JP2009267071A5 - - Google Patents
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- Publication number
- JP2009267071A5 JP2009267071A5 JP2008114733A JP2008114733A JP2009267071A5 JP 2009267071 A5 JP2009267071 A5 JP 2009267071A5 JP 2008114733 A JP2008114733 A JP 2008114733A JP 2008114733 A JP2008114733 A JP 2008114733A JP 2009267071 A5 JP2009267071 A5 JP 2009267071A5
- Authority
- JP
- Japan
- Prior art keywords
- switching element
- control element
- semiconductor device
- island
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (6)
前記スイッチング素子と前記制御素子とは同一のアイランドに実装され、
前記スイッチング素子は導電性固着材を介して前記アイランドに実装され、
前記制御素子は、裏面に貼着された絶縁シートおよび絶縁性固着材を介して、前記アイランドに実装されることを特徴とする半導体装置。 A switching element, and a control element for controlling the switching element,
The switching element and the control element are mounted on the same island,
The switching element is mounted on the island via a conductive fixing material,
The control device is mounted on the island through an insulating sheet and an insulating fixing material attached to the back surface.
前記制御素子は、前記アイランドを経由して前記スイッチング素子から熱エネルギーが伝導することで加熱され、
前記過熱保護部で検出された前記制御素子の温度が所定以上の時は、前記制御素子から前記スイッチング素子への制御信号の供給を遮断することを特徴とする請求項１または請求項２に記載の半導体装置。 The control element includes an overheat protection unit,
The control element is heated by conducting heat energy from the switching element via the island,
3. The supply of a control signal from the control element to the switching element is cut off when the temperature of the control element detected by the overheat protection unit is equal to or higher than a predetermined value. Semiconductor device.
前記制御素子は、前記リードが整列する方向に対して前記スイッチング素子よりも前記アイランドの中央部付近に実装されることを特徴とする請求項１から請求項５の何れかに記載の半導体装置。
A plurality of leads connected to the switching element or the control element and projecting to the outside;
6. The semiconductor device according to claim 1 , wherein the control element is mounted closer to a center portion of the island than the switching element in a direction in which the leads are aligned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008114733A JP5132407B2 (en) | 2008-04-25 | 2008-04-25 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008114733A JP5132407B2 (en) | 2008-04-25 | 2008-04-25 | Semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009267071A JP2009267071A (en) | 2009-11-12 |
| JP2009267071A5 true JP2009267071A5 (en) | 2011-05-26 |
| JP5132407B2 JP5132407B2 (en) | 2013-01-30 |
Family
ID=41392543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008114733A Active JP5132407B2 (en) | 2008-04-25 | 2008-04-25 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5132407B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6227226B2 (en) * | 2012-05-11 | 2017-11-08 | 株式会社デンソー | Semiconductor device |
| US10833595B2 (en) * | 2016-07-01 | 2020-11-10 | Rohm Co., Ltd. | Semiconductor device with upper and lower switching devices and isolation transformer |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438063U (en) * | 1990-07-27 | 1992-03-31 | ||
| JP2704342B2 (en) * | 1992-04-03 | 1998-01-26 | シャープ株式会社 | Semiconductor device and manufacturing method thereof |
| JP3036256B2 (en) * | 1992-10-06 | 2000-04-24 | 富士電機株式会社 | Semiconductor device |
| JP3685585B2 (en) * | 1996-08-20 | 2005-08-17 | 三星電子株式会社 | Semiconductor package structure |
| KR100317648B1 (en) * | 1998-08-26 | 2002-02-19 | 윤종용 | Semiconductor device having die adhesively bonded by electrically insulating tape, method and apparatus for die bonding |
| KR100335481B1 (en) * | 1999-09-13 | 2002-05-04 | 김덕중 | Power device having multi-chip package structure |
| JP3989417B2 (en) * | 2003-07-28 | 2007-10-10 | シャープ株式会社 | Power device |
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2008
- 2008-04-25 JP JP2008114733A patent/JP5132407B2/en active Active
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