CN104105334B - Printed circuit board and manufacturing methods - Google Patents
Printed circuit board and manufacturing methods Download PDFInfo
- Publication number
- CN104105334B CN104105334B CN201410144076.1A CN201410144076A CN104105334B CN 104105334 B CN104105334 B CN 104105334B CN 201410144076 A CN201410144076 A CN 201410144076A CN 104105334 B CN104105334 B CN 104105334B
- Authority
- CN
- China
- Prior art keywords
- film
- base unit
- layer
- pcb
- core cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
The present invention provides a kind of printed circuit board (PCB) and its manufacturing method, the PCB can be by forming copper (Cu) film on the surface come using general engagement member, increase engaging force, and radiation efficiency and bending strength are increased by using aluminium (Al).The PCB includes: core cell；Base unit, surface are made of Cu；Engagement member is arranged between core cell and base unit, by base unit engagement to every side of core cell；Layer is replaced, is configured to that the surface of base unit is made to become zinc (Zn)；First coating is made of plating of the first metal material on replacement layer；And second coating, it is made of plating of second metal material different from the first metal material on the first coating.
Description
Cross reference to related applications
The South Korea patent application No.10-2013- submitted this application claims on April 12nd, 2013 in Korean Intellectual product office
0040367 equity is disclosed by reference and is incorporated herein in.
Technical field
The present invention relates to the printed circuit boards (PCB) for using aluminium (Al), and systems are increased using Al
The PCB and its manufacturing method of heat radiation and bending strength.
Background technique
In general, printed circuit board (PCB) refer to for installed by wiring integrated thereon various devices or
The component of electrical connection between person's realization device.As technology develops, PCB takes various forms to manufacture and have various function
Energy.As the demand of such as electrical control of household electrical appliance, communication device, semiconductor equipment, commercial plant and automobile etc is prosperous
The growth of industry is contained, the demand to PCB is continuously increased.Specifically, with towards electronic component small size and high-tech become
Gesture, PCB are just becoming smaller, lighter and high value added product.
The notable feature of those electronic devices first is that increase by adding multi-functional caused power consumption.Accordingly
Ground is thermally generated increase in electronic component.Being thermally generated can be related to users satisfaction degree or as purchase standard.
Conventionally, circuit diagram is formed and added by using copper-clad laminate (CCL) as substrate and on CCL
Case, to manufacture multi-layer PCB.But since the material of conventional PCB is confined to copper (Cu), so the thermorodiative property of PCB is limited
System.
Summary of the invention
One aspect of the present invention provides a kind of printed circuit board (PCB) and its manufacturing method, using aluminium (Al) it is laminated come
It realizes various types of circuits, and correspondingly simplifies products configuration.
Another aspect of the present invention provides a kind of PCB and its manufacturing method, is increased by using general engagement member
Adjunction resultant force, and thus reduce manufacturing cost.
Another aspect of the present invention provides a kind of PCB and its manufacturing method, increases radiation efficiency and bending strength.
Another aspect of the present invention provides a kind of PCB and its manufacturing method, prevents in the adverse circumstances item for being applied to automobile
Thus the destruction of substrate under part increases the reliability of product.
Another aspect of the present invention provides a kind of PCB and its manufacturing method, reduces automobile by using lighter Al
Electronic component.
Another aspect of the present invention provides a kind of PCB and its manufacturing method, reduces manufacturing time and manufacturing cost.
According to one aspect of the present invention, a kind of PCB is provided comprising: core cell；Base unit, surface is by Cu
To be made；Engagement member is arranged between core cell and base unit, by base unit engagement to the every of core cell
Side；Layer is replaced, is configured to that the surface of base unit is made to become zinc (Zn)；First coating, by plating by first on replacement layer
Metal material is made；And second coating, by plating by second metal different from the first metal material on the first coating
Material is made.
Core cell can be made of insulating material.Core cell, engagement member and base unit be may pass through to form through-hole.
Metal layer can be formed, to expose the section of the core cell as made by insulating materials and engagement member in plated-through hole, with
And replacement layer can be formed not including the region of metal layer.Replacement layer thickness can be equal to or greater than metal layer thickness.Base
Bill kept on file member may be arranged so that Cu film is arranged on Al layers of surface and base unit can wrap by Al layer be surface-treated
Include Al layers, the Zn film that is formed on Al layer, nickel (Ni) film formed on Zn film by plating and by plating on Ni film
The Cu film of formation.
