KR20140123273A - Printed circuit board and manufacturing method thereof - Google Patents

Abstract

Disclosed are a printed circuit board and a manufacturing method thereof, capable of using a bonding member made of a general material by forming a copper layer on a surface thereof, improving adhesion, and increasing bending strength and heat dissipation by using aluminum. The printed circuit board includes a core part, a base part which has a surface made of copper materials, the bonding member which is interposed between the core part and the base part to bond the base part to both sides of the core part, a substitution layer which forms zinc on the surface of the base part, a first plating layer which is formed with a first metal material on the substitution layer by plating, and a second plating layer which is formed with a second metal material, which is different from the first metal material, on the first plating layer by the plating.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board (PCB)

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board using aluminum and a method of manufacturing the same, and more particularly, to a printed circuit board capable of increasing heat radiation and flexural strength using aluminum and a method of manufacturing the same.

In general, a printed circuit board (PCB) called a printed circuit board (PCB) is a component that is integrated with wiring so that various devices can be mounted or electrical connection between the devices is possible. Substrates are being manufactured. Demand for printed circuit boards has been growing along with the growth of electric appliances, communication equipment, semiconductor equipment, industrial equipment, and automobile electrical control in demand industries. In particular, printed circuit board products are becoming smaller and lighter And high value-added products.

One of the prominent features of such electronic devices is that power consumption is increased due to the addition of various complex functions, and as a result, heat generation in electronic components is intensified, so that depending on the degree of heat generation of electronic products, It also works.

Conventionally, a method of manufacturing a multilayer printed circuit board by using a copper clad laminate (CCL) as a base substrate, forming a circuit pattern on a copper foil, and then laminating the circuit pattern has been used. However, in such a printed circuit board, there is a limitation in improving the heat radiation characteristic of the printed circuit board by limiting the material of copper (Cu).

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a printed circuit board and a printed circuit board which can realize various types of circuits, And a method for manufacturing the same.

Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same that can use commonly used bonding members to improve the bonding force and reduce the manufacturing cost.

Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same that can increase the heat radiation function and the bending strength.

Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same that can improve the reliability of a product by preventing breakage (cracking) of the substrate under harsh environmental conditions applied to automobiles.

Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same that reduce the weight of automotive electrical components using relatively lightweight aluminum.

Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same that can shorten the manufacturing time of the printed circuit board and reduce the manufacturing cost thereof.

The printed circuit board according to the above-described embodiments of the present invention includes a core portion, a base portion having a surface made of a copper material, and a base portion interposed between the core portion and the base portion to bond the base portion to both sides of the core portion A first plating layer formed on the substitution layer by using a first metal material and a second plating layer formed on the first plating layer by plating on the first metal layer, And a second plating layer formed of a second metal material of different material.

According to one aspect, the core portion may be formed of an insulator material. And a via hole is formed through the core portion, the bonding member, and the base portion, a metal layer for metallizing the core portion formed of an insulator material and the cross-sectional portion exposed by the bonding material is formed in the via hole, Layer may be formed in a region except for the portion where the metal layer is formed. Here, the substitution layer may be formed to have a thickness equal to or greater than that of the metal layer. The base portion has a copper film formed on the surface of the aluminum layer through surface treatment of aluminum. The base portion includes an aluminum layer, a zinc film formed on the aluminum film, a nickel film formed by plating on the zinc film, And a copper film formed by plating on the copper film.

According to one aspect, the core portion may have a form in which a copper film is formed on the surface of the aluminum layer through surface treatment of aluminum. Here, the core portion may include an aluminum layer, a zinc film formed on the aluminum layer, a nickel film formed on the zinc film using plating, and a copper film formed on the nickel film using plating. The core portion may be formed with a core pattern. For example, the core pattern may be formed of at least one hole formed through the metal core layer, and the holes may be formed in a pattern or regularly or irregularly arranged holes. A via hole is formed through the core portion, the bonding member, and the base portion. A metal layer for metallizing a cross-sectional portion of the bonding material exposed in the via hole is formed, May be formed in an area other than the area. Here, the substitution layer may be formed to have a thickness equal to or greater than that of the metal layer. For example, the base portion has a copper film formed on the surface of the aluminum layer through surface treatment of aluminum, and includes an aluminum layer, a zinc film formed on the aluminum film, a nickel film formed on the zinc film using plating, And a copper film formed by plating on the nickel film. Alternatively, the base portion may be formed of a copper plate.

