JP5086379B2 - 放熱構造物の製造方法 - Google Patents

放熱構造物の製造方法 Download PDF

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Publication number
JP5086379B2
JP5086379B2 JP2010015996A JP2010015996A JP5086379B2 JP 5086379 B2 JP5086379 B2 JP 5086379B2 JP 2010015996 A JP2010015996 A JP 2010015996A JP 2010015996 A JP2010015996 A JP 2010015996A JP 5086379 B2 JP5086379 B2 JP 5086379B2
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JP
Japan
Prior art keywords
metal
oxide film
heat dissipation
metal substrate
light emitting
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010015996A
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English (en)
Japanese (ja)
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JP2011096996A (ja
Inventor
ホー ヘオ、チョル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of JP2011096996A publication Critical patent/JP2011096996A/ja
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Publication of JP5086379B2 publication Critical patent/JP5086379B2/ja
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2010015996A 2009-10-29 2010-01-27 放熱構造物の製造方法 Expired - Fee Related JP5086379B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0103320 2009-10-29
KR1020090103320A KR101075738B1 (ko) 2009-10-29 2009-10-29 방열 구조물 및 그 제조 방법

Publications (2)

Publication Number Publication Date
JP2011096996A JP2011096996A (ja) 2011-05-12
JP5086379B2 true JP5086379B2 (ja) 2012-11-28

Family

ID=43959073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010015996A Expired - Fee Related JP5086379B2 (ja) 2009-10-29 2010-01-27 放熱構造物の製造方法

Country Status (4)

Country Link
JP (1) JP5086379B2 (zh)
KR (1) KR101075738B1 (zh)
CN (1) CN102054932B (zh)
TW (1) TWI422078B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102176472B1 (ko) * 2014-01-28 2020-11-09 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 발광장치
KR102339683B1 (ko) * 2015-02-16 2021-12-16 주식회사 아모그린텍 무선충전용 방열유닛 및 이를 포함하는 무선전력 충전모듈

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144985A (ja) * 1991-11-18 1993-06-11 Sanyo Electric Co Ltd 混成集積回路装置
JPH07162116A (ja) * 1993-12-01 1995-06-23 Toagosei Co Ltd 金属ベース基板材料およびその製造方法
JPH08125117A (ja) * 1994-10-19 1996-05-17 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法
JP2002299540A (ja) * 2001-04-04 2002-10-11 Hitachi Ltd 半導体装置およびその製造方法
TWI220282B (en) * 2002-05-23 2004-08-11 Viking Technology Corp Package method for enhancing the brightness of LED
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
US8203848B2 (en) * 2005-08-31 2012-06-19 Sanyo Electric Co., Ltd. Circuit device and method of manufacturing the same
KR100647867B1 (ko) * 2005-11-07 2006-11-23 (주)싸이럭스 발광소자와 그 패키지 구조체
JP2007194405A (ja) * 2006-01-19 2007-08-02 Nitto Shinko Kk 熱伝導用エポキシ樹脂組成物
JP2010500779A (ja) * 2006-08-11 2010-01-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー デバイスチップキャリア、モジュールおよびその製造方法
TWM330566U (en) * 2007-08-16 2008-04-11 Litatek Corp Light-emitting device
JP5220373B2 (ja) * 2007-09-25 2013-06-26 三洋電機株式会社 発光モジュール

Also Published As

Publication number Publication date
CN102054932A (zh) 2011-05-11
CN102054932B (zh) 2013-03-20
JP2011096996A (ja) 2011-05-12
KR20110046713A (ko) 2011-05-06
KR101075738B1 (ko) 2011-10-26
TW201115799A (en) 2011-05-01
TWI422078B (zh) 2014-01-01

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