JP5147445B2 - 噴流液柱内に導かれたレーザー光によるレーザー加工装置 - Google Patents

噴流液柱内に導かれたレーザー光によるレーザー加工装置 Download PDF

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Publication number
JP5147445B2
JP5147445B2 JP2008036507A JP2008036507A JP5147445B2 JP 5147445 B2 JP5147445 B2 JP 5147445B2 JP 2008036507 A JP2008036507 A JP 2008036507A JP 2008036507 A JP2008036507 A JP 2008036507A JP 5147445 B2 JP5147445 B2 JP 5147445B2
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Japan
Prior art keywords
nozzle
storage chamber
liquid
laser
liquid storage
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Active
Application number
JP2008036507A
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English (en)
Japanese (ja)
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JP2009095884A (ja
Inventor
良司 村椿
幸明 永田
正 杉森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sugino Machine Ltd
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Sugino Machine Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sugino Machine Ltd filed Critical Sugino Machine Ltd
Priority to JP2008036507A priority Critical patent/JP5147445B2/ja
Priority to US12/232,378 priority patent/US8134098B2/en
Priority to DE102008048697.3A priority patent/DE102008048697B4/de
Priority to KR1020080094952A priority patent/KR101521256B1/ko
Priority to CN2008101695182A priority patent/CN101396768B/zh
Publication of JP2009095884A publication Critical patent/JP2009095884A/ja
Priority to US13/365,593 priority patent/US8581141B2/en
Application granted granted Critical
Publication of JP5147445B2 publication Critical patent/JP5147445B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
JP2008036507A 2007-09-28 2008-02-18 噴流液柱内に導かれたレーザー光によるレーザー加工装置 Active JP5147445B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008036507A JP5147445B2 (ja) 2007-09-28 2008-02-18 噴流液柱内に導かれたレーザー光によるレーザー加工装置
US12/232,378 US8134098B2 (en) 2007-09-28 2008-09-16 Laser machining apparatus using laser beam introduced into jet liquid column
DE102008048697.3A DE102008048697B4 (de) 2007-09-28 2008-09-24 Vorrichtung zur Laserbearbeitung mit Hilfe eines in eine Flüssigkeitsstrahlsäule eingeleiteten Laserstrahls
KR1020080094952A KR101521256B1 (ko) 2007-09-28 2008-09-26 분사류 액체 칼럼 내에 도입된 레이저 광을 이용한 레이저 가공 장치
CN2008101695182A CN101396768B (zh) 2007-09-28 2008-09-27 利用引入射流柱中的激光束的激光加工装置
US13/365,593 US8581141B2 (en) 2007-09-28 2012-02-03 Laser machining apparatus using laser beam introduced into jet liquid column

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007254318 2007-09-28
JP2007254318 2007-09-28
JP2008036507A JP5147445B2 (ja) 2007-09-28 2008-02-18 噴流液柱内に導かれたレーザー光によるレーザー加工装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012171282A Division JP2012210661A (ja) 2007-09-28 2012-08-01 噴流液柱内に導かれたレーザー光によるレーザー加工装置

Publications (2)

Publication Number Publication Date
JP2009095884A JP2009095884A (ja) 2009-05-07
JP5147445B2 true JP5147445B2 (ja) 2013-02-20

Family

ID=40515740

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008036507A Active JP5147445B2 (ja) 2007-09-28 2008-02-18 噴流液柱内に導かれたレーザー光によるレーザー加工装置
JP2012171282A Abandoned JP2012210661A (ja) 2007-09-28 2012-08-01 噴流液柱内に導かれたレーザー光によるレーザー加工装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012171282A Abandoned JP2012210661A (ja) 2007-09-28 2012-08-01 噴流液柱内に導かれたレーザー光によるレーザー加工装置

Country Status (3)

Country Link
JP (2) JP5147445B2 (zh)
KR (1) KR101521256B1 (zh)
CN (1) CN101396768B (zh)

