CN102054932A - Thermoradiation structure and manufacturing method thereof - Google Patents
Thermoradiation structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN102054932A CN102054932A CN 201010124695 CN201010124695A CN102054932A CN 102054932 A CN102054932 A CN 102054932A CN 201010124695 CN201010124695 CN 201010124695 CN 201010124695 A CN201010124695 A CN 201010124695A CN 102054932 A CN102054932 A CN 102054932A
- Authority
- CN
- China
- Prior art keywords
- oxide film
- metallic substrates
- front surface
- thermal radiation
- luminescent device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a thermoradiation structure and a manufacturing method thereof, wherein the thermoradiation structure comprises a metal substrate, an oxide film pattern, an adhesive film and a metal pattern formed on the adhesive film. The metal substrate is equipped with a front surface facing a light emitting device, a rear surface opposite to the front surface and a side surface connecting the front surface with the rear surface. The oxide film pattern covers the front surface of the metal substrate and the adhesive film covers the oxide film pattern.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
The application requires the priority to 10-2009-0103320 number korean patent application of Korea S Department of Intellectual Property submission on October 29th, 2009, and its full content is incorporated into this by quoting as proof.
Technical field
The present invention relates to a kind of thermal radiation arrangement, more specifically, relate to a kind of thermal radiation arrangement that improves radiation efficiency, and the method that is used to make this thermal radiation arrangement.
Background technology
Usually, the luminescent device encapsulation is to form by the luminescent device that encapsulates such as light-emitting diode (LED) and generating laser, to provide luminescent device in home appliance, remote controller, electronic display, indicating device, automation equipment and lighting apparatus etc.Recently, because luminescent device has been applied to every field, the encapsulation technology that the luminescent device duration of work is effectively handled by the heat of luminescent device generation has become necessary.Particularly, LED is applied under the situation of lighting apparatus in height output, because along with the increase of power consumption can produce elevated temperature heat, so need to improve the radiation efficiency of luminescent device.At present, the thermal radiation of LED is handled, and is by being finished by the heat that LED produces to extraneous radiation in order to the ceramic bases that LED is installed.But, in this case, because the ceramic bases fancy price has increased the cost that light-emitting component encapsulates.In addition, ceramic bases has relatively low thermal endurance and resistance to wear, and this also becomes a problem.
Summary of the invention
For addressing the above problem the present invention has been proposed.Therefore, an object of the present invention is to provide a kind of thermal radiation arrangement with radiation efficiency of raising.
In addition, another object of the present invention provides the method for thermal radiation arrangement that a kind of manufacturing has the radiation efficiency of raising.
For achieving the above object, according to an aspect of the present invention, the invention provides a kind of thermal radiation arrangement, comprising: metallic substrates has the front surface in the face of luminescent device, the rear surface relative with front surface and the side surface that connects front surface and rear surface; Oxide film pattern, the front surface of covering metallic substrates; Tacky film, the capping oxidation film figure; And metal pattern, be formed on the tacky film.
According to embodiments of the invention, metallic substrates can be made by aluminum, and oxide film pattern can comprise pellumina.
According to embodiments of the invention, metal pattern can be made by copper (Cu) material, and can comprise the circuit that is electrically connected to luminescent device.
According to embodiments of the invention, oxide film pattern can form by metallic substrates is carried out anodic oxidation.
For achieving the above object, according to a further aspect in the invention, the invention provides a kind of method of making this thermal radiation arrangement, may further comprise the steps: preparation metallic substrates, this metallic substrates have the front surface in the face of luminescent device, the rear surface relative with front surface and the side surface that connects front surface and rear surface; Form metal oxide film, cover front surface, rear surface and the side surface of metallic substrates; Form tacky film, cover the metal oxide film that is formed on the front surface; And on tacky film, form metal pattern; The metal oxide film that removal forms on rear surface and side surface.
