JP2007519253A - フラットトップを有するレーザービームを形成するシステム及び方法 - Google Patents

フラットトップを有するレーザービームを形成するシステム及び方法 Download PDF

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Publication number
JP2007519253A
JP2007519253A JP2006551055A JP2006551055A JP2007519253A JP 2007519253 A JP2007519253 A JP 2007519253A JP 2006551055 A JP2006551055 A JP 2006551055A JP 2006551055 A JP2006551055 A JP 2006551055A JP 2007519253 A JP2007519253 A JP 2007519253A
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laser
laser system
lasers
output
frequency
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JP2006551055A
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JP2007519253A5 (https=
Inventor
デマリア、アンソニー・ジェイ
ニューマン、レオン・エイ
セクイン、バーノン
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コヒーレント・インク
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0977—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/03—Constructional details of gas laser discharge tubes
    • H01S3/0315—Waveguide lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08018—Mode suppression
    • H01S3/08022—Longitudinal modes
    • H01S3/08031—Single-mode emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/10084—Frequency control by seeding
    • H01S3/10092—Coherent seed, e.g. injection locking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/22—Gases
    • H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
    • H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)
JP2006551055A 2004-01-20 2004-11-30 フラットトップを有するレーザービームを形成するシステム及び方法 Pending JP2007519253A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/760,687 US7199330B2 (en) 2004-01-20 2004-01-20 Systems and methods for forming a laser beam having a flat top
PCT/US2004/039951 WO2005076419A1 (en) 2004-01-20 2004-11-30 Systems and methods for forming a laser beam having a flat top

Publications (2)

Publication Number Publication Date
JP2007519253A true JP2007519253A (ja) 2007-07-12
JP2007519253A5 JP2007519253A5 (https=) 2007-11-15

Family

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Family Applications (1)

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JP2006551055A Pending JP2007519253A (ja) 2004-01-20 2004-11-30 フラットトップを有するレーザービームを形成するシステム及び方法

Country Status (4)

Country Link
US (1) US7199330B2 (https=)
EP (1) EP1709713A1 (https=)
JP (1) JP2007519253A (https=)
WO (1) WO2005076419A1 (https=)

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JP2011523723A (ja) * 2008-06-06 2011-08-18 リモ パテントフェルヴァルトゥング ゲーエムベーハー ウント コー．カーゲー ビーム形成装置およびビーム形成方法

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US20070238046A1 (en) * 2006-04-07 2007-10-11 The Domino Corporation Laser marking
US7545838B2 (en) * 2006-06-12 2009-06-09 Coherent, Inc. Incoherent combination of laser beams
US20080013182A1 (en) * 2006-07-17 2008-01-17 Joerg Ferber Two-stage laser-beam homogenizer
US7615722B2 (en) 2006-07-17 2009-11-10 Coherent, Inc. Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers
JP2008073742A (ja) * 2006-09-22 2008-04-03 Nitto Denko Corp 光学フィルムの切断方法及び光学フィルム
KR100879010B1 (ko) * 2007-06-18 2009-01-15 주식회사 코윈디에스티 표시장치의 휘점불량 수리방법
US20100065758A1 (en) * 2008-09-16 2010-03-18 Tokyo Electron Limited Dielectric material treatment system and method of operating
US8895942B2 (en) * 2008-09-16 2014-11-25 Tokyo Electron Limited Dielectric treatment module using scanning IR radiation source
RU2435182C2 (ru) * 2008-11-24 2011-11-27 Корпорация "САМСУНГ ЭЛЕКТРОНИКС Ко., Лтд." Согласующая лазерная оптическая система для обеспечения постоянства размера и положения выходной перетяжки
DE102009010693A1 (de) * 2009-02-26 2010-09-02 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Homogenisierung von Laserstrahlung
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP6055414B2 (ja) * 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
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DK2564973T3 (en) * 2011-09-05 2015-01-12 Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung Marking apparatus having a plurality of lasers and a kombineringsafbøjningsindretning
DK2565994T3 (en) 2011-09-05 2014-03-10 Alltec Angewandte Laserlicht Technologie Gmbh Laser device and method for marking an object
ES2544269T3 (es) * 2011-09-05 2015-08-28 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente
DK2565996T3 (da) 2011-09-05 2014-01-13 Alltec Angewandte Laserlicht Technologie Gmbh Laserindretning med en laserenhed og en fluidbeholder til en køleindretning af laserenheden
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ES2438751T3 (es) 2011-09-05 2014-01-20 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo y procedimiento para marcar un objeto por medio de un rayo láser
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US10201877B2 (en) 2011-10-26 2019-02-12 Titanova Inc Puddle forming and shaping with primary and secondary lasers
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JP6594861B2 (ja) * 2013-09-24 2019-10-23 アイピージー フォトニクス コーポレーション ディザリング可能なレーザー処理システム
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Publication number Priority date Publication date Assignee Title
JP2011523723A (ja) * 2008-06-06 2011-08-18 リモ パテントフェルヴァルトゥング ゲーエムベーハー ウント コー．カーゲー ビーム形成装置およびビーム形成方法

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Publication number Publication date
US20050157762A1 (en) 2005-07-21
WO2005076419A1 (en) 2005-08-18
US7199330B2 (en) 2007-04-03
EP1709713A1 (en) 2006-10-11

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