According to one aspect, the bonding material may be a polyimide-based adhesive sheet or an epoxy-based material.

According to one aspect, the first plating layer may be formed using electroless plating or electrolytic plating. For example, the first plating layer may be formed of any one metal selected from the group consisting of nickel, gold, and silver.

According to one aspect, the second plating layer may be formed using electrolytic plating. For example, the second plating layer may be formed of a copper material.

According to one aspect of the present invention, the circuit pattern may further include a circuit pattern formed on the second plating layer. For example, the circuit pattern may be formed using a material selected from ferric chloride, cupric chloride, and sodium chlorate after applying a dry film on the plating layer and after exposure.

According to one aspect, the core portion, the joining member, and the base portion may be formed by stacking a plurality of layers.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board, including the steps of providing a core, providing a base portion having a surface made of a copper material, Forming a substitution layer on the surface of the base by zincating the surface of the base, forming a first plating layer of a first metal material on the substitution layer by plating, and forming a first plating layer on the first plating layer using plating And forming a second plating layer of a second metal material different from the first metal.

According to one aspect, the core portion may be formed of an insulator material. Forming a via hole penetrating the core portion, the bonding member, and the base portion; and forming a metal layer for metallizing the end portion of the core portion and the bonding material exposed from the insulator within the via hole, And the substitution layer may be formed in a region except for a portion where the metal layer is formed. For example, the step of forming the substitution layer may be formed to have the same thickness as the metal layer, or may be formed to be thicker than the metal layer. Further, the base portion may have a form in which a copper film is formed on the surface of the aluminum layer through surface treatment of aluminum, providing an aluminum layer, forming a zinc film on the aluminum layer, plating on the zinc film Thereby forming a nickel film, and forming a copper film on the nickel film using plating.

According to one aspect, the core portion may have a form in which a copper film is formed on the surface of the aluminum layer through surface treatment of aluminum. Here, the core portion may include a step of providing an aluminum layer, forming a zinc film on the aluminum layer, forming a nickel film on the zinc film using plating, and forming a copper film on the nickel film using plating And a step of forming the second electrode. And forming a core pattern on the core portion. For example, the step of forming the core pattern may include forming at least one hole formed through the metal core layer, and the hole may be formed in a pattern or regularly or irregularly arranged holes. Forming a via hole penetrating the core portion, the bonding member, and the base portion; and forming a metal layer for metallizing a cross-sectional portion of the bonding material exposed in the via hole, May be formed in a region except for the portion where the metal layer is formed. For example, the step of forming the substitution layer may be formed to have the same thickness as the metal layer, or may be formed to be thicker than the metal layer. Here, the base portion may have a form in which a copper film is formed on the surface of the aluminum layer through surface treatment of aluminum, and includes the steps of providing an aluminum layer, forming a zinc film on the aluminum layer, Thereby forming a nickel film, and forming a copper film on the nickel film using plating. Alternatively, the base portion may be formed of a copper plate.

According to one aspect, the bonding material may be a polyimide-based adhesive sheet or an epoxy-based material.

According to one aspect, the first plating layer may be formed using electroless plating or electrolytic plating. For example, the first plating layer may be formed of any one metal selected from the group consisting of nickel, gold, and silver.

According to one aspect, the second plating layer may be formed using electrolytic plating. For example, the second plating layer may be formed of a copper material.

According to one aspect of the invention, there is provided a method of forming a circuit pattern, the method comprising: forming a circuit pattern on the second plating layer, the circuit pattern comprising: applying a dry film on the second plating layer; And etching the second plating layer using a hydrochloric acid-based acid etching using any one of iron, cupric chloride, and sodium chlorate.