Core cell may be arranged so that Cu film and be arranged on Al layers of surface by Al layers of surface treatment.Core list
Member may include Al layers, be formed on Al layer Zn film, the Ni film formed on Zn film by plating and by plating in Ni film
The Cu film of upper formation.Core cell may include core pattern.Core pattern may include across Al layers at least one hole, Yi Jizhi
A few hole can be arranged along pattern or regularly or irregularly be arranged.It may pass through core cell, engagement member and substrate list
Member forms through-hole.Metal layer can be formed, can not wrapped with the section of exposure engagement member in plated-through hole, and replacement layer
The region of metal layer is included to be formed.Replacement layer thickness can be equal to or greater than metal layer thickness.Base unit can be configured to make
Cu film is arranged on Al layers of surface and base unit may include Al layers, on Al layer by Al layer be surface-treated
The Zn film of formation, the nickel film formed on Zn film by plating and the Cu film formed on Ni film by plating.Substrate list
Member may include Cu plate.
Engagement member may include polyimide-based joint fastener or epoxy resin-matrix joint fastener.
First coating can be formed by electroless plating or plating.First coating may include from Ni, gold (Au) and silver (Ag)
At least one metal of middle selection.
Second coating can be formed by being electroplated.Second coating may include Cu.
PCB may additionally include the circuit pattern formed on the second coating.It can be by applying dry film on the second coating, executing
Any one of expose and use iron chloride, copper chloride and sodium chlorate, to form circuit pattern.
Multilayer core cell, engagement member and base unit can be deposited.
It is another aspect of this invention to provide that providing a kind of manufacturing method for PCB, which includes: offer core
Heart unit；Base unit is provided, surface is made of Cu；Base unit is engaged to the every of core cell using engagement member
Side；Surface by making base unit becomes Zn to form replacement layer；Form the first coating, replacement layer on by plating by
First metal material is made；And formed the second coating, on the first coating by plating by with the first metal material not
With second metal material be made.
Core cell can be made of insulating material.The manufacturing method may also include that be formed across core cell, engagement member
With the through-hole of base unit；And metal layer is formed, for exposure core list as made by insulating materials in plated-through hole
The section of member and engagement member, wherein replacement layer is formed not including the region of metal layer.Replacement layer formation may include by
The thickness of replacement layer is formed as the thickness equal to or more than metal layer.Base unit may be arranged so that Cu film passes through Al layers of table
Surface treatment is arranged on Al layers of surface, and wherein the manufacturing method may include providing Al layers, being formed on Al layers and to be formed
Zn film, form the Ni film formed on Zn film by plating and form the Cu film formed on Ni film by plating.
Core cell may be arranged so that Cu film and be arranged on Al layers of surface by Al layers of surface treatment.Core list
The offer of member may include providing Al layers, being formed in the Zn film formed on Al layer, form the Ni film formed on Zn film by plating
And form the Cu film formed on Ni film by plating.The manufacturing method further includes forming core pattern in core cell.Core
The formation of heart pattern may include being formed to be arranged along pattern across Al layers at least one hole and at least one hole or rule
Ground is irregularly arranged.The manufacturing method may also include that be formed across the logical of core cell, engagement member and base unit
Hole；And metal layer is formed, for the section of exposure engagement member in plated-through hole, wherein replacement layer can not include metal
The region of layer is formed.The formation of replacement layer may include the thickness be formed as the thickness for replacing layer equal to or more than metal layer.
Base unit may be arranged so that Cu film and be arranged on Al layers of surface by Al layers of surface treatment, and the wherein manufacture
Method may include provide Al layer, be formed in the Zn film formed on Al layer, formation passes through the Ni film that is formed on Zn film of plating and
Form the Cu film formed on Ni film by plating.Base unit may include Cu plate.
Engagement member may include polyimide-based joint fastener or epoxy resin-matrix joint fastener.
First coating can be formed by electroless plating or plating.First coating may include choosing from Ni, Au and Ag
At least one metal.
Second coating can be formed by being electroplated.Second coating can be made of Cu.
The manufacturing method, which may additionally include, forms circuit pattern on the second coating, wherein the formation of circuit pattern may include
Apply dry film, exposure dry film on second coating and by using selected any from iron chloride, copper chloride and sodium chlorate
Hydrochloric acid-base etch to etch the second coating.
