KR101075738B1 - 방열 구조물 및 그 제조 방법 - Google Patents

방열 구조물 및 그 제조 방법 Download PDF

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Publication number
KR101075738B1
KR101075738B1 KR1020090103320A KR20090103320A KR101075738B1 KR 101075738 B1 KR101075738 B1 KR 101075738B1 KR 1020090103320 A KR1020090103320 A KR 1020090103320A KR 20090103320 A KR20090103320 A KR 20090103320A KR 101075738 B1 KR101075738 B1 KR 101075738B1
Authority
KR
South Korea
Prior art keywords
metal
light emitting
metal substrate
front surface
emitting device
Prior art date
Application number
KR1020090103320A
Other languages
English (en)
Korean (ko)
Other versions
KR20110046713A (ko
Inventor
허철호
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020090103320A priority Critical patent/KR101075738B1/ko
Priority to TW99100612A priority patent/TWI422078B/zh
Priority to JP2010015996A priority patent/JP5086379B2/ja
Priority to CN 201010124695 priority patent/CN102054932B/zh
Publication of KR20110046713A publication Critical patent/KR20110046713A/ko
Application granted granted Critical
Publication of KR101075738B1 publication Critical patent/KR101075738B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020090103320A 2009-10-29 2009-10-29 방열 구조물 및 그 제조 방법 KR101075738B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020090103320A KR101075738B1 (ko) 2009-10-29 2009-10-29 방열 구조물 및 그 제조 방법
TW99100612A TWI422078B (zh) 2009-10-29 2010-01-11 熱輻射結構以及製造其之方法
JP2010015996A JP5086379B2 (ja) 2009-10-29 2010-01-27 放熱構造物の製造方法
CN 201010124695 CN102054932B (zh) 2009-10-29 2010-02-08 热辐射结构及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090103320A KR101075738B1 (ko) 2009-10-29 2009-10-29 방열 구조물 및 그 제조 방법

Publications (2)

Publication Number Publication Date
KR20110046713A KR20110046713A (ko) 2011-05-06
KR101075738B1 true KR101075738B1 (ko) 2011-10-26

Family

ID=43959073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090103320A KR101075738B1 (ko) 2009-10-29 2009-10-29 방열 구조물 및 그 제조 방법

Country Status (4)

Country Link
JP (1) JP5086379B2 (zh)
KR (1) KR101075738B1 (zh)
CN (1) CN102054932B (zh)
TW (1) TWI422078B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102176472B1 (ko) * 2014-01-28 2020-11-09 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 발광장치
KR102339683B1 (ko) * 2015-02-16 2021-12-16 주식회사 아모그린텍 무선충전용 방열유닛 및 이를 포함하는 무선전력 충전모듈

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100647867B1 (ko) * 2005-11-07 2006-11-23 (주)싸이럭스 발광소자와 그 패키지 구조체

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144985A (ja) * 1991-11-18 1993-06-11 Sanyo Electric Co Ltd 混成集積回路装置
JPH07162116A (ja) * 1993-12-01 1995-06-23 Toagosei Co Ltd 金属ベース基板材料およびその製造方法
JPH08125117A (ja) * 1994-10-19 1996-05-17 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法
JP2002299540A (ja) * 2001-04-04 2002-10-11 Hitachi Ltd 半導体装置およびその製造方法
TWI220282B (en) * 2002-05-23 2004-08-11 Viking Technology Corp Package method for enhancing the brightness of LED
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
US8203848B2 (en) * 2005-08-31 2012-06-19 Sanyo Electric Co., Ltd. Circuit device and method of manufacturing the same
JP2007194405A (ja) * 2006-01-19 2007-08-02 Nitto Shinko Kk 熱伝導用エポキシ樹脂組成物
JP2010500779A (ja) * 2006-08-11 2010-01-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー デバイスチップキャリア、モジュールおよびその製造方法
TWM330566U (en) * 2007-08-16 2008-04-11 Litatek Corp Light-emitting device
JP5220373B2 (ja) * 2007-09-25 2013-06-26 三洋電機株式会社 発光モジュール

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100647867B1 (ko) * 2005-11-07 2006-11-23 (주)싸이럭스 발광소자와 그 패키지 구조체

Also Published As

Publication number Publication date
CN102054932A (zh) 2011-05-11
CN102054932B (zh) 2013-03-20
JP2011096996A (ja) 2011-05-12
JP5086379B2 (ja) 2012-11-28
KR20110046713A (ko) 2011-05-06
TW201115799A (en) 2011-05-01
TWI422078B (zh) 2014-01-01

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