According to one aspect, the step of providing the core part or the step of bonding the base part using the bonding member may be repeated many times to form a multilayer.

As described above, according to the embodiments of the present invention, since aluminum materials are stacked, it is possible to realize various types of circuits, thereby integrating circuits to simplify the product.

Further, according to the embodiments of the present invention, since a copper film is formed on the aluminum surface, a commonly used joining member can be used, so that the joining force can be improved, the manufacturing time can be shortened, and the manufacturing cost can be reduced.

Further, since the aluminum is laminated, the heat radiation function and the bending strength of the printed circuit board can be increased, and the breakage (cracking) of the printed circuit board can be prevented under harsh environmental conditions such as automobiles, thereby improving the reliability of the product.

In addition, the use of relatively lightweight aluminum can reduce the weight of automotive electrical components.

1 to 13 are views for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention.
14 to 22 are views for explaining a method of manufacturing a printed circuit board according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or limited by the embodiments. In describing the embodiments, a detailed description of well-known functions or constructions may be omitted so as to clarify the gist of the present invention.

Hereinafter, with reference to FIGS. 1 to 13, a method of manufacturing a printed circuit board having a core portion 100 made of a copper film on an aluminum surface according to an embodiment of the present invention will be described in detail. On the other hand, in the embodiment described below, the expression "on a layer" means that it is formed on both the upper surface and the lower surface unless otherwise specified. The term " hole " includes not only a circular shape but also a polygonal shape.

First, the core portion 100 is prepared. The core part 100 is formed of an aluminum material and may have a shape in which a copper film 104 is formed by performing a predetermined surface treatment on a core layer 101 made of an aluminum foil having a predetermined thickness. Specifically, the core portion 100 may have a configuration in which a zinc film 102, a nickel film 103, and a copper film 104 are sequentially stacked on an aluminum core layer 101 having a predetermined thickness. The structure and manufacturing method of the core unit 100 will be described below.

First, as shown in Fig. 1, a core layer 101 formed of an aluminum foil having a predetermined thickness is provided.

Next, as shown in Fig. 2, the surface of the core layer 101 is treated with zincate (zinc substitution plating) to form a zinc film 102 having a predetermined thickness. The zinc film 102 is formed by replacing a part of the thickness of the surface of the core layer 101 with zinc. The zinc film 102 serves to prevent the aluminum core layer 101 from being oxidized in the atmosphere and to protect the surface of the core layer 101 in the subsequent electroless plating or electrolytic plating process.

Next, as shown in Fig. 3, electroplating is performed on the zinc film 102 to form a nickel film 103. Then, as shown in Fig. The nickel film 103 can be formed by a method of electrolytic (reductive) plating in which the production cost is relatively low in electroless plating. However, it is also possible to form the nickel film 103 by plating the zinc film 102 with nickel in accordance with working conditions. In this case, the nickel film 103 can be replaced with a nickel film 103 in part or all of the thickness of the zinc film 102. [ Nickel is used in the above embodiment to form the nickel film 103 on the zinc film 102. However, instead of nickel, other metals having high chemical resistance such as gold (Au) or silver (Ag ) Can also be used. However, when a metal such as gold or silver is used, since the cost is higher than nickel in terms of cost, nickel is used in this embodiment to form a plating film.

Next, as shown in Fig. 4, a copper film 104 is formed on the nickel film 103 by electrolytic plating. For example, the copper film 104 is formed to a thickness of 20 탆, and the thickness of the copper film 104 can be adjusted according to electrical characteristics.

Through the process described with reference to FIG. 1 to FIG. 4, a core portion 100 having a copper film 104 of a predetermined thickness formed on aluminum can be formed. Therefore, since the surface of the core portion 100 is formed of the copper film 104, bonding property is improved as compared with aluminum, it is possible to use a joining member 111 made of a generally used material.

Next, as shown in Fig. 5, a core pattern 105 composed of one or more holes is formed in the core portion 100. As shown in Fig. However, the present invention is not limited thereto, and the core pattern 100 may be omitted and the core portion 100 itself may be used as one pattern.

For example, the core pattern 105 may be formed by arranging a plurality of holes according to a predetermined pattern, or a plurality of holes may be formed regularly or irregularly. The role of the core pattern 105 may serve to form a predetermined circuit pattern on the core portion 100. [ In addition, the core pattern 105 serves to smoothly dissipate the heat of the core portion 100. Here, the core pattern 105 may be formed on the core portion 100 by a chemical or mechanical method. For example, the core pattern 105 can form a pattern on the core portion 100 using chemical etching or the like. Alternatively, the core pattern 105 may be formed in the core portion 100 by punching or the like.

Next, as shown in Figs. 6A and 6B, the base portion 112 is bonded to both side surfaces of the core portion 100 by using the bonding member 111. Next, as shown in Figs. The base portion 112 is formed by heating the core portion 100 and the base portion 112 to a predetermined temperature with the bonding portion 111 interposed between the core portion 100 and the base portion 112, Can be added.

Here, the surface of the base portion 112 is made of copper. For example, as shown in FIG. 6A, the base portion 112 may be formed of an aluminum material formed by performing a predetermined surface treatment on aluminum, such as the core portion 100 described above. The base portion 112 has a configuration in which a zinc film 1122, a nickel film 1123, and a copper film 1124 are sequentially formed on the surface of an aluminum layer 1121 having a predetermined thickness, as described with reference to FIGS. 1 to 4 . Here, the process of forming the aluminum layer 1121 to the copper film 1124 forming the base portion 112 is the same as the process of the core portion 100 described above, so duplicate description will be omitted. However, the present invention is not limited thereto. As shown in FIG. 6B, the base portion 112 may be formed of a single copper layer 1125 such as a copper plate or copper foil of a predetermined thickness.

For example, the bonding member 111 may be a polyimide-based insulating adhesive sheet having an excellent adhesive performance and an insulating function, or an epoxy-based bonding agent such as a glass epoxy resin. Here, the bonding member 111 may be made of a material having a thermal expansion coefficient similar to that of the base portion 112. According to the present embodiment, since the surface of the base portion 112 is formed of a copper material, the bonding member 111 can use a general-purpose adhesive used for a conventional copper material. According to the embodiments, the heat dissipation function and the bending strength of the printed circuit board can be increased by using the aluminum material. On the other hand, by using the universal joint member 111, it is possible to improve the bonding force, shorten the manufacturing time, The core member 100 is bonded to the bonding member 111 and the base member 112 in a state in which the base member 112 is bonded to the core member 100 as shown in FIG. A via hole 113 is formed. For example, the via hole 113 can be formed by using a drill process, a laser process, or the like.

Next, as shown in Fig. 8, a metal layer 114 for metallizing a portion of the bonding member 111 exposed on the inner surface of the via hole 113 is formed. For example, the metal layer 114 may be formed using carbon direct plating. The core portion 100 electrically isolated by the bonding member 111 and the base portion 112 formed at the upper and lower portions of the core portion 100 are electrically connected to each other by forming the metal layer 114. [ 9, the metal layer 114 is formed so as to cover not only the end face portion of the bonding member 111 but also the end face portion of the base member 112, as shown in FIG. 9, so that the core portion 100 and the base portion 112 can be electrically connected to each other. And may extend to a portion of the core portion 100 and a portion of the base portion 112.