The offer of core cell and carry out engaging substrate unit using engagement member and may be repeated repeatedly, is consequently formed more
Layer structure.
Effect
Embodiment according to the invention, the laminated of aluminium (Al) can be used to realize for various types of circuits, and therefore may be used
Simplify product by integrating various circuits.
In addition, embodiment according to the invention, since copper film is formed on the surface Al, so can be connect using what is generally used
Close component.Correspondingly, engaging force can increase, while manufacturing time and cost reduce.
In addition, embodiment according to the invention, since Al is laminated, the radiation efficiency of printed circuit board (PCB) and bending resistance
Intensity can increase.In addition, in harsh environments, for example in the car, the destruction or rupture of PCB can be prevented, and can increase
Add the reliability of product.
In addition, embodiment according to the invention, the weight of the electronic component for automobile can be come by using lighter Al
Reduce.
Detailed description of the invention
Example embodiment is described below in conjunction with the accompanying drawings, these and/or other aspects of the invention, feature and excellent
Point will become obvious and it is more readily appreciated that attached drawing includes:
Fig. 1 to Figure 13 is the letter for showing the manufacturing method of printed circuit board (PCB) of one embodiment according to the invention
Figure；And
Figure 14 to Figure 22 is the schematic diagram for showing the manufacturing method of PCB of another embodiment according to the invention.
Specific embodiment
It reference will now be made in detail to example embodiment of the invention now, its example is shown in the drawings, wherein similar reference label
Similar components are indicated in the whole text.
Below with reference to Fig. 1 to Figure 13 detailed description for including made by forming copper (Cu) film on the surface aluminium (Al)
At core cell 100 printed circuit board (PCB) manufacturing method.In the following description, it will be understood that when layer is said to be
Another layer ' on ' when, it can be arranged on either one or two of the upper side and lower side of layer.In addition, term ' hole ' can not only have circle
Tee section, but also have or with any of other polygonal cross-sections.
Firstly, preparing core cell 100.Core cell 100 can be made of aluminium (Al).Core cell 100 can be according to as follows
Mode configures: so that copper film 104 is by predetermined surface processing, made by the Al layers of foil as predetermined thickness core layer 101
Upper formation.Specifically, core cell 100 may include zinc (Zn) film being sequentially deposited in the Al core layer 101 of predetermined thickness
102, nickel (Ni) film 103 and Cu film 104.The structure and manufacturing method of core cell 100 will now be described.
As shown in Figure 1, preparation core layer 101, is the Al layers of foil with predetermined thickness.
As shown in Fig. 2, execute zincic acid salt treatment by surface for core layer 101, Zn film is formed with predetermined thickness
102.It can be by the segment thickness on the surface of core layer 101 be replaced with Zn, to form Zn film 102.Zn film 102 can prevent Al core
Central layer 101 aoxidizes in air, and the surface of core layer 101 is protected during the plating or electroless plating executed hereafter.
As shown in figure 3, by executing plating on Zn film 102, to form Ni film 103.It can be together with electroless plating method
By requiring the plating compared with low production cost, to form Ni film 103.But operating condition is depended on, it can be by by Zn film 102
Plating replace with Ni, to form Ni film 103.In this case, the part or whole thickness of Zn film 102 can be replaced Ni film
103.Although in the above-described embodiments, Ni is used to have its of high chemical resistance in the formation Ni film 103 on Zn film 102
Its metal, such as golden (Au) and silver-colored (Ag) can be used to replace Ni.But since Au and Ag ratio Ni is more expensive, so in the present embodiment
It is middle to use Ni.
As shown in figure 4, Cu film 104 is formed on Ni film 103 by plating.For example, Cu film 104 is formed as about 20 μ
The thickness of m.The thickness of Cu film 104 can be controlled according to electrical characteristics.
By process referring to figs. 1 to 4, can be formed on Al includes the core with the Cu film 104 of predetermined thickness
Heart unit 100.Therefore, because the surface of core cell 100 includes Cu film 104, so compared with when Al is used only, joint efficiency
It can increase.Therefore, general engagement member 111 can be used.
As shown in figure 5, forming the core pattern 105 including at least one hole in core cell 100.But do not limit to
In the present embodiment, core pattern 105 can be omitted from core cell 100 and core cell 100 can be used as pattern.
For example, core pattern 105 can be by according to multiple holes set by predetermined pattern or regularly or irregularly
Multiple holes for being arranged configure.Core pattern 105 can form predetermined circuit patterns on core cell 100.In addition, core pattern
105 can enhance the heat radiation of core cell 100.Herein, core pattern 105 can pass through chemistry or machine on core cell 100
Tool method is formed.For example, core pattern 105 can be formed by chemical etching.Alternatively, core pattern 105 can pass through punching
Pressure is to form.
As shown in Figure 6 A and 6 B, base unit 112 is joined to every side of core cell 100 using engagement member 111.
In the state that engagement member 111 is placed between core cell 100 and base unit 112, the heat of predetermined temperature and pressure applies
To core cell 100 and base unit 112, thus core cell 100 and base unit 112 are interconnected.
The surface of base unit 112 is made of Cu.For example, as shown in Figure 6A, handling institute by executing predetermined surface to Al
The Al material of preparation can be used for base unit 112 according to mode identical with core cell 110.As above by reference to Fig. 1 to Fig. 4 institute
Show, base unit 112 may include the Zn film 1122, Ni film 1123 and Cu being sequentially deposited on the Al film 1121 with predetermined thickness
Film 1124.Due to forming the Al layer 1121 of base unit 112 to the process and the process phase of formation core cell 100 of Cu film 1124
Together, so the description in relation to the process will not repeated.But the invention is not limited to the present embodiment.As shown in Figure 6B, such as
Base unit 112 can be formed by taking the single cu layer 1125 of the form of Cu plate or Cu foil with predetermined thickness.
For example, engagement member 111 can by the polyimide-based insulation bonding sheet with high Joint Properties and insulation function
It realizes or epoxy resin-matrix grafting material, such as glass epoxy resin can be used as engagement member 111.Engagement member 111 can have
There is thermal expansion coefficient similar with base unit 112.According to one embodiment, since the surface of base unit 112 is made of Cu,
So the adhesive for being generally used for Cu can be used as engagement member 111.According to embodiment, the radiation efficiency and bending strength of PCB
It can be increased by using Al.In addition, since general grafting material is used as engagement member 111, so engaging force can increase, together
When manufacturing time and manufacturing cost reduce.Then, as shown in fig. 7, passing through core cell 100, engagement member 111 and base unit
112 through-hole 113 can be formed in the state that base unit 112 is joined to core cell 100.For example, through-hole 113 can pass through brill
Hole or laser processing are to form.
As shown in figure 8, forming metal layer 114, being used to metallize is exposed to the engagement member of the inner surface of through-hole 113
111 exposed parts.For example, metal layer 114, which can be, is formed by carbon-coating by the direct plating of carbon.By metal layer 114, by
The core cell 100 that engagement member 111 is electrically insulated can be with the base unit 112 for the upper and lower part that core cell 100 is arranged in
Electrical connection.In addition, as shown in figure 9, metal layer 114 can not extend only into the section of engagement member 111, and even also extend
To the part of core cell 100 and the part of base unit 112, so that core cell 100 and base unit 112 are electrically connected.
As shown in figure 9, replacement layer 115 can execute zincic acid salt treatment by the surface for base unit 112, to be formed as
Predetermined thickness.For example, can be by the way that the part of the surface of base unit 112 be replaced with Zn, to form replacement layer 115.Replace layer 115
It may be provided at the section and the section of core cell 100 of base unit 112, i.e. in the surface of base unit 112 and through-hole 113
It does not include the inside of metal layer 114.Replacement layer 115 thickness can be equal to or greater than metal layer 114 thickness.In the present embodiment
In, by the way that a part of the thickness of base unit 112 is replaced with Zn (as shown in the reference label 115a in Fig. 9), to be formed
Replace layer 115.But, it is not limited to the present embodiment, the whole thickness of base unit 112 can be replaced replacement layer 115.Replacement
The thickness of layer 115 and the thickness of the part 115a replaced from base unit 112 can change.
According to the present embodiment, the aerial oxidation of base unit 112 as made by Al can be prevented by replacing layer 115, and
And the corrosion on the surface of the base unit 112 during also preventing hereafter electroless plating to be executed and being electroplated.
