KR101186646B1

KR101186646B1 - Light emitting diode

Info

Publication number: KR101186646B1
Application number: KR1020040061704A
Authority: KR
Inventors: 김도형
Original assignee: 서울반도체 주식회사
Priority date: 2004-08-05
Filing date: 2004-08-05
Publication date: 2012-09-28
Also published as: KR20060012966A

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode, and more particularly, to a light emitting diode comprising a substrate made of a thermally conductive and / or electrically conductive material, an electrode pattern formed on the substrate, and a chip mounted on the electrode. It is characterized in that the heat sink that emits heat generated from. Here, the heat sink is made of a metal or a thermally conductive resin.

Therefore, the heat of the light emitting chip can be discharged to the outside without using a separate circuit board and slug, and a heat sink having excellent thermal conductivity and electrical conductivity is used as the second electrode to make contact with external electrical terminals wide. The heat sink in which the reflecting cup is formed may be used to effectively emit heat generated by the light emitting chip to the outside, and the brightness of the light may be improved.

LED, heat sink, heat generation, insulation film, electrode, light emitting chip

Description

Light emitting diodes

1 to 5 are cross-sectional views of light emitting diodes according to the present invention.

6 is a conceptual diagram illustrating a method of manufacturing a light emitting diode according to the present invention.

10: heat sink 15: reflection cup

20 light emitting chip 30 insulating film

40, 45: electrode 50, 55: wire

60: molding part 70: fixing hole

80, 85: metal wiring

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to light emitting diodes and, more particularly, to light emitting diodes using heat sinks on which electrodes are printed.

Generally, a light emitting diode refers to a device that receives an electrical signal and outputs the light as light. The light emitting diode is mounted on a printed circuit board on which an electrode receiving the electrical signal is formed, and then a molding part is formed to encapsulate the light emitting chip. To prepare.

The brightness of the light emitting diode described above is proportional to the current applied to the light emitting chip, and the current applied to the light emitting chip is proportional to the heat emitted by the light emitting chip. In order to brighten the brightness of the light emitting diode, a high current must be applied, but the light emitting chip is damaged due to heat emitted from the light emitting chip, thereby causing a problem in that a high current cannot be applied indefinitely. That is, when the current applied to the light emitting chip is increased, the heat emitted by the light emitting chip is increased.

Accordingly, in the conventional light emitting diode described above, there is no element capable of effectively dissipating heat emitted by the light emitting chip to the outside.

Accordingly, many studies have been conducted to reduce the heat emitted by the light emitting chip. As a result, Korean Patent Laid-Open Publication No. 2002-0089785 reduces the heat emitted by the light emitting chip by drilling a predetermined heat dissipation hole, and Korean Patent Laid-Open Publication No. 2003-0053853 surrounds the LED element with a predetermined metal plate and uses it as a heat sink. The device is designed to reduce the heat dissipated.

As described above, the heat dissipation of the light emitting chip through the predetermined heat dissipation hole and the metal plate can be emitted to the outside to protect the light emitting chip and improve the brightness of the light emitting diode. In the case of drilling, external impurities may be added due to the heat radiation holes to damage not only the light emitting chip but the entire light emitting diode.

In addition, since the molding part uses an epoxy resin and the metal plate uses a metal, when a separate metal plate is added to the device, a predetermined air layer is formed on the interface between the metal and the epoxy resin when the metal part and the molding plate encapsulating the light emitting chip are combined. Problems arise from the formation or bonding of two materials, which complicates the manufacturing process of light emitting diodes.

Accordingly, the present invention provides a light emitting diode capable of effectively dissipating heat from the light emitting chip by using a heat sink having excellent thermal conductivity as a lower substrate in order to solve the above problems.

A light emitting diode according to the present invention includes a substrate made of a thermally conductive material; An electrode pattern formed on the substrate in an insulated state from the substrate; A light emitting chip mounted on the electrode pattern; The light emitting chip may be disposed on the substrate to cover the light emitting chip, and may include a molding part having an optical lens shape and having a plurality of legs formed at the bottom thereof to be coupled to the substrate.
The substrate may be a heat sink that emits heat generated from the light emitting chip. The heat sink may be resin of a metal or a thermally conductive material. The mounting portion of the substrate on which the light emitting chip is mounted may be recessed with respect to the reference plane to form a reflecting portion.