Next, as shown in Fig. 9, the surface of the base portion 112 is subjected to a zincate treatment to form a substitution layer 115 having a predetermined thickness. For example, the replacement layer 115 is formed by replacing a part of the surface of the base portion 112 with zinc, and a region excluding the metal layer 114 in the surface of the base portion 112 and inside the via hole 113, And is formed on the end face of the base portion 112 and the end face portion of the core portion 100. The thickness of the substitution layer 115 is at least equal to the thickness of the metal layer 114 or is formed to be thicker than the thickness of the metal layer 114. Here, in this embodiment, as shown by reference numeral 115a in FIG. 9, a part of the thickness of the base portion 112 is replaced with zinc, but the present invention is not limited to the drawings, The thickness of the substitution layer 115 and the thickness of the portion 115a to be substituted in the base portion 112 can be substantially changed.

According to the present embodiment, the replacement layer 115 prevents the base portion 112 of the aluminum material from being oxidized in the atmosphere, and the surface of the base portion 112 in the electroless plating and electrolytic plating processes, And protects it from being damaged.

Next, as shown in FIG. 10, the first plating layer 116 is formed on the replacement layer 115 by plating with a metal having high chemical resistance. The first plating layer 116 is formed not only on the substitution layer 115 but also on the surface of the metal layer 114 inside the via hole 113. The first plating layer 116 can be formed by electrolytic plating or electroless plating. For example, the first plating layer 116 can be formed using electrolytic (reduction) plating of nickel (Ni). However, the material of the first plating layer 116 of the present invention is not limited to nickel, and it is also possible to perform substitution plating with another metal having a high chemical resistance, such as gold (Au) or silver (Ag) .

Next, as shown in FIG. 11, a second plating layer 117 is formed on the first plating layer 116 by using a metal different from the first plating layer 116. Next, as shown in FIG. For example, the second plating layer 117 may be a copper film formed by performing electrolytic plating using copper.

Next, as shown in Fig. 12, a dry film 118 having a predetermined pattern 119 formed on the surface of the second plating layer 117 is coated. For example, the dry film 118 is exposed and developed for a predetermined time to print and form a predetermined pattern 119 on the surface.

Next, as shown in Fig. 13, the second plating layer 117, the first plating layer 116, the replacement layer 115, and the base portion 112 are removed along the pattern 119 of the dry film 118 The circuit pattern 120 is formed, and after the formation of the circuit pattern 120 is completed, the dry film 118 is removed to form a printed circuit board. The circuit pattern 120 may be formed using a hydrochloric acid based acid etch, based on the pattern 119 on the dry film 118. For example, as the hydrochloric acid series, ferric chloride, cupric chloride, sodium chlorate, and the like can be used. However, the present invention is not limited thereto, and the circuit pattern 120 can be formed by a mechanical method such as punching as well as a chemical method using dry film 118 and hydrochloric acid-based acid etching.

The present invention is not limited to the drawings, and the core part 100, the joining member 111, and the base part 112 may be repeatedly formed It is also possible to laminate and form a plurality of layers. The via hole 113 is formed and the metal layer 114, the substitution layer 115, the first plating layer 116, and the second plating layer (not shown) are stacked on the core layer 100 and the base portion 112, 117 may be performed in the same manner.

The printed circuit board manufactured according to the present invention can be applied to automobile electric parts and the like.

Next, a method for manufacturing a printed circuit board according to another embodiment of the present invention will be described in detail with reference to FIGS. 14 to 22. FIG. Since the embodiments described below are substantially the same as those of the embodiments described above with reference to FIGS. 1 to 13 except for the material of the core portion, the same elements are given the same names, and redundant explanations are omitted do.

First, as shown in Fig. 14, the core portion 200 is prepared. The core portion 200 is formed of an insulator material.

Next, as shown in Fig. 15, the base portion 212 is bonded to the both side surfaces of the core portion 200 using the bonding member 211. Next, as shown in Fig. The base portion 212 can be bonded by heating the core portion 200 and the base portion 212 to a predetermined temperature and applying a predetermined pressure. For example, the bonding member 211 may be a polyimide-based insulating adhesive sheet having an excellent adhesive performance and an insulating function, or an epoxy-based bonding agent such as a glass epoxy resin. The joining member 211 may have a thermal expansion coefficient similar to that of the base portion 212.

The base portion 212 may be made of an aluminum material on which a copper film is formed by performing a predetermined surface treatment on aluminum. The base portion 212 has a structure in which a zinc film 2122, a nickel film 2123, and a copper film 21244 are sequentially formed on the surface of an aluminum layer 2121 having a predetermined thickness, as described with reference to FIGS. 1 to 4 Lt; / RTI > Here, the process of forming the aluminum layer 2121 to the copper film 2124 constituting the base portion 212 is the same as the process of manufacturing the core portion 100 described with reference to FIGS. 1 to 4, do.

Next, as shown in Fig. 16, a via hole 213 (shown in Fig. 16) that penetrates the core portion 200, the bonding member 211, and the base portion 212 with the base portion 212 bonded to the core portion 200 ). For example, the via hole 213 can be formed by a drilling process, a laser process, or the like.

Next, as shown in Fig. 17, a metal layer 214 for metallizing the core portion 200 of the insulator material exposed at the inner side of the via hole 213 and the bonding member 211 is formed. By forming the metal layer 214, the base portions 212 on both sides of the electrically insulated core portion 200 are electrically connected to each other. For example, the metal layer 214 may be formed by using a direct plating method to form a carbon layer and extend to a portion of the base portion 212 to connect the core portions 212 to each other.

Next, as shown in FIG. 18, the surface of the base portion 212 is subjected to a zincate treatment to form a replacement layer 215 having a predetermined thickness. For example, the substitution layer 215 may be formed by replacing a portion of the surface of the base portion 212 with zinc, and formed in a region inside the via hole 213 except for the metal layer 214. The thickness of the substitution layer 215 may be at least equal to the thickness of the metal layer 214 or may be greater than the thickness of the metal layer 214. According to the present embodiment, the replacement layer 215 prevents the base portion 212 of the aluminum material from being oxidized in the atmosphere and prevents the surface of the base portion 212 from being corroded during the subsequent electroless plating and electrolytic plating processes. And protects it from being damaged.

Next, as shown in FIG. 19, the first plating layer 216 is formed on the replacement layer 215 by plating with a metal having a high chemical resistance. The first plating layer 216 is formed not only on the replacement layer 215 but also on the surface of the metal layer 214 inside the via hole 213. The first plating layer 216 may be formed by electrolytic plating or electroless plating. For example, the first plating layer 216 may be formed by electrolytic (reduction) plating of nickel (Ni). However, the material of the first plating layer 216 of the present invention is not limited to nickel, and it is also possible to perform substitution plating with another metal having a high chemical resistance, such as gold (Au) or silver (Ag) .

Next, as shown in FIG. 20, a second plating layer 217 is formed on the first plating layer 216 by using a metal different from the first plating layer 216. For example, the second plating layer 217 may be a copper film formed by performing electrolytic plating using copper.

Next, as shown in Fig. 21, a dry film 218 having a predetermined pattern 219 formed on the surface of the second plating layer 217 is coated and exposed and developed for a predetermined time to form a pattern 219. Next, as shown in Fig.

2, the second plating layer 217, the first plating layer 216, the replacement layer 215, and the base portion 212 are removed in accordance with the pattern 219 of the dry film 218 The circuit pattern 220 is formed, and after the formation of the circuit pattern 220 is completed, the dry film 218 can be removed to form a printed circuit board. The circuit pattern 220 can be formed using a hydrochloric acid based acid etch, based on the pattern 219 on the dry film 218. For example, as the hydrochloric acid series, ferric chloride, cupric chloride, sodium chlorate, and the like can be used. However, the present invention is not limited thereto, and the circuit pattern 220 can be formed by a mechanical method such as punching as well as a chemical method using dry film 218 and hydrochloric acid-based acid etching.

The present invention is not limited to the drawings but may be applied to the core part 200 and the joining member 211 and the base part 212. In the above embodiment, May be repeatedly stacked to form a plurality of layers. A via hole 213 is formed and a metal layer 214, a substitution layer 215, a first plating layer 216, and a second plating layer (not shown) are formed in the core layer 200 and the base portion 212, 217 may be performed in the same manner.

