JP2007519253A5 - - Google Patents

Download PDF

Info

Publication number
JP2007519253A5
JP2007519253A5 JP2006551055A JP2006551055A JP2007519253A5 JP 2007519253 A5 JP2007519253 A5 JP 2007519253A5 JP 2006551055 A JP2006551055 A JP 2006551055A JP 2006551055 A JP2006551055 A JP 2006551055A JP 2007519253 A5 JP2007519253 A5 JP 2007519253A5
Authority
JP
Japan
Prior art keywords
laser
frequency
output
lasers
laser system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006551055A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007519253A (ja
Filing date
Publication date
Priority claimed from US10/760,687 external-priority patent/US7199330B2/en
Application filed filed Critical
Publication of JP2007519253A publication Critical patent/JP2007519253A/ja
Publication of JP2007519253A5 publication Critical patent/JP2007519253A5/ja
Pending legal-status Critical Current

Links

JP2006551055A 2004-01-20 2004-11-30 フラットトップを有するレーザービームを形成するシステム及び方法 Pending JP2007519253A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/760,687 US7199330B2 (en) 2004-01-20 2004-01-20 Systems and methods for forming a laser beam having a flat top
PCT/US2004/039951 WO2005076419A1 (en) 2004-01-20 2004-11-30 Systems and methods for forming a laser beam having a flat top

Publications (2)

Publication Number Publication Date
JP2007519253A JP2007519253A (ja) 2007-07-12
JP2007519253A5 true JP2007519253A5 (https=) 2007-11-15

Family

ID=34750047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006551055A Pending JP2007519253A (ja) 2004-01-20 2004-11-30 フラットトップを有するレーザービームを形成するシステム及び方法

Country Status (4)