According to embodiments of the invention, the step of preparation metallic substrates can comprise the step for preparing aluminium sheet, and the step that forms metal oxide film can comprise carries out anodised step to aluminium sheet.
According to embodiments of the invention, remove the step that is formed on the metal oxide film on rear surface and the side surface and can be included in the step of carrying out the layering processing on the generating structure that wherein is formed with metal oxide film.
According to embodiments of the invention, the step that forms metal pattern can comprise: lamination Copper Foil on tacky film; And before the step of removing metal oxide film, Copper Foil is carried out etch processes.
Description of drawings
In conjunction with the drawings embodiment is carried out following description, these and/or other aspect and the advantage thereof of the inventive concept that the present invention is total will become apparent and be more readily understood:
Fig. 1 is the diagrammatic sketch according to the thermal radiation arrangement of the embodiment of the invention;
Fig. 2 is the flow chart of making according to the method for the thermal radiation arrangement of the embodiment of the invention;
Fig. 3 a to Fig. 3 d is the diagrammatic sketch of description according to the manufacturing process of the thermal radiation arrangement of the embodiment of the invention;
Fig. 4 shows the diagrammatic sketch that has according to the luminescent device encapsulation of the thermal radiation arrangement of the embodiment of the invention.
Embodiment
With reference to the following embodiment that is described with reference to the accompanying drawings, advantage of the present invention and characteristics and the method for these advantages and characteristics that realizes can become apparent.Yet, the invention is not restricted to following embodiment, and can realize with other various forms.These embodiment are of the present invention open in order to finish, and fully inform those of ordinary skill in the art's technical scope of the present invention.In whole specification, identical reference marker is represented identical element.
The term that uses in this specification only is used for describing these embodiment, rather than in order to limit the present invention.In this manual, as long as be not that statement is arranged in addition in the associated description, singulative includes plural form.Term " comprises (comprise) " and/or does not get rid of " comprising (comprising) " existence or the increase of one or more different assembly, step, operation and/or elements.
Hereinafter, describe thermal radiation arrangement according to an embodiment of the invention with reference to the accompanying drawings in detail.
Fig. 1 is the diagrammatic sketch according to the thermal radiation arrangement of the embodiment of the invention.With reference to Fig. 1, comprise according to the thermal radiation arrangement 110 of the embodiment of the invention: metallic substrates 112, tacky film 114 and metal pattern 116a.This metallic substrates 112 has front surface 112a, the rear surface 112b relative with front surface 112a and the side surface 112c that connects front surface 112a and rear surface 112b.Be connected at thermal radiation arrangement 110 under the situation of luminescent device structure (not shown), front surface 112a is the surface in the face of the luminescent device structure.Metallic substrates 112 is plates of being made by the metal material with high-termal conductivity.For example, metallic substrates 112 can be aluminium (Al) substrate.In addition, metallic substrates 112 comprises oxide film pattern 113a.This oxide film pattern 113a only is formed on the front surface 112a of metallic substrates 112.Oxide film pattern 113a forms by metallic substrates 112 is carried out anodic oxidation.Therefore, be under the situation of aluminium sheet in metallic substrates 112, oxide film pattern 113a can be Al
2O
3Film.
Meanwhile, though in the example that present embodiment is described, oxide film pattern 113a only forms on the front surface 112a of metallic substrates 112, and the part that forms oxide film pattern 113a in the metallic substrates 112 also can be carried out different changes and change.For example, can form the oxide film pattern 113a of metallic substrates 112 to cover at least one among rear surface 112b and side surface 112c and the front surface 112a.
Fig. 2 is the flow chart according to the manufacture method of the thermal radiation arrangement of the embodiment of the invention, and Fig. 3 a to Fig. 3 d is the diagrammatic sketch of description according to the manufacture process of the thermal radiation arrangement of the embodiment of the invention.