The printed circuit board manufactured according to the present invention can be applied to automobile electric parts and the like.

In the above-described embodiments, a method of manufacturing a printed circuit board in the case where a via hole is formed has been described. However, the present invention is not limited thereto, and the method of the above embodiment may be applied to a case where a via hole is not formed .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

100: core part
101: core layer
102: zinc film
103: Nickel film
104: Copper film
105: core pattern
111:
112: Base portion
1121: Aluminum layer
1122: zinc film
1123: Nickel film
1124: Copper film
1125: single copper layer
113: via hole
114: metal layer
115: Substitution layer
116: First plating layer
117: Second plating layer
118: Dry film
119: Pattern
120: Circuit pattern

Claims (41)

A core portion;
A base portion having a surface made of a copper material;
A joining member interposed between the core portion and the base portion to join the base portion to both sides of the core portion;
A substitution layer formed to zincate the surface of the base portion;
A first plating layer formed of a first metal material on the replacement layer using plating; And
A second plating layer formed on the first plating layer by plating using a second metal material different from the first metal;
And a printed circuit board.
The method according to claim 1,
Wherein the core portion is formed of an insulator material.
3. The method of claim 2,
A via hole is formed through the core portion, the joining member, and the base portion,
A metal layer for metallizing the core portion formed of an insulator material and the cross-sectional portion of the bonding material exposed in the via hole,
Wherein the substitution layer is formed in a region excluding a portion where the metal layer is formed.
The method of claim 3,
Wherein the substitution layer is formed to have a thickness equal to or greater than that of the metal layer.
3. The method of claim 2,
Wherein the base portion has a copper film formed on the surface of the aluminum layer through surface treatment of aluminum,
An aluminum layer;
A zinc film formed on the aluminum layer;
A nickel film formed on the zinc film by plating; And
A copper film formed on the nickel film by plating;
And a printed circuit board.
The method according to claim 1,
Wherein the core portion has a form in which a copper film is formed on a surface of an aluminum layer through surface treatment of aluminum.
The method according to claim 1,
The core portion
An aluminum layer;
A zinc film formed on the aluminum layer;
A nickel film formed on the zinc film by plating; And
A copper film formed on the nickel film by plating;
And a printed circuit board.
The method according to claim 6,
Wherein the core portion is formed with a core pattern.
9. The method of claim 8,
Wherein the core pattern is formed of at least one hole formed through the metal core layer, and the holes are formed in a pattern or regularly or irregularly arranged holes.
The method according to claim 6,
A via hole is formed through the core portion, the joining member, and the base portion,
A metal layer is formed in the via hole for metallizing a cross-section portion of the bonding material exposed,
Wherein the substitution layer is formed in a region excluding a portion where the metal layer is formed.
11. The method of claim 10,
Wherein the substitution layer is formed to have a thickness equal to or greater than that of the metal layer.
The method according to claim 6,
Wherein the base portion has a copper film formed on the surface of the aluminum layer through surface treatment of aluminum,
An aluminum layer;
A zinc film formed on the aluminum layer;
A nickel film formed on the zinc film by plating; And
A copper film formed on the nickel film by plating;
And a printed circuit board.
The method according to claim 6,
Wherein the base portion is formed of a copper plate.
The method according to claim 1,
Wherein the bonding material is a polyimide adhesive sheet or an epoxy-based printed circuit board.
The method according to claim 1,
Wherein the first plating layer is formed using electroless plating or electrolytic plating.
16. The method of claim 15,
Wherein the first plating layer is formed of a metal selected from the group consisting of nickel, gold, and silver.
The method according to claim 1,
And the second plating layer is formed using electrolytic plating.
18. The method of claim 17,
Wherein the second plating layer is formed of a copper material.
The method according to claim 1,
And a circuit pattern formed on the second plating layer.
20. The method of claim 19,
Wherein the circuit pattern is formed using a material selected from ferric chloride, cupric chloride, and sodium chlorate after applying a dry film on the plating layer and after exposure.