As shown in Figure 10, plating is executed to replacement layer 115 using the metal with high chemical resistance, the first plating is consequently formed
Layer 116.First coating 116 can be not only on replacement layer 115 but also set by the inside of through-hole 113 metal layer 114
It is formed on surface.First coating 116 can be formed by electroless plating or plating.For example, the first coating 116 can pass through the electricity of Ni
Plating is to form.But the material of the first coating 116 is not limited to Ni.Other materials, such as Au with high chemical resistance or
Ag can be used as the first coating 116.
As shown in figure 11, the second coating 117 can be come on the first coating 116 using the metal different from the first coating 116
It is formed.For example, the second coating 117 can be and be formed by Cu film by using the plating of Cu.
As shown in figure 12, the dry film 118 including predetermined pattern 119 can be applied on the surface of the second coating 117.For example,
Predetermined pattern 119 can be printed on the surface of dry film 118 by the exposure and imaging of predetermined time.
As shown in figure 13, the second coating 117, the first coating 116, replacement layer can be removed by the pattern 119 along dry film 118
115 and base unit 112, to form circuit pattern 120.Dry film 118 is removed after forming circuit pattern 120, is thus manufactured
PCB.It can be etched by the hydrochloric acid-base of the pattern 119 based on dry film 118, to form circuit pattern 120.For example, iron chloride, chlorination
Copper, sodium chlorate etc. can be used as hydrochloric acid-base etching.But, it is not limited to above-mentioned example, it can be not only by using 118 He of dry film
The chemical method of hydrochloric acid-base etching, but also by mechanical means, such as punching press, to form circuit pattern 120.
Although showing single core cell 100 in the above-described embodiments, the present invention is not limited thereto attached drawing.Cause
This, core cell 100, engagement member 111 and base unit 112 can deposit on multilayered structure repeatedly.Even using multiple
When core cell 100 and base unit 112, through-hole 113, metal layer 114, replacement layer 115, the first coating 116 and second are formed
The process of coating 117 can also be executed according to same way.
The electronic component of automobile is applicable to according to PCB manufactured by the present embodiment.
The manufacturing method of the PCB of another embodiment according to the invention is described below with reference to Figure 14 to Figure 22.It removes
Except the material of core cell, be described below in embodiment it is with the embodiment of Fig. 1 to Figure 13 substantially the same.Therefore, phase
It will be indicated, and will not be repeated by similar names like element.
As shown in figure 14, core cell 200 is made.Core cell 200 can be made of insulating material.
As shown in figure 15, base unit 212 is joined to every side of core cell 200 using engagement member 211.It is engaging
Component 211 is placed in the state between core cell 200 and base unit 212, and the heat of predetermined temperature and pressure is applied to core
Core cell 200 and base unit 212, are thus interconnected by unit 200 and base unit 212.For example, engagement member 211
It can be by polyimide-based insulation bonding sheet or epoxy resin-matrix grafting material, such as with high Joint Properties and insulation function
Glass epoxy resin is realized.Engagement member 211 can have thermal expansion coefficient similar with base unit 212.
It can be used for base unit 212 including the Al by being formed by Cu film to the processing of predetermined surface performed by Al.Such as
Referring to figs. 1 to described in Fig. 4, Zn layer 2122, Ni layer 2123 and Cu film 2124 can be successively set on the Al layer with predetermined thickness
On 2121 surface.Since the Al layer 2121 and Cu film 2124 of base unit 212 pass through and the core cell 100 of Fig. 1 to Fig. 4
Manufacturing process identical process is formed, so omission is repeated.
As shown in figure 16, it in the state that base unit 212 is joined to core cell 200, formed across core 200, connect
Close the through-hole 213 of component 211 and base unit 212.For example, through-hole 213 can be formed by drilling or laser machining.
As shown in figure 17, metal layer 214 is formed, being used to metallize is exposed to the core cell of the inner surface of through-hole 213
The exposed parts of (it is made of insulating material) and engagement member 211.By metal layer 214, core cell 200 is set
On two sides and the base unit 212 of electrical isolation can be electrically connected to each other.For example, metal layer 214 can be by conformal via direct plating
It is formed at carbon-coating, and extends to the part of base unit 212, so that core cell 200 is connected with each other.
As shown in figure 18, replacement layer 215 can execute zincic acid salt treatment by the surface for base unit 212, to be formed
For predetermined thickness.For example, can be by the way that the part of the surface of base unit 212 be replaced with Zn, to form replacement layer 215.Replace layer
215 may be provided at do not include in through-hole 213 metal layer 214 the inside.The thickness of replacement layer 215 can be equal to or be greater than metal layer
214 thickness.In the present embodiment, replacement layer 215 can prevent the aerial oxidation of base unit 212 as made by Al,
And the corrosion on the surface of the base unit 212 during also preventing hereafter electroless plating to be executed and being electroplated.