With reference to Fig. 2 and Fig. 3 a, preparation metallic substrates 112 (S110).For example, the step of preparation metallic substrates 112 can comprise the step for preparing aluminium substrate, and this aluminium substrate has front surface 112a, the rear surface 112b relative with front surface 112a and the side surface 112c that connects front surface 112a and rear surface 112b.
Form metal oxide film 113 to cover all surface 112a, 112b and the 112c (S120) of metallic substrates 112.For example, the step that forms metal oxide film 113 is finished by metallic substrates 112 is carried out anodic oxidation.Anodic oxidation is one of electrochemistry burning method, and it forms stable oxide film on the surface of metallic substrates 112.In metallic substrates 112 is under the situation of aluminium substrate, and metal oxide film 113 (for pellumina) forms by anodic oxidation, is used to cover front surface 112a, rear surface 112b and the side surface 112c of metallic substrates 112.Metal oxide film 113 prevents the corrosion of metallic substrates 112, and improves resistance to wear, thermal endurance and the adhesiveness of metallic substrates 112.
With reference to Fig. 2 and Fig. 3 b, on metallic substrates 112, form tacky film 114 and metal film 116 (S130) in turn.For example, on the front surface 112a of metallic substrates 112, form tacky film 114 with high-termal conductivity.The fluororesin adhesive as special teflon, can be used as tacky film 114.And, on tacky film 114, form metal film 116.For example, the step that forms metal film 116 can be finished by the Copper Foil of lamination cupric (Cu) on tacky film 114.In the process of adhesion metal film 116 on tacky film 114, can apply predetermined pressure and prevent that metal film 116 from separating with tacky film 114.
With reference to Fig. 2 and Fig. 3 c, on metallic substrates 112, form metal pattern 116a (S140).For example, the step that forms metal pattern 116a can be carried out by being scheduled to etch processes on the metal film in Fig. 3 b 116.As an example, etch processes can comprise the photoresist etch processes.As another example, etch processes can comprise the processing of metal film 116 being processed with laser or drill bit.The metal pattern 116a that makes by said method is used as circuitry lines, with to luminescent device (not shown) transmission of electric signals, and as heat conductor, with the heat that produces by luminescent device to metallic substrates 112 conduction.
Meanwhile, in the process that forms metal pattern 116a, metal oxide film 113 can prevent the damage to metallic substrates 112.More particularly, when the method for use such as photoresist etch processes forms metal pattern 116a,, can on metallic substrates 112, produce such as corroding and unnecessary etched damage because metallic substrates 112 is subjected to the influence of etch processes.In order to prevent this damage, rear surface 112b and side surface 112c and front surface 112a that metal oxide film 113 has covered metallic substrates 112 protect metallic substrates 112 to avoid the etching and processing environment, thereby prevent the damage of metallic substrates 112 in etch processes.
With reference to Fig. 2 and Fig. 3 d, surperficial 112b in the removal metallic substrates 112 except that front surface 112a and the metal oxide film 113 (S150) among Fig. 3 c on the 112c.For example, the step of removing metal oxide film 113 is to handle and finish by be scheduled to layering on the generating structure that is formed with metal pattern 116a.At this moment, tacky film 114 and metal pattern 116a have prevented coming off of the last metal oxide film 113 that forms of metallic substrates 112 front surface 112a.The metal oxide film 113 that forms on the rear surface of metallic substrates 112 112b and side surface 112c is come off.Finally, handle, on metallic substrates 112, formed the oxide film pattern 113a that only covers front surface 112a by layering.
Meanwhile, though in the example that present embodiment is described, removed the metal oxide film that covers metallic substrates 112 rear surface 112b and side surface 112c, can carry out different changes and change from its part of removing metal oxide film 113.In addition, the manufacturing of the thermal radiation arrangement shown in Fig. 1 110 can be finished under the situation of the processing of not removing metal oxide film 113.In this case, final thermal radiation arrangement 110 can have all front surface 112a, the rear surface 112b of covering metallic substrates 112 and the metal oxide film 113 of side surface 112c.