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Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Wherein like reference numerals refer to like elements throughout.

1 to 5, a light emitting diode according to the present invention includes a heat sink 10 having a thermal conductivity, a light emitting chip 20 mounted on the heat sink 10, and an electrode formed on the heat sink 10. 40 and 45 and a molding unit 60 for encapsulating the light emitting chip 20. In addition, the light emitting chip 20 may further include predetermined wires 50 and 55 that electrically connect the electrodes 40 and 45. In addition, a predetermined phosphor (not shown) for absorbing light emitted from the light emitting chip 20 to change the wavelength may be further included on the light emitting chip 20. The light emitting chip 20 may further include a predetermined paste (not shown) for mounting.

As the heat sink 10, an electrically conductive metal material may be used. In addition, the heat sink 10 in which the predetermined reflection cup 15 is formed may be used. In addition, a predetermined insulating film 30 may be formed to insulate the heat sink 10 from the electrodes 40 and 45. The molding part 60 may be formed in at least one of an optical lens shape, a flat plate shape, and a shape having predetermined irregularities on the surface.

The light emitting diode of the present invention is possible in various embodiments. Hereinafter, various forms of embodiments will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1 of the present invention, the light emitting diode includes a heat sink 10 having a heat conductive and electrical conductivity having a reflecting cup 15, a light emitting chip 20 mounted inside the reflecting cup 15, The insulating layer 30 is formed on a predetermined region of the heat sink 10, and the molding unit 60 encapsulating the first electrode 40 and the light emitting chip 20 formed on the insulating layer 30.

The apparatus further includes a wire 50 electrically connecting the first electrode 40 and the light emitting chip 20 to each other. In addition, a first metal wire (not shown) connecting the first electrode 40 and an external first current input terminal (not shown), and a heat sink 10 and an external second current input terminal (not shown) are connected. A second metal wire (not shown) may be further included. In addition, a predetermined phosphor (not shown) for emitting light of a target color may be further included in a region where the light emitting chip 20 is formed in the reflection cup 15.

It is preferable that the light emitting chip 20 is mounted on the lower surface of the reflective cup 15 using silver paste (not shown). As a result, the light emitting chip 20 and the heat sink 10 are electrically connected to each other. The insulating film 30 is formed for insulation between the electrically conductive heat sink 10 and the first electrode 40. The insulating film 30 is preferably formed to have the same size as the first electrode 40 or wider than the first electrode 40. The first electrode 40 may be formed of a metal material including copper or aluminum having excellent conductivity. The insulating film 30 and the first electrode 40 may be formed through a printing technique. Or it can form using an adhesive agent. The molding part 60 may be formed through an injection process using a predetermined epoxy resin. In addition, after manufacturing using a separate manufacturing frame, it can be molded by pressing or heat-treating the light emitting chip 20. Preferably, a predetermined region of the first electrode 45 is exposed to the outside of the molding part 60.

This allows the heat of the light emitting chip to be discharged to the outside without using a separate circuit board and slug. In addition, a heat sink can be used instead of the second electrode to widen the contact with the external electrical terminals.

As shown in FIG. 2 of the present invention, the light emitting diode includes a heat conductive heat sink 10 having a reflection cup 15, an insulating film 30 formed in a predetermined region of the heat sink 10, and an upper portion of the insulating film 30. A first electrode 40 formed on the second electrode 45, electrically disconnected from the first electrode 40, and a second electrode 45 formed on the heat sink 10 and the reflection cup 15. The light emitting chip 20 electrically mounted on the second electrode 45 therein and a molding part 60 encapsulating the light emitting chip 20 are included.

In addition, a first metal wire connecting the wire 50 for electrically connecting the first electrode 40 and the light emitting chip 20 to the first electrode 40 and an external first current input terminal (not shown). A second metal wire (not shown) connecting the second electrode 45 and the external second current input terminal (not shown) may be further included. In addition, the light emitting chip 20 may further include a predetermined phosphor (not shown) for emitting light of a target color.

It is preferable to use a material having excellent thermal conductivity as the heat sink 10. As the material having excellent thermal conductivity, a metal material having excellent electrical conductivity and non-conductivity may be used, or a resin including a thermal conductive material may be used. The insulating film 30 and the first and second electrodes 40 and 45 may be formed through a printing technique. Or it can form using an adhesive agent. It can be formed through various process sequences. That is, after the insulating film 30 is formed in a predetermined region of the heat sink 10, the first electrode 40 is formed on the upper portion of the heat sink 10, and the second electrode 45 is formed in the predetermined region including the reflective cup 15. Can be formed. Alternatively, the insulating film 30 is formed on the heat sink 10, and then the insulating film 30 in the region where the reflective cup 15 and the second electrode 45 are to be formed is removed. Thereafter, the second electrode 45 may be formed in the region where the insulating layer 30 is removed, and the first electrode 40 may be formed in the region where the insulating layer 30 remains.

It is effective to form the first electrode 40 and the second electrode 45 with a metallic material including copper or aluminum having excellent conductivity. The second electrode 45 formed in the reflective cup 15 region is preferably formed so as not to interfere with the reflection of light due to the reflective cup 15. That is, it is effective to form a line on the lower predetermined region and one side wall of the reflective cup 15.

The light emitting chip 20 is mounted on the lower portion of the reflective cup 10 on which the second electrode 45 is formed by using a silver paste, but is preferably in electrical contact with the second electrode 45. The molding part 60 may be formed through an injection process using a predetermined epoxy resin. In addition, after manufacturing using a separate manufacturing frame, it can be molded by pressing or heat-treating the light emitting chip 20. Preferably, predetermined regions of the first and second electrodes 40 and 45 are exposed to the molding unit 60.

Thus, the heat sink 10 of the present invention can apply an external current to the light emitting chip through the second electrode 45 without using a thermally conductive material without using a separate printed circuit board and slug, and without losing power. .

As shown in FIG. 3 of the present invention, the light emitting diode includes a heat conductive heat sink 10 having a reflection cup 15 formed therein, a light emitting chip 20 mounted inside the reflection cup 15, and a reflection cup 15. ), An insulating film 30 formed on the heat sink 10 except for the region, an electrode 40 and 45 formed on the insulating film 30, and a molding part 60 encapsulating the light emitting chip 20. .

In addition, the electrodes 40 and 45 are formed of first and second electrodes 40 and 45 respectively connected to the negative and positive terminals of the light emitting chip 20, but the two electrodes are preferably formed to be electrically disconnected. Do. The apparatus may further include first and second wires 50 and 55 for electrically connecting the first and second electrodes 40 and 45 to the light emitting chip 20. In addition, the first metal wire (not shown) connecting the first electrode 40 and the external first current input terminal (not shown), the second electrode 45 and the external second current input terminal (not shown) It may further include a second metal wiring (not shown) for connecting. In addition, the light emitting chip 20 may further include a predetermined phosphor (not shown) for emitting light of a target color.

It is preferable to use a material having excellent thermal conductivity and electrical conductivity as the heat sink 10. In this embodiment, it is most preferable to use a metal material as the heat sink 10. The insulating film 10 and the first and second electrodes 40 and 45 may be formed through a printing technique. Or it can form using an adhesive agent. It can be formed through various process sequences. That is, after the insulating film 30 is formed on the heat sink 10, the first and second electrodes 40 and 45 are formed on the insulating film 30. It is effective that the insulating film 30 is formed on the entire structure except the reflective cup 15 of the heat sink 10. The first and second electrodes 40 and 45 are formed of a metal material including copper or aluminum having excellent conductivity.

The light emitting chip 20 may be mounted on the lower portion of the reflective cup 15 using silver paste. The molding part 60 may be formed through an injection process using a predetermined epoxy resin. In addition, after manufacturing using a separate manufacturing frame, it can be molded by pressing or heat-treating the light emitting chip 20. Preferably, predetermined regions of the first and second electrodes 40 and 45 are exposed to the molding unit 60.

