JP5146106B2 - スパッタ装置 - Google Patents

スパッタ装置 Download PDF

Info

Publication number
JP5146106B2
JP5146106B2 JP2008136224A JP2008136224A JP5146106B2 JP 5146106 B2 JP5146106 B2 JP 5146106B2 JP 2008136224 A JP2008136224 A JP 2008136224A JP 2008136224 A JP2008136224 A JP 2008136224A JP 5146106 B2 JP5146106 B2 JP 5146106B2
Authority
JP
Japan
Prior art keywords
targets
ground
substrate
vacuum chamber
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008136224A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009280882A5 (enExample
JP2009280882A (ja
Inventor
晃 奥田
喜之 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008136224A priority Critical patent/JP5146106B2/ja
Publication of JP2009280882A publication Critical patent/JP2009280882A/ja
Publication of JP2009280882A5 publication Critical patent/JP2009280882A5/ja
Application granted granted Critical
Publication of JP5146106B2 publication Critical patent/JP5146106B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Physical Vapour Deposition (AREA)
JP2008136224A 2008-05-26 2008-05-26 スパッタ装置 Expired - Fee Related JP5146106B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008136224A JP5146106B2 (ja) 2008-05-26 2008-05-26 スパッタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008136224A JP5146106B2 (ja) 2008-05-26 2008-05-26 スパッタ装置

Publications (3)

Publication Number Publication Date
JP2009280882A JP2009280882A (ja) 2009-12-03
JP2009280882A5 JP2009280882A5 (enExample) 2010-12-16
JP5146106B2 true JP5146106B2 (ja) 2013-02-20

Family

ID=41451634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008136224A Expired - Fee Related JP5146106B2 (ja) 2008-05-26 2008-05-26 スパッタ装置

Country Status (1)

Country Link
JP (1) JP5146106B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010156018A (ja) * 2008-12-26 2010-07-15 Masahiko Naoe スパッタ装置
CN102719798B (zh) * 2012-06-04 2015-06-17 深圳市华星光电技术有限公司 磁控溅射系统
KR101348828B1 (ko) * 2012-06-21 2014-01-09 경희대학교 산학협력단 스퍼터링 방식을 이용한 ｌｅｄ의 투명 전도층 성막 장치
KR20140014780A (ko) * 2012-07-26 2014-02-06 주식회사 아비즈알 마그네트론 냉각부를 구비한 마그네트론 스퍼터링 장치
CN107058960B (zh) * 2016-12-30 2019-04-30 武汉华星光电技术有限公司 一种溅射机
JP7102260B2 (ja) * 2018-06-29 2022-07-19 株式会社アルバック 対向ターゲット式スパッタ成膜装置
CN114645256B (zh) * 2022-03-14 2023-09-15 苏州迈为科技股份有限公司 减少溅射镀膜损伤硅片衬底的装置及方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313575A (ja) * 1989-06-13 1991-01-22 Hitachi Ltd 対向ターゲツトスパツタ装置
JPH0734236A (ja) * 1993-07-19 1995-02-03 Canon Inc 直流スパッタリング装置およびスパッタリング方法
JP3972558B2 (ja) * 2000-06-23 2007-09-05 松下電器産業株式会社 スパッタリング装置
JP2007154224A (ja) * 2005-12-01 2007-06-21 Matsushita Electric Ind Co Ltd スパッタリング方法および装置

Also Published As

Publication number Publication date
JP2009280882A (ja) 2009-12-03

Similar Documents

Publication Publication Date Title
JP5146106B2 (ja) スパッタ装置
JP4907124B2 (ja) スパッタ・コーティング用アノード
US9136086B2 (en) Closed drift magnetic field ion source apparatus containing self-cleaning anode and a process for substrate modification therewith
US20100276283A1 (en) Vacuum coating unit for homogeneous PVD coating
DK2954758T5 (en) plasma Source
US20220181129A1 (en) Magnetron plasma apparatus
CN110225995A (zh) 用于沉积、注入和处理的具有多种反应气体、高偏置功率和高功率脉冲源的pvd腔室的增设部分
WO2011158828A1 (ja) スパッタ成膜装置及び防着部材
JP6081625B2 (ja) ネオジム磁石の表面コーティング方法及び表面コーティング装置
JP2009293089A (ja) スパッタリング装置
JP5853487B2 (ja) 放電電極及び放電方法
JP2009191340A (ja) 成膜装置及び成膜方法
US9368331B2 (en) Sputtering apparatus
JP5971723B2 (ja) プラズマ処理装置およびプラズマ処理装置防着板
JP4370949B2 (ja) 成膜方法
JP2013079420A (ja) スパッタ装置
JP2007031816A (ja) スパッタリング装置及びスパッタリング方法
EP2811508B1 (en) Gas configuration for magnetron deposition systems
KR102617710B1 (ko) 기판 처리장치
JP3778501B2 (ja) スパッタリング装置およびスパッタリング方法
JP4877058B2 (ja) 対向ターゲットスパッタ装置及び方法
CN120700453A (zh) 一种用于磁控溅射的镀膜装置
JPH07188909A (ja) 真空製膜装置及びそれにより製造された膜
US20170275762A1 (en) Polygon deposition sources with high materials utilization and increased time between chamber cleanings
SE537187C2 (sv) Magnetronplasmaapparat förstärkt genom hålkatodplasma

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101102

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101102

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20101214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120308

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120313

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120510

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120605

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120803

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120821

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121002

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121030

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121112

R151 Written notification of patent or utility model registration

Ref document number: 5146106

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151207

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees