KR101075738B1 - Radiating structure and method for manufacturing the same - Google Patents

Radiating structure and method for manufacturing the same Download PDF

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Publication number
KR101075738B1
KR101075738B1 KR1020090103320A KR20090103320A KR101075738B1 KR 101075738 B1 KR101075738 B1 KR 101075738B1 KR 1020090103320 A KR1020090103320 A KR 1020090103320A KR 20090103320 A KR20090103320 A KR 20090103320A KR 101075738 B1 KR101075738 B1 KR 101075738B1
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KR
South Korea
Prior art keywords
metal
light emitting
metal substrate
front surface
emitting device
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Application number
KR1020090103320A
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Korean (ko)
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KR20110046713A (en
Inventor
허철호
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삼성전기주식회사
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Priority to KR1020090103320A priority Critical patent/KR101075738B1/en
Priority to TW99100612A priority patent/TWI422078B/en
Priority to JP2010015996A priority patent/JP5086379B2/en
Priority to CN 201010124695 priority patent/CN102054932B/en
Publication of KR20110046713A publication Critical patent/KR20110046713A/en
Application granted granted Critical
Publication of KR101075738B1 publication Critical patent/KR101075738B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention can provide a heat dissipation structure. According to an embodiment of the present invention, a heat dissipation structure includes a metal substrate having a front surface facing the light emitting device, a rear surface opposite to the front surface, and a side surface connecting the front surface and the rear surface, a metal oxide film covering the front surface of the metal substrate, and an adhesive covering the metal oxide film. A film, and a metal pattern formed on the adhesive film.

Heat dissipation substrate, light emitting element, light emitting diode, anodizing, aluminum oxide film,

Description

Heat dissipation structure and its manufacturing method {RADIATING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a heat dissipation structure, and more particularly, to a heat dissipation structure with improved heat dissipation efficiency and a method of manufacturing the heat dissipation structure.

In general, the light emitting device package includes a light emitting device such as a light emitting diode (LED) and a light emitting laser (Light Emitting Laser) to equip a home appliance, a remote control, an electronic board, an indicator, an automation device, and an illumination device. The device is packaged. Recently, as the light emitting device is applied to various fields, a package technology for effectively treating heat generated in the light emitting device during operation of the light emitting device is required. In particular, in the case of a high output light emitting diode applied to a lighting device, power consumption is increased to generate high temperature heat, and therefore, it is required to improve heat radiation efficiency of the light emitting device. Currently, heat dissipation of light emitting diodes is performed by discharging heat generated from light emitting diodes to the outside using a ceramic substrate for mounting the light emitting diodes. However, in this case, the price of the ceramic substrate is high, and the cost of the light emitting device package is increased. In addition, the ceramic substrate has a problem in that heat resistance and wear resistance are relatively low.

The problem to be solved by the present invention is to provide a heat radiation structure with improved heat radiation efficiency.

The problem to be solved by the present invention relates to a method for manufacturing a heat radiation structure with improved heat radiation efficiency.

The heat dissipation structure according to the present invention includes a metal substrate having a front surface facing the light emitting element, a rear surface opposite to the front surface, and a side surface connecting the front surface and the back surface, an oxide film pattern covering the front surface of the metal substrate, and the oxide film pattern. A covering adhesive film, and a metal pattern formed on the adhesive film.

According to an embodiment of the present invention, the metal substrate may be made of aluminum, and the oxide layer pattern may include an aluminum oxide layer.

According to an embodiment of the present invention, the metal pattern is made of copper (Cu) material and may include a circuit wiring electrically connected to the light emitting device.

According to an embodiment of the present invention, the metal oxide layer may be formed by anodizing the metal substrate.

The method of manufacturing a heat dissipation structure according to the present invention comprises the steps of preparing a metal substrate having a front surface facing the light emitting device, a rear surface opposite to the front surface, and a side surface connecting the front surface and the back surface, the front surface of the metal substrate, Forming a metal oxide film covering the back surface and the side surface, forming an adhesive film covering the metal oxide film formed on the front surface, forming a circuit pattern on the adhesive film, and on the back and side surfaces Removing the metal oxide film formed.

According to an embodiment of the present disclosure, preparing the metal substrate may include preparing an aluminum plate, and forming the metal oxide layer may include anodizing the aluminum plate. .

According to an embodiment of the present disclosure, removing the metal oxide film formed on the rear surface and the side surface may include performing a peeling process on the resultant product on which the metal oxide film is formed.

According to an exemplary embodiment of the present disclosure, the forming of the circuit pattern may include performing an etching process on the copper foil before laminating the copper foil on the adhesive film and removing the metal oxide film. It may include.

The heat dissipation structure according to the present invention may include a metal substrate, a thermally conductive oxide film pattern, an adhesive film, and a metal pattern sequentially stacked on the front surface of the metal substrate. When the heat dissipation structure of such a structure is combined with the light emitting device structure, it effectively releases heat generated from the light emitting device structure, the heat dissipation efficiency can be improved.

In the method of manufacturing a heat dissipation structure according to the present invention, a heat dissipation structure including a metal substrate, an oxide film pattern having high thermal conductivity, and an adhesive film, and a metal pattern, which are sequentially stacked on the front surface of the metal substrate, may be manufactured. The heat dissipation structure having the above structure, when combined with the light emitting device structure, effectively emits heat generated from the light emitting device structure. Accordingly, the method for manufacturing a heat dissipation structure according to the present invention can produce a heat dissipation structure with improved heat dissipation efficiency.

In the method of manufacturing the heat dissipation structure according to the present invention, since the metal pattern is formed on the metal substrate while the metal substrate is covered with the metal oxide film, the metal substrate may be prevented from being damaged during the process of forming the metal pattern. .

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The embodiments may be provided to make the disclosure of the present invention complete, and to fully inform the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout the specification.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, 'comprise' and / or 'comprising' refers to a component, step, operation and / or element that is mentioned in the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Hereinafter, a method of manufacturing a light emitting device package according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a heat radiation structure according to an embodiment of the present invention. Referring to FIG. 1, the heat radiation structure 110 according to the embodiment of the present invention may include a metal substrate 112, an adhesive layer 114, and a metal pattern 116a. The metal substrate 112 may have a front surface 112a, a rear surface 112b opposite to the front surface 112a, and a side surface 112c connecting the front surface 112a and the rear surface 112b. have. The front surface 112a may be a surface facing the light emitting device structure when the heat dissipation structure 110 is coupled to a light emitting device structure (not shown). The metal substrate 112 may be a plate made of a metal material having high thermal conductivity. As an example, the metal substrate 112 may be an aluminum (Al) substrate. In addition, the metal substrate 112 may include an oxide layer pattern 113a. The oxide layer pattern 113a may be formed to be limited to the front surface 112a of the metal substrate 112. The oxide layer pattern 113a may be formed by anodizing the metal substrate 112. Therefore, when the metal substrate 112 is an aluminum plate, the oxide layer pattern 113a may be formed of aluminum oxide (Al 2 O 3 ).

The adhesive layer 114 may be interposed between the metal substrate 112 and the metal pattern 116a. The adhesive layer 114 may be made of a predetermined insulating adhesive material, it may be preferable to have a high thermal conductivity. The adhesive layer 114 may fix the metal pattern 116a on the metal substrate 112 and may effectively transfer heat from the metal pattern 116a to the metal substrate 112. Meanwhile, the adhesive film 114 may further include a pre-preg layer.

The metal pattern 116a may be formed to cover the adhesive layer 114. The metal pattern 116a may be formed of a metal material having high thermal conductivity. As an example, the metal pattern 116a may be formed of copper (Cu). The metal pattern 116a may be used as a heat carrier for effectively transferring heat emitted from the light emitting device to the metal substrate 112 and may be used as a circuit line electrically connected to the light emitting device. .

Meanwhile, in the present embodiment, the case where the oxide film pattern 113a is formed by being limited to the front surface 112a of the metal substrate 112 is described as an example. However, the oxide film pattern 113a is formed on the metal substrate 112. The part may be variously changed and modified. For example, the oxide layer pattern 113a of the metal substrate 112 may be formed to cover at least one surface of the rear surface 112b and the side surface 112c as well as the front surface 112a.

2 is a flowchart illustrating a method of manufacturing a heat dissipation substrate according to an exemplary embodiment of the present invention, and FIGS. 3A to 3D are views for explaining a process of manufacturing a heat dissipation substrate according to an exemplary embodiment of the present invention.

2 and 3A, the metal substrate 112 may be prepared (S110). For example, the preparing of the metal substrate 112 may include a front surface 112a and a rear surface 112b opposite to the front surface 112a and a side surface 112c connecting the front surface 112a and the rear surface 112b. It may include the step of preparing an aluminum substrate having a.

A metal oxide layer 113 may be formed to cover all surfaces 112a, 112b, and 112c of the metal substrate 112 (S120). For example, the forming of the metal oxide layer 113 may be performed by performing an anodizing treatment on the metal substrate 112. The anodizing treatment may be one of electrochemical metal oxidation methods for forming a stable oxide film on the surface of the metal substrate 112. When the metal substrate 112 is an aluminum substrate, the metal of the aluminum oxide film covering the front surface 112a, the rear surface 112b and the side surface 112c of the metal substrate 112 by the anodizing treatment. An oxide film 113 may be formed. The metal oxide layer 113 may prevent the metal substrate 112 from being rusted, and may improve wear resistance, heat resistance, and adhesion of the metal substrate 112.

2 and 3B, the adhesive film 114 and the metal film 116 may be sequentially formed on the metal substrate 112 (S130). For example, an adhesive layer 114 having high thermal conductivity may be formed on the front surface 112a of the metal substrate 112. As the adhesive layer 114, a fluororesin-based adhesive such as teflon may be used. In addition, the metal layer 116 may be formed on the adhesive layer 114. For example, the forming of the metal film 116 may be performed by laminating a copper foil including copper (Cu) on the adhesive film 114. In the process of attaching the metal film 116 to the adhesive film 114, a predetermined pressure may be applied to prevent the metal film 116 from being separated from the adhesive film 114.

2 and 3C, a metal pattern 116a may be formed on the metal substrate 112 (S140). For example, the forming of the metal pattern 116a may be performed by performing a predetermined etching process on the metal film 116 of FIG. 3B. As an example, the etching process may include a photoresist etching process. As another example, the etching process may include a process of processing the metal film 116 by laser or drill. The metal pattern 116a formed through the above method is used as a circuit wiring for transmitting an electrical signal to a light emitting device (not shown), and also transfers heat generated from the light emitting device to the metal substrate 112. May be used as a heat carrier.

Meanwhile, in the process of forming the metal pattern 116a, damage to the metal substrate 112 may be prevented by the metal oxide layer 113. More specifically, when the metal pattern 116a is formed by the same method as the photoresist etching process, since the metal substrate 112 is affected by the etching process, the metal substrate 112 is corroded and unnecessary. Damage such as etching may occur. To prevent this, the metal oxide layer 113 covers not only the front side 112a of the metal substrate 112 but also the back side 112b and the side surfaces 112c to protect the metal substrate 112 from the etching process environment. As a result, damage to the metal substrate 112 may be prevented in the etching process.

2 and 3D, the metal oxide layer 113 of FIG. 3C may be removed on the surfaces 112b and 112c except for the front surface 112a of the metal substrate 112 (S150). For example, the process of removing the metal oxide layer 113 may be performed by performing a predetermined peeling process on the resultant product on which the metal pattern 116a is formed. In this case, the metal oxide layer 113 formed on the front surface 112a of the metal substrate 112 may be prevented from being peeled off by the adhesive layer 114 and the metal pattern 116a. Accordingly, the peeling process may selectively peel off the metal oxide film 113 formed on the back surface 112b and the side surface 112c of the metal substrate 112. As a result, an oxide layer pattern 113a may be formed on the metal substrate 112 to cover the front surface 112a.

Meanwhile, in the exemplary embodiment of the present invention, the case in which the metal oxide layer 113 covering the rear surface 112b and the side surface 112c of the metal substrate 112 is removed is described as an example, but the portion in which the metal oxide layer 113 is removed is removed. May be variously changed and modified. In addition, the manufacturing of the heat dissipation structure 110 illustrated in FIG. 1 may be completed without removing the metal oxide layer 113. In this case, the finally manufactured heat dissipation structure 110 may include a metal oxide layer 113 covering all of the front surface 112a, the rear surface 112b, and the side surface 112c of the metal substrate 112. .

The heat dissipation structure 110 according to the embodiment of the present invention may have a structure in which the metal substrate 112 having high thermal conductivity, the oxide film pattern 113a, and the metal pattern 116a are sequentially stacked. Since the heat transfer efficiency of the heat dissipation structure 110 of the structure from the metal pattern 116a to the metal substrate 112 is increased, the heat dissipation efficiency of the heat dissipation structure 110 may be improved.

In addition, according to an embodiment of the present invention, the metal pattern 116a is formed on the metal substrate 112 in a state in which all surfaces 112a, 112b, and 112c of the metal substrate 112 are covered with the metal oxide film 113. Since the etching process is performed, the metal substrate 112 may be protected from the etching process environment when the metal pattern 116a is formed. Accordingly, the method of manufacturing the heat dissipation structure according to the present invention may prevent damage to the metal substrate in the process of forming the metal pattern 116a.

Hereinafter, an example of the light emitting device package 100 including the heat dissipation structure 110 according to the above-described embodiment of the present invention will be described. Here, the overlapping contents for the heat dissipation structure 110 described above may be omitted or simplified.