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JP5501099B2 (ja) * 2010-06-03 2014-05-21 株式会社ディスコ レーザ加工装置
JP5501098B2 (ja) * 2010-06-03 2014-05-21 株式会社ディスコ レーザ加工装置
CN102465195B (zh) * 2010-11-16 2013-07-10 杭州中科新松光电有限公司 一种光水同轴的激光冲击强化头
JP5302998B2 (ja) * 2011-03-31 2013-10-02 株式会社スギノマシン ウォータービーム加工装置
JP5220914B2 (ja) * 2011-05-25 2013-06-26 株式会社スギノマシン レーザー加工装置
CN102259237B (zh) * 2011-07-01 2014-09-03 中国电子科技集团公司第四十五研究所 激光光束与水射流耦合调节装置
CN102350591B (zh) * 2011-07-08 2015-01-28 厦门大学 矩形水波导激光加工装置
RU2647952C2 (ru) 2011-12-07 2018-03-21 Дженерал Атомикс Способы и системы для применения в лазерной обработке
JP5877432B2 (ja) * 2012-02-29 2016-03-08 株式会社スギノマシン レーザー加工装置
JP6063635B2 (ja) * 2012-04-10 2017-01-18 株式会社東芝 レーザ加工装置、レーザ加工システム、レーザ加工方法
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CN103590080A (zh) * 2013-11-28 2014-02-19 铜陵学院 一种激光强化喷射电沉积快速成形加工装置及方法
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JP6318428B2 (ja) * 2014-04-18 2018-05-09 株式会社スギノマシン レーザー加工装置
EP2957378A1 (de) * 2014-06-16 2015-12-23 Synova SA Bearbeitungskopf zum Einkopplen eines Laserstrahles in einem Flüssigkeitsstrahl mit einer Flüssigkeitschnittstelle
CN104368911B (zh) * 2014-10-28 2016-12-07 中国科学院宁波材料技术与工程研究所 激光加工头及其应用、激光加工系统及方法
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CN104942442A (zh) * 2015-06-11 2015-09-30 温州大学 激光微加工装置及其方法
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CN106825921A (zh) * 2016-11-17 2017-06-13 雅芳股份公司 激光加工材料时保持工件表面没有液体积聚的系统及方法
WO2018116932A1 (ja) * 2016-12-22 2018-06-28 三菱電機株式会社 レーザ加工装置、レーザ加工方法及び半導体装置の製造方法
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CN107662046B (zh) * 2017-09-19 2019-11-22 清华大学 一种离轴光路的水导激光加工耦合装置
CN107695514A (zh) * 2017-09-20 2018-02-16 华中科技大学 一种激光‑气水同轴射流的耦合头及水下激光加工装置
EP3466597A1 (en) * 2017-10-05 2019-04-10 Synova S.A. Apparatus for machining a workpiece with a laser beam
EP3470165B1 (en) * 2017-10-13 2023-08-16 Synova S.A. Apparatus for machining a workpiece with a liquid jet guided laser beam and the assembly thereof
CN108296633B (zh) * 2018-01-19 2020-02-21 天津科技大学 激光水射流加工装置及其应用
JP6511665B2 (ja) * 2018-02-01 2019-05-15 株式会社スギノマシン レーザー加工装置
CN108406098A (zh) * 2018-03-07 2018-08-17 哈尔滨工业大学 脉冲调控的飞秒激光-纳秒电解射流复合加工系统及方法
CN108480842B (zh) * 2018-06-12 2022-11-29 桂林电子科技大学 水导激光耦合分流稳压装置
US10822879B2 (en) * 2018-08-07 2020-11-03 Saudi Arabian Oil Company Laser tool that combines purging medium and laser beam
CN109623139B (zh) * 2018-12-11 2021-07-27 中国科学院宁波材料技术与工程研究所 水导激光加工装置及系统
CN109623140B (zh) * 2018-12-11 2021-07-27 中国科学院宁波材料技术与工程研究所 光纤与水导激光耦合加工装置及系统
CN109514080B (zh) * 2018-12-11 2021-04-23 中国科学院宁波材料技术与工程研究所 高功率水导激光加工装置及系统
CN109514081B (zh) * 2018-12-11 2021-06-01 中国科学院宁波材料技术与工程研究所 一种水导激光加工装置及加工系统
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Also Published As

Publication number Publication date
JP2012210661A (ja) 2012-11-01
CN101396768B (zh) 2013-07-24
CN101396768A (zh) 2009-04-01
KR20090033143A (ko) 2009-04-01
KR101521256B1 (ko) 2015-05-18
JP2009095884A (ja) 2009-05-07

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