Country Link
US (1) US7199330B2 (https=)
EP (1) EP1709713A1 (https=)
JP (1) JP2007519253A (https=)
WO (1) WO2005076419A1 (https=)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019361A (ja) * 2005-07-11 2007-01-25 Mitsutoyo Corp 周波数安定化レーザ
US7327769B2 (en) * 2005-10-18 2008-02-05 Coherent, Inc. Injection locking Q-switched and Q-switched cavity dumped CO2 lasers for extreme UV generation
US20070238046A1 (en) * 2006-04-07 2007-10-11 The Domino Corporation Laser marking
US7545838B2 (en) * 2006-06-12 2009-06-09 Coherent, Inc. Incoherent combination of laser beams
US20080013182A1 (en) * 2006-07-17 2008-01-17 Joerg Ferber Two-stage laser-beam homogenizer
US7615722B2 (en) 2006-07-17 2009-11-10 Coherent, Inc. Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers
JP2008073742A (ja) * 2006-09-22 2008-04-03 Nitto Denko Corp 光学フィルムの切断方法及び光学フィルム
KR100879010B1 (ko) * 2007-06-18 2009-01-15 주식회사 코윈디에스티 표시장치의 휘점불량 수리방법
DE102008027231B4 (de) * 2008-06-06 2016-03-03 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Strahlformung
US20100065758A1 (en) * 2008-09-16 2010-03-18 Tokyo Electron Limited Dielectric material treatment system and method of operating
US8895942B2 (en) * 2008-09-16 2014-11-25 Tokyo Electron Limited Dielectric treatment module using scanning IR radiation source
RU2435182C2 (ru) * 2008-11-24 2011-11-27 Корпорация "САМСУНГ ЭЛЕКТРОНИКС Ко., Лтд." Согласующая лазерная оптическая система для обеспечения постоянства размера и положения выходной перетяжки
DE102009010693A1 (de) * 2009-02-26 2010-09-02 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Homogenisierung von Laserstrahlung
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP6055414B2 (ja) * 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
WO2013009550A2 (en) * 2011-07-13 2013-01-17 Bae Systems Integration And Electronic Systems Integration Inc. Beam shaping and control apparatus
DK2564973T3 (en) * 2011-09-05 2015-01-12 Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung Marking apparatus having a plurality of lasers and a kombineringsafbøjningsindretning
DK2565994T3 (en) 2011-09-05 2014-03-10 Alltec Angewandte Laserlicht Technologie Gmbh Laser device and method for marking an object
ES2544269T3 (es) * 2011-09-05 2015-08-28 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente
DK2565996T3 (da) 2011-09-05 2014-01-13 Alltec Angewandte Laserlicht Technologie Gmbh Laserindretning med en laserenhed og en fluidbeholder til en køleindretning af laserenheden
ES2530070T3 (es) * 2011-09-05 2015-02-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres y conjuntos ajustables individualmente de medios de desviación
EP2564972B1 (en) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam
ES2438751T3 (es) 2011-09-05 2014-01-20 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo y procedimiento para marcar un objeto por medio de un rayo láser
EP2564976B1 (en) 2011-09-05 2015-06-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with at least one gas laser and heat dissipator
US8883565B2 (en) * 2011-10-04 2014-11-11 Infineon Technologies Ag Separation of semiconductor devices from a wafer carrier
US10201877B2 (en) 2011-10-26 2019-02-12 Titanova Inc Puddle forming and shaping with primary and secondary lasers
WO2014024196A2 (en) * 2012-08-09 2014-02-13 Israel Aerospace Industries Ltd. Friend or foe identification system and method
DE102013103422B4 (de) 2013-04-05 2022-01-05 Focuslight Technologies Inc. Vorrichtung zur Erzeugung von Laserstrahlung mit einer linienförmigen Intensitätsverteilung
JP6594861B2 (ja) * 2013-09-24 2019-10-23 アイピージー フォトニクス コーポレーション ディザリング可能なレーザー処理システム
EP3165615B1 (en) * 2014-07-03 2022-12-21 Nippon Steel Corporation Use of a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet
US9613815B2 (en) 2014-11-24 2017-04-04 Ultratech, Inc. High-efficiency line-forming optical systems and methods for defect annealing and dopant activation
US10025107B2 (en) * 2016-02-16 2018-07-17 Gerald Ho Kim Two-dimensional coherent beam combination using circular or spiral diffraction grating
DE102017203655B4 (de) 2017-03-07 2019-08-22 Robert Bosch Gmbh Verfahren und Vorrichtung zur Formung von Strahlung für die Laserbearbeitung
FR3072895B1 (fr) * 2017-10-31 2019-10-18 Saint-Gobain Glass France Procede d'alignement d'une pluralite de lignes lasers
CN108521068B (zh) * 2018-03-23 2019-04-05 武汉大学 可调节波长、脉冲宽度以及功率的激光器调节装置
US11931824B2 (en) 2019-01-23 2024-03-19 Vulcanforms Inc. Laser control systems for additive manufacturing
IL284740B2 (en) 2021-07-08 2023-05-01 Elbit Systems Electro Optics Elop Ltd Optical correction component for coherent beam combining systems and coherent beam combining methods and systems using an optical correction component
CN113467096A (zh) * 2021-07-29 2021-10-01 英诺激光科技股份有限公司 一种激光光束平顶光整形装置及其工作方法
CN120244211B (zh) * 2025-05-23 2025-10-14 中国科学院宁波材料技术与工程研究所 一种激光加工装置以及方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3476463A (en) 1965-05-11 1969-11-04 Perkin Elmer Corp Coherent light optical system yielding an output beam of desired intensity distribution at a desired equiphase surface
US3793595A (en) * 1971-12-27 1974-02-19 Perkin Elmer Corp Single frequency stabilized laser
US4025875A (en) * 1976-01-05 1977-05-24 Nasa Length controlled stabilized mode-lock Nd:YAG laser
JPS5790987A (en) 1980-11-26 1982-06-05 Fujitsu Ltd Controlling device of laser frequency
JPS62142095A (ja) * 1985-12-12 1987-06-25 Mitsubishi Electric Corp レ−ザ加工装置
DE3750693T3 (de) * 1986-11-28 1999-12-23 Fuji Photo Film Co., Ltd. Optisches System für Laser.
JPH01287979A (ja) 1988-05-13 1989-11-20 Brother Ind Ltd 安定化レーザ光源装置
US5397327A (en) 1993-07-27 1995-03-14 Coherent, Inc. Surgical laser handpiece for slit incisions
JPH088479A (ja) * 1994-06-16 1996-01-12 Hitachi Ltd レーザ装置及びレーザシステム
US5674414A (en) 1994-11-11 1997-10-07 Carl-Zeiss Stiftung Method and apparatus of irradiating a surface of a workpiece with a plurality of beams
JP3141715B2 (ja) * 1994-12-22 2001-03-05 松下電器産業株式会社 レーザ加工方法
JPH10258383A (ja) * 1997-03-14 1998-09-29 Mitsubishi Heavy Ind Ltd 線状レーザビーム光学系
IL140386A0 (en) 2000-12-18 2002-02-10 Rayteq Laser Ind Ltd Optical device for unifying light beams emitted by several light sources
DE19915000C2 (de) 1999-04-01 2002-05-08 Microlas Lasersystem Gmbh Vorrichtung und Verfahren zum Steuern der Intensitätsverteilung eines Laserstrahls
US6838638B2 (en) * 2000-07-31 2005-01-04 Toyota Jidosha Kabushiki Kaisha Laser beam machining method
JP2002141301A (ja) * 2000-11-02 2002-05-17 Mitsubishi Electric Corp レーザアニーリング用光学系とこれを用いたレーザアニーリング装置
WO2002075935A2 (en) * 2001-03-15 2002-09-26 Iolon, Inc. Apparatus for frequency tuning and locking and method for operating same
WO2002090037A1 (en) * 2001-05-09 2002-11-14 Electro Scientific Industries, Inc. Micromachining with high-energy, intra-cavity q-switched co2 laser pulses
JP5201614B2 (ja) * 2001-07-23 2013-06-05 株式会社日本製鋼所 レーザ光の照射方法及びその装置
JP5078205B2 (ja) * 2001-08-10 2012-11-21 株式会社半導体エネルギー研究所 レーザ照射装置
US6750423B2 (en) * 2001-10-25 2004-06-15 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
US6700096B2 (en) * 2001-10-30 2004-03-02 Semiconductor Energy Laboratory Co., Ltd. Laser apparatus, laser irradiation method, manufacturing method for semiconductor device, semiconductor device, production system for semiconductor device using the laser apparatus, and electronic equipment
TWI289896B (en) * 2001-11-09 2007-11-11 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
US7113527B2 (en) * 2001-12-21 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for laser irradiation and manufacturing method of semiconductor device
JP2003347236A (ja) * 2002-05-28 2003-12-05 Sony Corp レーザ照射装置