4 is a view showing a light emitting device package having a heat radiation substrate according to an embodiment of the present invention. Referring to FIG. 4, the light emitting device package 100 may be manufactured by coupling the heat radiation structure 110 described above with reference to FIG. 1 to a predetermined light emitting device structure 120. The light emitting device structure 120 may be coupled to the metal pattern 116a formed on the front surface 112a of the metal substrate 112. The light emitting device structure 120 may include a light emitting device 122, a lead frame 124, and a molding film 126. The light emitting device 122 may be at least one of a light emitting diode and a laser diode. As an example, the light emitting element 112 may be a light emitting diode. The lead frame 124 may be electrically connected to the light emitting device 122 and the metal pattern 116a, respectively. The lead frame 124 may transmit an electrical signal between the light emitting device 122 and the metal pattern 116a. The molding layer 126 may cover the light emitting device 122 to protect the light emitting device 122 from an external environment.

The light emitting device package 100 has heat (H) generated from the light emitting device 122 transferred to the metal substrate 112 by the metal pattern 116a of the heat dissipation structure 110, and then the metal substrate ( It may have a structure in which the heat (H) is discharged from the 112 to the outside. Accordingly, the light emitting device package 100 having the heat dissipation structure 110 according to the embodiment of the present invention may improve heat dissipation efficiency.

The foregoing detailed description illustrates the present invention. It is also to be understood that the foregoing is illustrative and explanatory of preferred embodiments of the invention only, and that the invention may be used in various other combinations, modifications and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The foregoing embodiments are intended to illustrate the best mode contemplated for carrying out the invention and are not intended to limit the scope of the present invention to other modes of operation known in the art for utilizing other inventions such as the present invention, Various changes are possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. In addition, the appended claims should be construed as including steps in other embodiments.

1 is a view showing a heat radiation substrate according to an embodiment of the present invention.

2 is a flowchart illustrating a method of manufacturing a heat dissipation substrate according to an exemplary embodiment of the present invention.

3A to 3D are views for explaining a manufacturing process of a heat radiation substrate according to an embodiment of the present invention.

4 is a view showing a light emitting device package having a heat radiation substrate according to an embodiment of the present invention.

Description of the Related Art [0002]

100: light emitting device package

110: heat dissipation structure

112: metal substrate

112a: front

112b: back side

112c: side

113: metal oxide film

113a: oxide film pattern

114: adhesive film

116: metal film

116a: Metal Pattern

Claims (8)

delete delete delete delete In the method of manufacturing a heat dissipation structure for dissipating heat generated from the light emitting device, Preparing a metal substrate having a front surface opposite to the light emitting device, a rear surface opposite to the front surface, and a side surface connecting the front surface and the back surface; Forming a metal oxide film covering the front surface, the rear surface and the side surface of the metal substrate; Forming an adhesive film covering the metal oxide film formed on the front surface; Forming a metal pattern on the adhesive film; And And removing the metal oxide film formed on the rear surface and the side surface by performing a peeling process on the resultant product on which the metal oxide film is formed. The method of claim 5, Preparing the metal substrate includes preparing an aluminum plate, The forming of the metal oxide layer may include anodizing the aluminum plate. delete The method of claim 5, Forming the metal pattern is: Laminating the copper foil on the adhesive film; And And performing an etching process on the copper foil before removing the metal oxide film.
KR1020090103320A 2009-10-29 2009-10-29 Radiating structure and method for manufacturing the same KR101075738B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020090103320A KR101075738B1 (en) 2009-10-29 2009-10-29 Radiating structure and method for manufacturing the same
TW99100612A TWI422078B (en) 2009-10-29 2010-01-11 Heat radiating structure and method for manufacturing the same
JP2010015996A JP5086379B2 (en) 2009-10-29 2010-01-27 Manufacturing method of heat dissipation structure
CN 201010124695 CN102054932B (en) 2009-10-29 2010-02-08 Thermoradiation structure and manufacturing method thereof

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Application Number Priority Date Filing Date Title
KR1020090103320A KR101075738B1 (en) 2009-10-29 2009-10-29 Radiating structure and method for manufacturing the same

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KR20110046713A KR20110046713A (en) 2011-05-06
KR101075738B1 true KR101075738B1 (en) 2011-10-26

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KR (1) KR101075738B1 (en)
CN (1) CN102054932B (en)
TW (1) TWI422078B (en)

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KR102176472B1 (en) * 2014-01-28 2020-11-09 엘지이노텍 주식회사 PRINTED CIRCUIT BOARD AND luminous device INCLUDING THE SAME
KR102339683B1 (en) * 2015-02-16 2021-12-16 주식회사 아모그린텍 Heat radiation unit for a wireless charging and wireless charging module having the same

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Also Published As

Publication number Publication date
CN102054932A (en) 2011-05-11
JP5086379B2 (en) 2012-11-28
KR20110046713A (en) 2011-05-06
TWI422078B (en) 2014-01-01
CN102054932B (en) 2013-03-20
TW201115799A (en) 2011-05-01
JP2011096996A (en) 2011-05-12

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