JP5143415B2 - マルチビットセル及び直径が調節できるコンタクトを具備する相変化記憶素子、その製造方法及びそのプログラム方法 - Google Patents

マルチビットセル及び直径が調節できるコンタクトを具備する相変化記憶素子、その製造方法及びそのプログラム方法 Download PDF

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JP5143415B2
JP5143415B2 JP2006346152A JP2006346152A JP5143415B2 JP 5143415 B2 JP5143415 B2 JP 5143415B2 JP 2006346152 A JP2006346152 A JP 2006346152A JP 2006346152 A JP2006346152 A JP 2006346152A JP 5143415 B2 JP5143415 B2 JP 5143415B2
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contact
region
phase change
chalcogenide
information storage
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JP2007184591A (ja
JP2007184591A5 (enExample
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元哲 鄭
亨俊 金
世昊 李
哉▲ヒュン▼ 朴
椙旭 鄭
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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JP2006346152A 2006-01-02 2006-12-22 マルチビットセル及び直径が調節できるコンタクトを具備する相変化記憶素子、その製造方法及びそのプログラム方法 Active JP5143415B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020060000265A KR100746224B1 (ko) 2006-01-02 2006-01-02 멀티비트 셀들을 구비하는 상변화 기억소자들 및 그프로그램 방법들
KR10-2006-0000265 2006-01-02
US11/586,820 2006-10-26
US11/586,820 US20070155093A1 (en) 2006-01-02 2006-10-26 Multi-bit phase-change random access memory (PRAM) with diameter-controlled contacts and methods of fabricating and programming the same

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JP2007184591A JP2007184591A (ja) 2007-07-19
JP2007184591A5 JP2007184591A5 (enExample) 2010-02-12
JP5143415B2 true JP5143415B2 (ja) 2013-02-13

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI326917B (en) * 2007-02-01 2010-07-01 Ind Tech Res Inst Phase-change memory
JP2008218492A (ja) * 2007-02-28 2008-09-18 Elpida Memory Inc 相変化メモリ装置
JP5172269B2 (ja) * 2007-10-17 2013-03-27 株式会社東芝 不揮発性半導体記憶装置
TWI347607B (en) 2007-11-08 2011-08-21 Ind Tech Res Inst Writing system and method for a phase change memory
US8426838B2 (en) 2008-01-25 2013-04-23 Higgs Opl. Capital Llc Phase-change memory
US8098520B2 (en) * 2008-04-25 2012-01-17 Seagate Technology Llc Storage device including a memory cell having multiple memory layers
US8604457B2 (en) 2008-11-12 2013-12-10 Higgs Opl. Capital Llc Phase-change memory element
TWI402845B (zh) 2008-12-30 2013-07-21 Higgs Opl Capital Llc 相變化記憶體陣列之驗證電路及方法
TWI412124B (zh) 2008-12-31 2013-10-11 Higgs Opl Capital Llc 相變化記憶體
US8470635B2 (en) * 2009-11-30 2013-06-25 Micron Technology, Inc. Keyhole-free sloped heater for phase change memory
JP6084521B2 (ja) * 2013-06-20 2017-02-22 株式会社日立製作所 相変化デバイス

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5687112A (en) * 1996-04-19 1997-11-11 Energy Conversion Devices, Inc. Multibit single cell memory element having tapered contact
US7660180B2 (en) * 2004-11-30 2010-02-09 Nxp B.V. Dielectric antifuse for electro-thermally programmable device
JP4890016B2 (ja) * 2005-03-16 2012-03-07 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置

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