweights 81 is made to be resistant to the pressing force generated by the vacuum. In this configuration, the same effect as in the second embodiment can be obtained. Embodiment 3 Hereinafter, the vacuum vapor deposition alignment device according to the third embodiment will be described based on Fig. 10 . In the first embodiment, the vacuum (vacuum force) in the vacuum container 3 is used as the spring pushing device 16. However, in the third embodiment, the air cylinder user β is used, that is, the tenth As shown in the figure, an air cylinder 91 is disposed between the pedestal 52 disposed on the left and right of the connecting plate 13 and the mounting frame 51, and the air cylinder 91 is, for example, a one-bar type, and the rod side is used. The air supply port 93 of the chamber 16 - 1377259 is connected to the air supply pump 96 via an air pipe 95 having j| in the middle. Therefore, when the vacuum chamber 2 is vacuumed, the pump 96 is actuated, and in the air cylinder 91, the tensile force of the urging force can be generated. At this time, the same effect as in the first embodiment is obtained. The air pressure supplied to the air cylinder 91 can be adjusted to the magnitude of the tensile strength. In the third embodiment, when the connecting plate is pushed, the space is placed above the connecting plate 13, but as shown in the figure, the configuration is arranged between the connecting plates 1a. The air cylinder 91 may be 1 3 from the bottom to the top. According to this configuration, it is possible to reduce the size, weight, and manufacturing cost of the mounting frame and the table. As a modification of the third embodiment, the substrate is held in the substrate holder. The suction cup is only required to hold the base plate 5 with the claws 101 102 as shown in Fig. 12. Of course, the claws 101 are plurally arranged in four places (provided at 6 or 8 positions where the substrate does not cause strain). Further, on the side of the mask holder 103, when the substrate 5 is loaded, the claw 101 does not come into contact with the portion 103a of the mask holder 103. The art force adjuster 94 makes the air supply resistant to the vacuum, and by pressing the top to resist the pressing force! 1 3, the upper I cylinder 91 is pushed upwards, and the mounting plate is pushed and connected with the plate seat. Can be installed. In the first embodiment, the substrate holder holding the substrate 5 using static electricity is provided on the mask 6 as needed, and a recess -17-1377259 is formed, and the position adjusting device 14 shown in Fig. 12 is formed. Instead of the four guide shafts 42 described in the first embodiment (fourth diagram) and the four guide tubes 43 guided by the guide shafts 42, the guide shaft for lifting and lowering is provided with a linear guide shaft 111 and externally embedded therein. A linear guide mechanism formed by one side of the linear guide shaft 111 and guided by the moving member 112. Further, in the pillar portion 10b of the mask holder 103, a passage 103c such as a cooling fluid such as water is formed. With this configuration, the substrate 5 can be held in the vapor deposition chamber 2 without using an electrostatic chuck. Further, the air cylinder 91 shown in Figs. 10 to 12 is disposed between the pedestal 52 of the connecting plate 13 and the mounting frame 51, or between the connecting plate 13 and the mounting plate 1a. However, since the side of the connecting plate 13 is movable at least in the horizontal direction, a joint that can be freely stretched and contracted is provided at both end portions of the air cylinder 91. In addition, in the eleventh and twelfth drawings, the cylinder body of the lower end of the air cylinder 91 is fixed to the side of the mounting plate 1a, and the rotating ball (ball bearing) is disposed at the tip end of the upper rod portion, and is formed only from below. The configuration of the connection board 13 may be supported. However, the in-plane moving device 21' of each of the above-described embodiments may be configured by the driving support mechanism 32 disposed at three places and the guiding support mechanism 33 disposed at one place, but the driving support mechanism 32 may be configured. In each of the above-described embodiments, an alignment device as a vacuum vapor deposition device for depositing an organic EL material on a glass substrate is described. However, the "object to be vacuum vapor deposition" is not limited to the organic EL. Materials, for example, when manufacturing a semiconductor device, a device for forming a conductor pattern on a substrate of "18-1377259" using a mask in a vacuum container can be applied to any vacuum vapor deposition device. According to the present invention, the glass substrate to be vapor-deposited can be aligned with the mask disposed in the vacuum container at a low cost. Therefore, it is most suitable for forming a display portion such as an organic EL display. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a schematic configuration of a vacuum vapor deposition apparatus provided with an alignment device according to a first embodiment of the present invention. Fig. 2 is a schematic perspective view showing a substrate holder and a substrate of the same alignment device. Figure 3 is a schematic perspective view showing the same alignment device. Figure 4 is a cross-sectional view showing the same alignment device. Figure 5 is a plan view showing the in-plane moving device of the same alignment device; Figure 5(a) is a view showing the components of the moving device in the plane, and Figures 5(b) to (f) are diagrams showing the actors . Fig. 6 is a plan view showing the positioning operation of the substrate and the mask of the alignment device. Figure 7 is a cross-sectional view showing an alignment device according to a second embodiment of the present invention. Fig. 8 is a cross-sectional view showing a modification of the alignment device of the second embodiment. Fig. 9 is a sectional view taken along the line -19-1377259 of another modification of the alignment device of the second embodiment. Figure 10 is a cross-sectional view showing an alignment device according to a third embodiment of the present invention. Figure 11 is a cross-sectional view showing a modification of the alignment device of the third embodiment. Figure 12 is a cross-sectional view showing another modification of the alignment device of the third embodiment. [Main component symbol description] 1 Alignment device 2 Vapor deposition chamber 3 Vacuum container 4 Evaporation source 5 Substrate 6 Mask 7 Mounting frame 8 Mask holder 9 Loading and unloading opening 11 Substrate holder 11a Holder body lib Electrostatic chuck 12 Suspension member 13 Connecting plate 14 Position blocking device-20- Cylindrical blocking member Pushing device Lower ring mounting seat Ring mounting seat In-plane moving device Vertical internal moving device Support plate Driving support mechanism Guidance support Mechanism connection moving plate lifting guide mechanism linear guide mechanism servo motor mounting plate guide shaft guide mounting frame pedestal lower ring mount upper ring mount telescopic tubular connection hole CCD camera device-21 - window Coil spring air spring counterweight air pressure cylinder rod side cylinder air supply port pressure regulator air piping air supply pump claw substrate holder with curtain holder retaining shaft moving member-22-