In addition, according to embodiments of the invention, owing on metallic substrates 112, form the etch processes of metal pattern 116a, be under the state that covers metallic substrates 112 all surface 112a, 112b, 112c with metal oxide film 113, to carry out, so in the process that forms metal pattern 116a, metallic substrates 112 is isolated with the etch processes environment facies.Therefore, prevented in the process that forms metal pattern 116a damage according to the manufacture method of thermal radiation arrangement of the present invention to metallic substrates 112.
Hereinafter, will the example of luminescent device encapsulation 100 with thermal radiation arrangement 110 according to the abovementioned embodiments of the present invention be described.At this, being repeated in this description of above-mentioned thermal radiation arrangement 110 will be omitted or simplify.
Fig. 4 shows the diagrammatic sketch that has according to the luminescent device encapsulation of the thermal radiation arrangement of the embodiment of the invention.With reference to Fig. 4, luminescent device encapsulation 100 is to make by being connected with the luminescent device structure 120 of being scheduled to above with reference to the thermal radiation arrangement 110 that Fig. 1 describes.Herein, luminescent device structure 120 is connected on the metal pattern 116a that is formed on the metallic substrates 112 front surface 112a.This luminescent device structure 120 comprises: luminescent device 122, lead frame 124 and molded film 126.Luminescent device 122 is at least one in light-emitting diode or the laser diode.As an example, this luminescent device 122 can be a light-emitting diode.Lead frame 124 is electrically connected to luminescent device 122 and metal pattern 116a.This lead frame 124 is transmission of electric signals between luminescent device 122 and metal pattern 116a.And molded film 126 covers on the luminescent device 122 isolated with external environment condition with protection luminescent device 122.
Light emitting device package 100 has such structure, and the heat H that produces from luminescent device 122 in this structure is transferred on the metallic substrates 112 by the metal pattern 116a of thermal radiation arrangement 110, is radiated the external world from metallic substrates 112 then.Therefore, has the radiation efficiency that has raising according to the luminescent device encapsulation 100 of the thermal radiation arrangement 110 of the embodiment of the invention.
Thermal radiation arrangement according to the embodiment of the invention comprises: metallic substrates, oxide film pattern, tacky film and metal pattern with high-termal conductivity, and be stacked in turn on the front surface of metallic substrates.When the thermal radiation arrangement of this structure was connected with the luminescent device structure, this thermal radiation arrangement is the heat that produced by the luminescent device structure of radiation effectively, thereby had the radiation efficiency of raising.
The method of this thermal radiation arrangement constructed in accordance, the thermal radiation arrangement that produces comprise metallic substrates, have the oxide film pattern of high-termal conductivity, tacky film and metal pattern, and are stacked on the front surface of metallic substrates in turn.When the thermal radiation arrangement of this structure was connected with the luminescent device structure, this thermal radiation arrangement is the heat that produced by the luminescent device structure of radiation effectively.Therefore, the method for this thermal radiation arrangement constructed in accordance can produce the thermal radiation arrangement of the radiation efficiency with raising.
The method of this thermal radiation arrangement constructed in accordance under the state with metal oxide film protection metallic substrates, prevents the damage that metallic substrates is caused by in the process that is forming metal pattern forming metal pattern on the metallic substrates.
The present invention has been explained in above-mentioned explanation for example.In addition, above-mentioned explanation only illustrates and has explained the preferred embodiments of the present invention, but it should be understood that, the present invention can be used in various other combinations, modification and environment, and can proportionately carry out changes and improvements with the experience or the knowledge of above-mentioned instruction and/or correlation technique in inventive concept scope described herein.The foregoing description is intended to further explain implements optimal mode of the present invention, and makes other one of ordinary skill in the art can be according to this embodiment or other embodiment, and according to special applications of the present invention or use desired various change to utilize the present invention.Therefore, above-mentioned explanation is not for the present invention being limited to form disclosed herein.And claims should be understood to include other replaceabilities embodiment.