Similar Documents

Publication Publication Date Title
JP2007519253A5 (https=)
US7545838B2 (en) Incoherent combination of laser beams
US7199330B2 (en) Systems and methods for forming a laser beam having a flat top
US10118256B2 (en) Sheet metal processing method using laser beams and direct diode laser processing device for carrying it out
JP6453303B2 (ja) レーザビーム位置決めシステムのためのフェーズドアレイステアリング
US20260084239A1 (en) Machining apparatus for laser machining a workpiece, method for laser machining a workpiece
KR101898632B1 (ko) 레이저 증폭 장치
CN102380709B (zh) 平顶高斯光束皮秒脉冲激光加工系统
JP2017170454A (ja) レーザ加工装置、三次元造形装置、及びレーザ加工方法
JP5081087B2 (ja) 平面ガラスシートの製造方法
JP5536319B2 (ja) レーザスクライブ方法および装置
US20020134765A1 (en) Laser irradiating apparatus
JP2013046924A (ja) レーザダイシング方法
US8450638B2 (en) Laser scribing method and apparatus
JP2016112609A (ja) レーザ切断装置およびレーザ切断方法
JP2004035953A (ja) レーザー光を利用した焼入れ方法及び装置
JP4813624B1 (ja) レーザダイシング方法
CN114221208B (zh) 纳米阵列制备系统及纳米阵列制备方法
US6890839B2 (en) Method and apparatus for laser annealing configurations of a beam
WO2016059936A1 (ja) ダイレクトダイオードレーザ加工装置及びこれを用いた板金の加工方法
JP2016073983A (ja) レーザ溶接装置およびレーザ溶接方法
JP2015123482A (ja) レーザダイシング装置およびレーザダイシング方法
JP2013184207A (ja) レーザパターニング装置およびレーザパターニング方法
CN110549012B (zh) 一种多色超短脉冲光丝隐切方法及装置
JP2010056338A (ja) ２次元フォトニック結晶レーザ