As a result, the reflection of the light due to the reflective cup 15 may be maximized, and heat emission of the light emitting chip 20 may be effectively controlled.

As shown in FIG. 4 of the present invention, the light emitting diode includes a heat conductive heat sink 10, a light emitting chip 20 mounted on the heat sink 10, and a region in which the light emitting chip 20 is mounted. An insulating film 30 formed on the heat sink 10, electrodes 40 and 45 formed on the insulating film 30, and a molding part 60 encapsulating the light emitting chip 20.

The heat sink 10 may further include a reflector (not shown) for improving the brightness of the light of the light emitting chip 20. In addition, the electrodes 40 and 45 are preferably composed of first and second electrodes 40 and 45 for connecting to the positive terminal and the negative terminal of the light emitting chip 10. In addition, the electronic device may further include first and second wires 50 and 55 for electrically connecting the first and second electrodes 40 and 45 to the light emitting chip 10. In addition, the first metal wire (not shown) connecting the first electrode 40 and the external first current input terminal (not shown), the second electrode 45 and the external second current input terminal (not shown) It may further include a second metal wiring (not shown) for connecting. In addition, the light emitting chip 20 may further include a predetermined phosphor (not shown) for emitting light of a target color.

It is preferable to use a material having excellent thermal conductivity and electrical conductivity as the heat sink 10. In this embodiment, it is most preferable to use a metal material as the heat sink 10. In addition, a resin including a thermally conductive material may be used as the heat sink 10.

The insulating film 30 and the first and second electrodes 40 and 45 may be formed through a printing technique. Or it can form using an adhesive agent. It can be formed through various process sequences. That is, after the insulating film 30 is formed on the heat sink 10, the first and second electrodes 40 and 45 are formed on the insulating film 30. An insulating film 30 is formed on the heat sink 10 except for the mounting region of the light emitting chip 20. This may be formed by forming the insulating film 30 on the heat sink 10 and then removing the insulating film 30 in the mounting region of the light emitting chip 10. Thereafter, it is preferable to form the first and second electrodes 40 and 45 on the insulating film 30 by a printing method or a metal wiring forming method. The first and second electrodes 40 and 45 may be formed of a metal material including copper or aluminum having excellent conductivity, and the first and second electrodes 40 and 45 may be electrically disconnected.

The light emitting chip 20 may be mounted on the lower portion of the reflective cup 15 using silver paste. The molding part 60 may be formed through an injection process using a predetermined epoxy resin. In addition, after manufacturing using a separate production frame, it can be molded by pressing or heat-treating the light emitting chip. Preferably, predetermined regions of the first and second electrodes 40 and 45 are exposed to the molding unit 60.

As a result, the heat of the light emitting chip 20 can be effectively released using the heat sink 10, and the stress of the heat sink can be reduced.

As shown in FIG. 5 of the present invention, the light emitting diode includes an insulating film formed in a predetermined region of the heat sink 10 including the heat conductive heat sink 10 having the reflection cup 15 and a part of the reflection cup 15. 30, a first electrode 40 formed on the insulating film 30, and a second electrode electrically disconnected from the first electrode 40 and formed in the reflection cup 15 and on the heat sink 10. 45, a light emitting chip 20 electrically mounted on the second electrode 45 inside the reflective cup 15, and a molding part 60 encapsulating the light emitting chip 20.

In addition, a first metal wire connecting the wire 50 for electrically connecting the first electrode 40 and the light emitting chip 20 to the first electrode 40 and an external first current input terminal (not shown). A second metal wire (not shown) connecting the second electrode 45 and the external second current input terminal may be further included. In addition, the light emitting chip 20 may further include a predetermined phosphor (not shown) for emitting light of a target color.