As shown in figure 19, plating can be executed to replacement layer 215 by using the metal with high chemical resistance, to form the
One coating 216.First coating 216 can be not only on replacement layer 215 but also the metal layer set by the inside of through-hole 213
It is formed on 214 surface.First coating 216 can be formed by plating or electroless plating.For example, the first coating 216 can lead to
The plating of Ni is crossed to be formed.But the material of the first coating 216 is not limited to Ni.Other materials with high chemical resistance,
Such as Au or Ag can be used as the first coating 216.
As shown in figure 20, the second coating 217 can be come on the first coating 216 using the metal different from the first coating 216
It is formed.For example, the second coating 217 can be and be formed by Cu film by using the plating of Cu.
As shown in figure 21, the dry film 218 including predetermined pattern 219 can be applied on the surface of the second coating 217.Predetermined figure
Case 219 can be formed by the exposure and imaging of predetermined time.
As shown in figure 22, the second coating 217, the first coating 216, replacement layer can be removed by the pattern 219 along dry film 218
215 and base unit 212, to form circuit pattern 220.Dry film 218 is removed after forming circuit pattern 220, is thus manufactured
PCB.It can be etched by the hydrochloric acid-base of the pattern 219 based on dry film 218, to form circuit pattern 220.For example, iron chloride, chlorination
Copper, sodium chlorate etc. can be used as hydrochloric acid-base etching.But, it is not limited to above-mentioned example, it can be not only by using 218 He of dry film
The chemical method of hydrochloric acid-base etching, but also by mechanical means, such as punching press, to form circuit pattern 220.
Although core cell 100 is shown as single layer in the above-described embodiments, the present invention is not limited thereto attached drawing.Cause
This, core cell 200, engagement member 211 and base unit 212 can deposit on multilayered structure repeatedly.Even using multiple
When core cell 200 and base unit 212, through-hole 213, metal layer 214, replacement layer 215, the first coating 216 and second are formed
The process of coating 217 can also be executed according to same way.
The electronic component of automobile is applicable to according to PCB manufactured by the present embodiment.
Although the description of the manufacturing method for the PCB for including through-hole, but the present invention is not limited thereto.The above method is even
It can also be applied according to same way when omitting through-hole.
Although several example embodiments of the invention have shown and described, it is real that the invention is not limited to the demonstrations
Apply example.Those skilled in the art but it will be appreciated that these example embodiments can be changed, without departing from of the invention
Principle and spirit, the scope of the present invention are limited by claim and its equivalent.
Claims (20)
1. a kind of printed circuit board (PCB), comprising:
Core cell；
Base unit, surface are made of copper (Cu)；
Engagement member is arranged between the core cell and the base unit, by base unit engagement to institute
State every side of core cell；
Layer is replaced, is formed by making the surface of the base unit become zinc (Zn)；
First coating is made of plating of the first metal material on the replacement layer；And
Second coating, by plating by second metal material different from first metal material on first coating
It is made,
Wherein,
Through-hole is formed across the core cell, the engagement member and the base unit,
Metal layer is formed, with the section of the exposure core cell and the engagement member in the through-hole that metallizes, and
The replacement layer is formed not including the region of the metal layer.
2. printed circuit board (PCB) as described in claim 1, wherein the core cell is made of insulating material.
3. printed circuit board (PCB) as described in claim 1, wherein the thickness of the replacement layer is equal to or more than the gold
Belong to the thickness of layer.
4. printed circuit board (PCB) as claimed in claim 2, wherein
The base unit is arranged so that the top on Al layers of the surface is arranged in by Al layer be surface-treated in Cu film,
And
The base unit includes:
It is Al layers described；
The Zn film formed on the Al layer；
Nickel (Ni) film is formed by by plating on the Zn film；And
The Cu film is formed by by plating on the nickel (Ni) film.
5. printed circuit board (PCB) as described in claim 1, wherein the core cell is arranged so that Cu film by Al
Layer is surface-treated the top on Al layers of the surface is arranged in.
