JP5114092B2 - 電圧を発生させるための方法および少なくとも1つの熱電モジュールの温度を調整するためのシステム - Google Patents

電圧を発生させるための方法および少なくとも1つの熱電モジュールの温度を調整するためのシステム Download PDF

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JP5114092B2
JP5114092B2 JP2007122230A JP2007122230A JP5114092B2 JP 5114092 B2 JP5114092 B2 JP 5114092B2 JP 2007122230 A JP2007122230 A JP 2007122230A JP 2007122230 A JP2007122230 A JP 2007122230A JP 5114092 B2 JP5114092 B2 JP 5114092B2
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temperature
thermoelectric module
cooling
heat sink
heat
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JP2007305993A5 (enExample
JP2007305993A (ja
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ベン・ピー・フー
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Boeing Co
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Boeing Co
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

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  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007122230A 2006-05-10 2007-05-07 電圧を発生させるための方法および少なくとも1つの熱電モジュールの温度を調整するためのシステム Active JP5114092B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/382,632 2006-05-10
US11/382,632 US7915516B2 (en) 2006-05-10 2006-05-10 Thermoelectric power generator with built-in temperature adjustment

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JP2007305993A JP2007305993A (ja) 2007-11-22
JP2007305993A5 JP2007305993A5 (enExample) 2010-06-17
JP5114092B2 true JP5114092B2 (ja) 2013-01-09

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US (1) US7915516B2 (enExample)
EP (1) EP1855328B1 (enExample)
JP (1) JP5114092B2 (enExample)
CN (1) CN101072004B (enExample)

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JP2015524894A (ja) 2012-08-01 2015-08-27 ゲンサーム インコーポレイテッド 高効率熱電発電
CN103853214B (zh) * 2012-12-04 2016-04-27 联想(北京)有限公司 一种控制温度的电子设备及方法
KR101335277B1 (ko) * 2012-12-28 2013-11-29 송영배 태양열 발전 시스템에 사용되는 축열조, 이에 사용되는 태양열 발전기 및 이를 포함하는 태양열 발전 시스템
KR102253247B1 (ko) 2013-01-30 2021-05-17 젠썸 인코포레이티드 열전-기반 열 관리 시스템
US20140360547A1 (en) * 2013-06-06 2014-12-11 Hamilton Sundstrand Corporation Energy recovery and regeneration system
TWI480565B (zh) * 2013-06-27 2015-04-11 China Steel Corp Simulation System of Thermoelectric Power Generation Performance
US9666781B2 (en) * 2013-08-19 2017-05-30 The Boeing Company Methods for recovering waste energy from bleed air ducts
JP6171996B2 (ja) * 2014-03-13 2017-08-02 富士ゼロックス株式会社 電子機器及び画像形成装置
CN108028306B (zh) * 2015-09-18 2022-01-25 三菱综合材料株式会社 热电转换模块及热电转换装置
JP6750404B2 (ja) * 2015-09-18 2020-09-02 三菱マテリアル株式会社 熱電変換モジュール及び熱電変換装置並びに熱電変換モジュールの製造方法
CN105305886B (zh) * 2015-11-02 2017-10-31 无锡海斯凯尔医学技术有限公司 用于弹性检测设备的热能处理装置
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US20200049053A1 (en) * 2018-08-08 2020-02-13 Universidade Do Minho System for efficient heat recovery and method thereof
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
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Also Published As

Publication number Publication date
EP1855328B1 (en) 2013-11-13
JP2007305993A (ja) 2007-11-22
US7915516B2 (en) 2011-03-29
EP1855328A3 (en) 2011-05-25
US20070261729A1 (en) 2007-11-15
EP1855328A2 (en) 2007-11-14
CN101072004A (zh) 2007-11-14
CN101072004B (zh) 2011-10-12

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