JP5132407B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5132407B2
JP5132407B2 JP2008114733A JP2008114733A JP5132407B2 JP 5132407 B2 JP5132407 B2 JP 5132407B2 JP 2008114733 A JP2008114733 A JP 2008114733A JP 2008114733 A JP2008114733 A JP 2008114733A JP 5132407 B2 JP5132407 B2 JP 5132407B2
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JP
Japan
Prior art keywords
control element
island
switching element
semiconductor device
fixing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008114733A
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English (en)
Japanese (ja)
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JP2009267071A5 (https=
JP2009267071A (ja
Inventor
昌和 渡辺
政弘 畑内
貴 倉持
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
On Semiconductor Trading Ltd
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On Semiconductor Trading Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by On Semiconductor Trading Ltd filed Critical On Semiconductor Trading Ltd
Priority to JP2008114733A priority Critical patent/JP5132407B2/ja
Publication of JP2009267071A publication Critical patent/JP2009267071A/ja
Publication of JP2009267071A5 publication Critical patent/JP2009267071A5/ja
Application granted granted Critical
Publication of JP5132407B2 publication Critical patent/JP5132407B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008114733A 2008-04-25 2008-04-25 半導体装置 Active JP5132407B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008114733A JP5132407B2 (ja) 2008-04-25 2008-04-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008114733A JP5132407B2 (ja) 2008-04-25 2008-04-25 半導体装置

Publications (3)

Publication Number Publication Date
JP2009267071A JP2009267071A (ja) 2009-11-12
JP2009267071A5 JP2009267071A5 (https=) 2011-05-26
JP5132407B2 true JP5132407B2 (ja) 2013-01-30

Family

ID=41392543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008114733A Active JP5132407B2 (ja) 2008-04-25 2008-04-25 半導体装置

Country Status (1)

Country Link
JP (1) JP5132407B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6227226B2 (ja) * 2012-05-11 2017-11-08 株式会社デンソー 半導体装置
JP6646744B2 (ja) * 2016-07-01 2020-02-14 ローム株式会社 半導体パッケージ
JP7643161B2 (ja) 2021-04-22 2025-03-11 富士電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0438063U (https=) * 1990-07-27 1992-03-31
JP2704342B2 (ja) * 1992-04-03 1998-01-26 シャープ株式会社 半導体装置およびその製造方法
JP3036256B2 (ja) * 1992-10-06 2000-04-24 富士電機株式会社 半導体装置
JP3685585B2 (ja) * 1996-08-20 2005-08-17 三星電子株式会社 半導体のパッケージ構造
KR100317648B1 (ko) * 1998-08-26 2002-02-19 윤종용 절연접착테이프에의하여다이접착되는반도체소자및다이접착방법그리고그장치
KR100335481B1 (ko) * 1999-09-13 2002-05-04 김덕중 멀티 칩 패키지 구조의 전력소자
JP3989417B2 (ja) * 2003-07-28 2007-10-10 シャープ株式会社 電源用デバイス

Also Published As

Publication number Publication date
JP2009267071A (ja) 2009-11-12

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