It is preferable to use a material having excellent thermal conductivity as the heat sink 10. As the material having excellent thermal conductivity, a metal material having excellent electrical conductivity and non-conductivity may be used, or a resin including a thermal conductive material may be used. The insulating film 30 and the first and second electrodes 40 and 45 may be formed through a printing technique. Or it can form using an adhesive agent. It can be formed through various process sequences. It is effective to form the first electrode 40 and the second electrode 45 with a metallic material including copper or aluminum having excellent conductivity. The first and second electrodes 40 and 45 formed in the reflective cup 15 region are preferably formed so as not to interfere with the reflection of light due to the reflective cup 15. That is, it is effective to form each of the lines in the lower predetermined region and one side wall of the reflective cup 15.

The light emitting chip 20 is mounted on the lower portion of the reflective cup 15 on which the second electrode 45 is formed by using a silver paste, but is preferably in electrical contact with the second electrode 45. The molding part 60 may be formed in a shape in which an optical lens is formed on a plane, and may be formed through an injection process using a predetermined epoxy resin. In addition, after manufacturing using a separate production frame, it can be molded by pressing or heat-treating the light emitting chip. Preferably, predetermined regions of the first and second electrodes 40 and 45 are exposed to the molding unit 60. As described above, the shape of the molding part 60 may be variously formed. That is, it can be formed in at least one of an optical lens shape, a flat plate shape, and a shape having predetermined irregularities on the surface.

Each embodiment described above is not limited to each single embodiment, but may be used in combination with each other.

Referring to FIG. 6, a step of providing a heat sink 10 having predetermined fixing holes 70, a reflection cup 15, and an insulating film on the heat sink 10 except for the region of the reflection cup 15 is provided. Forming the 30, forming the first and second electrodes 40 and 45 around the reflective cup 15, and mounting the light emitting chip 20 inside the reflective cup 15. , Forming the molding part 60.

The reflective cup 15 region is formed at the center of the heat sink 10 through a physical processing process, and a fixing hole 70 for fixing the substrate of the heat sink 10 is formed at the outer surface of the heat sink 10. . The insulating film 30 and the first and second electrodes 40 and 45 are formed using the printing method. It is preferable to form the insulating film 30 on the heat sink 10 except for the reflective cup 15 region. In addition, it is preferable to form the first and second electrodes 40 and 45 in the form of a thin plate around the reflective cup 15, so that the two electrodes are electrically disconnected. In this case, the first and second metal wires 80 and 85 to be connected to an external power supply terminal may be formed on the outer surface of the heat sink 10. In the present embodiment, the insulating film 30, the first and second electrodes 40 and 45 may be formed, and then the reflective cup 15 and the fixing hole 70 may be formed.

The light emitting chip 20 is mounted inside the reflective cup 15 using silver paste. Thereafter, the wire bonding process is performed to electrically connect the first and second electrodes 40 and 45 to the light emitting chip 20. It is preferable to form the molding part 60 through a predetermined injection process.

As described above, the present invention can form the light emitting diode on the heat sink to emit heat of the light emitting chip to the outside without using a separate circuit board and slug.

In addition, a heat sink excellent in thermal conductivity and electrical conductivity can be used as the second electrode to widen contact with external electrical terminals.

In addition, the heat sink in which the reflective cup is formed may be used to effectively emit heat generated by the light emitting chip to the outside, thereby improving brightness of light.

Claims

A thermally conductive substrate;

An electrode pattern formed on the substrate in an insulated state from the substrate;

A light emitting chip mounted on the electrode pattern;

A molding part disposed on the substrate to cover the light emitting chip and having a shape of an optical lens and having a plurality of legs formed at a lower portion thereof coupled to the substrate;

A phosphor positioned on the light emitting chip to change light by absorbing light emitted from the light emitting chip; And

A light emitting diode formed on the upper surface of the substrate and including first and second metal wires connected to an external power supply terminal.

The method of claim 1,

The substrate is a light emitting diode, characterized in that the heat sink that emits heat generated from the light emitting chip.

The method of claim 2,

The heat sink is a light emitting diode, characterized in that the resin of metal or thermally conductive material.

4. The method according to any one of claims 1 to 3,

And a mounting portion of the substrate on which the light emitting chip is mounted is recessed with respect to a reference plane to form a reflecting portion.

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