Claims (8)
1. a thermal radiation arrangement is used for the heat that radiation produces from luminescent device, and described thermal radiation arrangement comprises:
Metallic substrates has front surface, the rear surface relative with described front surface and the side surface that connects described front surface and described rear surface in the face of described luminescent device;
Oxide film pattern covers the described front surface of described metallic substrates;
Tacky film covers described oxide film pattern; And
Metal pattern is formed on the described tacky film.
2. thermal radiation arrangement according to claim 1, wherein, described metallic substrates is made by aluminum, and described oxide film pattern comprises pellumina.
3. thermal radiation arrangement according to claim 1, wherein, described metal pattern is made by copper (Cu) material, and comprises the circuit that is electrically connected to described luminescent device.
4. thermal radiation arrangement according to claim 1, wherein, described oxide film pattern forms by described metallic substrates is carried out anodic oxidation.
5. method that is used to make thermal radiation arrangement, described thermal radiation arrangement are used for radiation by the heat that luminescent device produces, and said method comprising the steps of:
The preparation metallic substrates, described metallic substrates has front surface, the rear surface relative with described front surface and the side surface that connects described front surface and described rear surface in the face of described luminescent device;
Form metal oxide film, cover the described front surface of described metallic substrates, described rear surface and described side surface;
Form tacky film, cover the metal oxide film that is formed on the described front surface;
On described tacky film, form metal pattern; And
Removal is formed on the metal oxide film on described rear surface and the described side surface.
6. method according to claim 5, wherein, the step of described preparation metallic substrates comprises the step for preparing aluminium sheet, the step of described formation metal oxide film comprises carries out anodised step to described aluminium sheet.
7. method according to claim 5, wherein, the step that described removal is formed on the metal oxide film on described rear surface and the described side surface is included in the step of carrying out the layering processing on the generating structure that wherein is formed with described metal oxide film.
8. method according to claim 5, wherein, the step of described formation metal pattern comprises:
Lamination Copper Foil on described tacky film; And
Before the step of removing described metal oxide film, described Copper Foil is carried out etch processes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090103320A KR101075738B1 (en) | 2009-10-29 | 2009-10-29 | Radiating structure and method for manufacturing the same |
| KR10-2009-0103320 | 2009-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102054932A true CN102054932A (en) | 2011-05-11 |
| CN102054932B CN102054932B (en) | 2013-03-20 |
Family
ID=43959073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010124695 Expired - Fee Related CN102054932B (en) | 2009-10-29 | 2010-02-08 | Thermoradiation structure and manufacturing method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5086379B2 (en) |
| KR (1) | KR101075738B1 (en) |
| CN (1) | CN102054932B (en) |
| TW (1) | TWI422078B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102176472B1 (en) * | 2014-01-28 | 2020-11-09 | 엘지이노텍 주식회사 | PRINTED CIRCUIT BOARD AND luminous device INCLUDING THE SAME |
| KR102339683B1 (en) * | 2015-02-16 | 2021-12-16 | 주식회사 아모그린텍 | Heat radiation unit for a wireless charging and wireless charging module having the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05144985A (en) * | 1991-11-18 | 1993-06-11 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| JPH07162116A (en) * | 1993-12-01 | 1995-06-23 | Toagosei Co Ltd | Metallic base material and its production |
