JP5118694B2 - レーザビームの非干渉合成 - Google Patents

レーザビームの非干渉合成 Download PDF

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Publication number
JP5118694B2
JP5118694B2 JP2009515420A JP2009515420A JP5118694B2 JP 5118694 B2 JP5118694 B2 JP 5118694B2 JP 2009515420 A JP2009515420 A JP 2009515420A JP 2009515420 A JP2009515420 A JP 2009515420A JP 5118694 B2 JP5118694 B2 JP 5118694B2
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Japan
Prior art keywords
laser
frequency
output
resonator
beams
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Expired - Fee Related
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JP2009515420A
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English (en)
Japanese (ja)
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JP2009540604A5 (https=
JP2009540604A (ja
Inventor
フォンタネラ、ジョエル
ブラウン、デイビッド・イー
ミュラー、エリック・アール
ミシャウド、レイモンド
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コヒーレント・インク
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/22—Gases
    • H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
    • H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/065—Mode locking; Mode suppression; Mode selection ; Self pulsating
    • H01S5/0651—Mode control
    • H01S5/0652—Coherence lowering or collapse, e.g. multimode emission by additional input or modulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)
JP2009515420A 2006-06-12 2007-06-05 レーザビームの非干渉合成 Expired - Fee Related JP5118694B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US81287706P 2006-06-12 2006-06-12
US60/812,877 2006-06-12
US11/810,090 US7545838B2 (en) 2006-06-12 2007-06-04 Incoherent combination of laser beams
US11/810,090 2007-06-04
PCT/US2007/013218 WO2007145933A2 (en) 2006-06-12 2007-06-05 Incoherent combination of laser beams

Publications (3)

Publication Number Publication Date
JP2009540604A JP2009540604A (ja) 2009-11-19
JP2009540604A5 JP2009540604A5 (https=) 2010-05-27
JP5118694B2 true JP5118694B2 (ja) 2013-01-16

Family

ID=38832325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009515420A Expired - Fee Related JP5118694B2 (ja) 2006-06-12 2007-06-05 レーザビームの非干渉合成

Country Status (3)

Country Link
US (1) US7545838B2 (https=)
JP (1) JP5118694B2 (https=)
WO (1) WO2007145933A2 (https=)

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US8596823B2 (en) 2010-09-07 2013-12-03 Coherent, Inc. Line-projection apparatus for arrays of diode-laser bar stacks
US8602592B2 (en) 2011-04-07 2013-12-10 Coherent, Inc. Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions
US9793673B2 (en) 2011-06-13 2017-10-17 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
ES2530070T3 (es) * 2011-09-05 2015-02-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres y conjuntos ajustables individualmente de medios de desviación
DK2565994T3 (en) 2011-09-05 2014-03-10 Alltec Angewandte Laserlicht Technologie Gmbh Laser device and method for marking an object
DK2564973T3 (en) * 2011-09-05 2015-01-12 Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung Marking apparatus having a plurality of lasers and a kombineringsafbøjningsindretning
ES2544269T3 (es) * 2011-09-05 2015-08-28 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente
EP2564972B1 (en) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam
DK2565996T3 (da) 2011-09-05 2014-01-13 Alltec Angewandte Laserlicht Technologie Gmbh Laserindretning med en laserenhed og en fluidbeholder til en køleindretning af laserenheden
EP2564976B1 (en) 2011-09-05 2015-06-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with at least one gas laser and heat dissipator
ES2438751T3 (es) 2011-09-05 2014-01-20 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo y procedimiento para marcar un objeto por medio de un rayo láser
KR101865222B1 (ko) 2011-10-18 2018-06-08 삼성디스플레이 주식회사 레이저 결정화 장치 및 레이저 결정화 방법
WO2014024196A2 (en) * 2012-08-09 2014-02-13 Israel Aerospace Industries Ltd. Friend or foe identification system and method
JP2015531895A (ja) * 2012-09-24 2015-11-05 リモ パテントフェルヴァルトゥング ゲーエムベーハー ウント コー．カーゲーＬＩＭＯ Ｐａｔｅｎｔｖｅｒｗａｌｔｕｎｇ ＧｍｂＨ ＆ Ｃｏ．ＫＧ 作業面におけるレーザビームの線形強度分布を発生させるための装置
US9151940B2 (en) 2012-12-05 2015-10-06 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
DE102013103422B4 (de) * 2013-04-05 2022-01-05 Focuslight Technologies Inc. Vorrichtung zur Erzeugung von Laserstrahlung mit einer linienförmigen Intensitätsverteilung
US9525265B2 (en) * 2014-06-20 2016-12-20 Kla-Tencor Corporation Laser repetition rate multiplier and flat-top beam profile generators using mirrors and/or prisms
KR101718207B1 (ko) * 2015-05-04 2017-04-05 한국과학기술원 전자 주파수로 태깅되는 단일 검출기를 사용한 광 간섭의 연쇄적 록킹 방법 및 시스템
WO2017110121A1 (ja) * 2015-12-25 2017-06-29 鴻海精密工業股▲ふん▼有限公司 ラインビーム光源およびラインビーム照射装置ならびにレーザリフトオフ方法
WO2021138026A1 (en) * 2019-12-31 2021-07-08 Cymer, Llc Dual pulsed power system with independent voltage and timing control and reduced power consumption
CN113219477B (zh) * 2020-01-21 2025-04-11 深圳引望智能技术有限公司 激光探测装置及其制造方法
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Also Published As

Publication number Publication date
WO2007145933A3 (en) 2008-03-13
US20070295974A1 (en) 2007-12-27
JP2009540604A (ja) 2009-11-19
WO2007145933A2 (en) 2007-12-21
US7545838B2 (en) 2009-06-09

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