The method according to claim 1,
And the base portion, the core portion, the bonding member, and the base portion.
Providing a core portion;
Providing a base portion whose surface is made of a copper material;
Joining the base portion to both sides of the core portion using a joining member;
Forming a substitution layer by zincifying the surface of the base portion;
Forming a first plating layer of a first metal material on the replacement layer using plating; And
Forming a second plating layer of a second metal material different from the first metal on the first plating layer using plating;
And a step of forming the printed circuit board.
23. The method of claim 22,
Wherein the core portion is formed of an insulator material.
24. The method of claim 23,
Forming a via hole penetrating the core portion, the joining member, and the base portion; And
Forming a metal layer in the via hole to metallize the core portion formed of an insulator material and a cross-sectional portion of the joint material exposed;
Further comprising:
Wherein the replacement layer is formed in a region except for a portion where the metal layer is formed.
25. The method of claim 24,
Wherein the step of forming the substitution layer is formed to have the same thickness as the metal layer or to have a thickness greater than that of the metal layer.
24. The method of claim 23,
Wherein the base portion has a copper film formed on the surface of the aluminum layer through surface treatment of aluminum,
Providing an aluminum layer;
Forming a zinc film on the aluminum layer;
Forming a nickel film on the zinc film using plating; And
Forming a copper film on the nickel film using plating;
And a step of forming the printed circuit board.
23. The method of claim 22,
Wherein the core portion has a form in which a copper film is formed on the surface of the aluminum layer through surface treatment of aluminum.
23. The method of claim 22,
The core portion
Providing an aluminum layer;
Forming a zinc film on the aluminum layer;
Forming a nickel film on the zinc film using plating; And
Forming a copper film on the nickel film using plating;
The method comprising the steps of:
28. The method of claim 27,
And forming a core pattern on the core portion.
30. The method of claim 29,
The forming of the core pattern may include forming at least one hole formed through the metal core layer, wherein the hole is formed in a pattern, or holes are regularly or irregularly arranged.
28. The method of claim 27,
Forming a via hole penetrating the core portion, the joining member, and the base portion; And
Forming a metal layer in the via hole to metallize a cross-section portion of the bonding material exposed;
Further comprising:
Wherein the replacement layer is formed in a region except for a portion where the metal layer is formed.
32. The method of claim 31,
Wherein the step of forming the substitution layer is formed to have the same thickness as the metal layer or to have a thickness greater than that of the metal layer.
28. The method of claim 27,
Wherein the base portion has a copper film formed on the surface of the aluminum layer through surface treatment of aluminum,
Providing an aluminum layer;
Forming a zinc film on the aluminum layer;
Forming a nickel film on the zinc film using plating; And
Forming a copper film on the nickel film using plating;
And a step of forming the printed circuit board.
28. The method of claim 27,
Wherein the base portion is formed of a copper plate.
23. The method of claim 22,
Wherein the bonding material is a polyimide adhesive sheet or an epoxy-based adhesive.
23. The method of claim 22,
Wherein the first plating layer is formed using electroless plating or electrolytic plating.
37. The method of claim 36,
Wherein the first plating layer is formed of one of a metal selected from the group consisting of nickel, gold, and silver.
23. The method of claim 22,
And the second plating layer is formed using electrolytic plating.
39. The method of claim 38,
Wherein the second plating layer is formed of a copper material.
23. The method of claim 22,
Further comprising the step of forming a circuit pattern on the second plating layer,
In the circuit pattern,
Applying a dry film on the second plating layer;
Exposing the dry film to light; And
Etching the second plating layer using a hydrochloric acid-based acid etching using any one of ferric chloride, cupric chloride, and sodium chlorate;
And a step of forming the printed circuit board.
23. The method of claim 22,
Wherein the step of providing the core part or the step of bonding the base part using the bonding member is repeated many times to form a multilayer.

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