JP2009267071A5 - - Google Patents

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Publication number
JP2009267071A5
JP2009267071A5 JP2008114733A JP2008114733A JP2009267071A5 JP 2009267071 A5 JP2009267071 A5 JP 2009267071A5 JP 2008114733 A JP2008114733 A JP 2008114733A JP 2008114733 A JP2008114733 A JP 2008114733A JP 2009267071 A5 JP2009267071 A5 JP 2009267071A5
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JP
Japan
Prior art keywords
switching element
control element
semiconductor device
island
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008114733A
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English (en)
Japanese (ja)
Other versions
JP5132407B2 (ja
JP2009267071A (ja
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Priority to JP2008114733A priority Critical patent/JP5132407B2/ja
Priority claimed from JP2008114733A external-priority patent/JP5132407B2/ja
Publication of JP2009267071A publication Critical patent/JP2009267071A/ja
Publication of JP2009267071A5 publication Critical patent/JP2009267071A5/ja
Application granted granted Critical
Publication of JP5132407B2 publication Critical patent/JP5132407B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008114733A 2008-04-25 2008-04-25 半導体装置 Active JP5132407B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008114733A JP5132407B2 (ja) 2008-04-25 2008-04-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008114733A JP5132407B2 (ja) 2008-04-25 2008-04-25 半導体装置

Publications (3)

Publication Number Publication Date
JP2009267071A JP2009267071A (ja) 2009-11-12
JP2009267071A5 true JP2009267071A5 (https=) 2011-05-26
JP5132407B2 JP5132407B2 (ja) 2013-01-30

Family

ID=41392543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008114733A Active JP5132407B2 (ja) 2008-04-25 2008-04-25 半導体装置

Country Status (1)

Country Link
JP (1) JP5132407B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6227226B2 (ja) * 2012-05-11 2017-11-08 株式会社デンソー 半導体装置
JP6646744B2 (ja) * 2016-07-01 2020-02-14 ローム株式会社 半導体パッケージ
JP7643161B2 (ja) 2021-04-22 2025-03-11 富士電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0438063U (https=) * 1990-07-27 1992-03-31
JP2704342B2 (ja) * 1992-04-03 1998-01-26 シャープ株式会社 半導体装置およびその製造方法
JP3036256B2 (ja) * 1992-10-06 2000-04-24 富士電機株式会社 半導体装置
JP3685585B2 (ja) * 1996-08-20 2005-08-17 三星電子株式会社 半導体のパッケージ構造
KR100317648B1 (ko) * 1998-08-26 2002-02-19 윤종용 절연접착테이프에의하여다이접착되는반도체소자및다이접착방법그리고그장치
KR100335481B1 (ko) * 1999-09-13 2002-05-04 김덕중 멀티 칩 패키지 구조의 전력소자
JP3989417B2 (ja) * 2003-07-28 2007-10-10 シャープ株式会社 電源用デバイス

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