| JPH08125117A (en) * | 1994-10-19 | 1996-05-17 | Sanyo Electric Co Ltd | Hybrid integrated circuit device and production thereof |
| JP2002299540A (en) * | 2001-04-04 | 2002-10-11 | Hitachi Ltd | Semiconductor device and manufacturing method therefor |
| TWI220282B (en) * | 2002-05-23 | 2004-08-11 | Viking Technology Corp | Package method for enhancing the brightness of LED |
| TW594950B (en) * | 2003-03-18 | 2004-06-21 | United Epitaxy Co Ltd | Light emitting diode and package scheme and method thereof |
| CN101253627B (en) * | 2005-08-31 | 2011-09-14 | 三洋电机株式会社 | Circuit device and method for manufacturing same |
| KR100647867B1 (en) * | 2005-11-07 | 2006-11-23 | (주)싸이럭스 | Light emitting device and package structure thereof |
| JP2007194405A (en) * | 2006-01-19 | 2007-08-02 | Nitto Shinko Kk | Epoxy resin composition for heat conduction |
| WO2008021269A2 (en) * | 2006-08-11 | 2008-02-21 | E. I. Du Pont De Nemours And Company | Device chip carriers, modules, and methods of forming thereof |
| TWM330566U (en) * | 2007-08-16 | 2008-04-11 | Litatek Corp | Light-emitting device |
| JP5220373B2 (en) * | 2007-09-25 | 2013-06-26 | 三洋電機株式会社 | Light emitting module |
-
2009
- 2009-10-29 KR KR1020090103320A patent/KR101075738B1/en not_active IP Right Cessation
-
2010
- 2010-01-11 TW TW99100612A patent/TWI422078B/en not_active IP Right Cessation
- 2010-01-27 JP JP2010015996A patent/JP5086379B2/en not_active Expired - Fee Related
- 2010-02-08 CN CN 201010124695 patent/CN102054932B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011096996A (en) | 2011-05-12 |
| KR20110046713A (en) | 2011-05-06 |
| JP5086379B2 (en) | 2012-11-28 |
| KR101075738B1 (en) | 2011-10-26 |
| TWI422078B (en) | 2014-01-01 |
| TW201115799A (en) | 2011-05-01 |
| CN102054932B (en) | 2013-03-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102907183B (en) | For the plating systems of LED | |
| CN103026120B (en) | The installation of LED in TL remodeling pipe | |
| CN101901865B (en) | Metallic laminate and manufacturing method of light emitting diode package using the same | |
| US20140096380A1 (en) | Hybrid heat-radiating substrate and method of manufacturing the same | |
| CN110071206B (en) | COB aluminum-based packaging plate and preparation process thereof | |
| CN202957287U (en) | Packaging structure of semiconductor light-emitting element | |
| CN109379833A (en) | A kind of high heat conduction metal-based method for manufacturing circuit board | |
| CN102054932B (en) | Thermoradiation structure and manufacturing method thereof | |
| CN108712825B (en) | Manufacturing method of heat conduction circuit board | |
| JP2012234857A (en) | Ceramic circuit boad and module using the same | |
| WO2016013651A1 (en) | Brazing filler metal, and ceramic substrate employing same | |
| CN100459194C (en) | Packing structure and method | |
| US20110101406A1 (en) | Light emitting device package and method for manufacturing the same | |
| US20110100616A1 (en) | Heat radiating structure and method for manufacturing the same | |
| CN209926075U (en) | Flexible lamp strip substrate and flexible lamp strip | |
| KR20140123273A (en) | Printed circuit board and manufacturing method thereof | |
| CN209964358U (en) | Composite heat dissipation type circuit board and ultraviolet curing module | |
| CN102763493A (en) | Printed circuit board having aluminum traces with a solderable layer of material of applied thereto | |
| KR101214261B1 (en) | Metal printed circuit board | |
| KR101153701B1 (en) | The manufacturing method of the metal printed circthe manufacturing method of the metal printed circuit board uit board | |
| KR101037325B1 (en) | Metal base board for led lighting device and method for fabricating the same | |
| KR100466162B1 (en) | method of manufacturing an insulated metal substrate | |
| CN107316843A (en) | A kind of manufacture method of the insulation system of power electronic devices | |
| JP2008124242A (en) | Heat transfer substrate, its production process and circuit module | |
| US20140116613A1 (en) | Method of Forming Thermal Conductive Pillar in Metal Core Printed Circuit Board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20150208 |
|
| EXPY | Termination of patent right or utility model |