6. printed circuit board (PCB) as described in claim 1, wherein the core cell includes:
Al layers；
The Zn film formed on the Al layer；
Ni film is formed by by plating on the Zn film；And
Cu film is formed by by plating on the Ni film.
7. printed circuit board (PCB) as claimed in claim 5, wherein the core cell include across described Al layers extremely
A few hole and at least one described hole are arranged along pattern or are regularly or irregularly arranged.
8. printed circuit board (PCB) as claimed in claim 5, wherein the thickness of the replacement layer is equal to or more than the gold
Belong to the thickness of layer.
9. printed circuit board (PCB) as claimed in claim 5, wherein
The base unit is arranged so that the top on Al layers of the surface is arranged in by Al layer be surface-treated in Cu film,
And
The base unit includes:
It is Al layers described；
The Zn film formed on the Al layer；
Ni film is formed by by plating on the Zn film；And
The Cu film is formed by by plating on the Ni film.
10. printed circuit board (PCB) as claimed in claim 5, wherein the base unit includes Cu plate.
11. printed circuit board (PCB) as described in claim 1, wherein the engagement member includes polyimide-based joint fastener
Or epoxy resin-matrix joint fastener.
12. printed circuit board (PCB) as described in claim 1, wherein first coating by electroless plating or plating come
It is formed.
13. printed circuit board (PCB) as claimed in claim 12, wherein first coating includes from nickel (Ni), golden (Au)
With at least one metal chosen in silver-colored (Ag).
14. printed circuit board (PCB) as described in claim 1, wherein second coating is formed by being electroplated.
15. printed circuit board (PCB) as claimed in claim 14, wherein second coating includes Cu.
16. printed circuit board (PCB) as described in claim 1 further includes the circuit pattern formed on second coating.
17. printed circuit board (PCB) as claimed in claim 16, wherein by applying dry film on second coating, holding
Row exposes and using any one of iron chloride, copper chloride and sodium chlorate, to form the circuit pattern.
18. printed circuit board (PCB) as described in claim 1, wherein core cell, the engagement structure described in deposition multilayer
Part and the base unit.
19. one kind is used for the manufacturing method of printed circuit board (PCB), the manufacturing method includes:
Core cell is provided；
Base unit is provided, surface is made of copper (Cu)；
The base unit is engaged to every side of the core cell using engagement member；
The surface by making the base unit becomes zinc (Zn) to form replacement layer；
It is formed on the replacement layer through plating first coating as made by the first metal material；And
It is formed on first coating through plating as made by second metal material different from first metal material
The second coating,
Wherein, the core cell is made of insulating material,
The manufacturing method further include:
It is formed across the core cell, the through-hole of the engagement member and the base unit；And
Metal layer is formed, for described as made by the insulating materials core cell of exposure in the through-hole that metallizes and described
The section of engagement member,
Wherein the replacement layer is formed not including the region of the metal layer.
20. one kind is used for the manufacturing method of printed circuit board (PCB), the manufacturing method includes:
Core cell is provided；
Base unit is provided, surface is made of copper (Cu)；
The base unit is engaged to every side of the core cell using engagement member；
The surface by making the base unit becomes zinc (Zn) to form replacement layer；
It is formed on the replacement layer through plating first coating as made by the first metal material；And
It is formed on first coating through plating as made by second metal material different from first metal material
The second coating,
Wherein, the core cell is arranged so that Cu film by Al layers of surface treatment Al layers of the surface is arranged in
Top,
The manufacturing method further include:
It is formed across the core cell, the through-hole of the engagement member and the base unit；And
Metal layer is formed, with the section for the exposure engagement member in the through-hole that metallizes,
Wherein the replacement layer is formed not including the region of the metal layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130040367A KR20140123273A (en) | 2013-04-12 | 2013-04-12 | Printed circuit board and manufacturing method thereof |
| KR10-2013-0040367 | 2013-04-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104105334A CN104105334A (en) | 2014-10-15 |
| CN104105334B true CN104105334B (en) | 2018-12-14 |
Family
ID=51673023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410144076.1A Expired - Fee Related CN104105334B (en) | 2013-04-12 | 2014-04-11 | Printed circuit board and manufacturing methods |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20140123273A (en) |
| CN (1) | CN104105334B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017179748A1 (en) * | 2016-04-15 | 2017-10-19 | 손경애 | Method for manufacturing printed circuit board and printed circuit board manufactured by same method |
| US10892086B2 (en) * | 2017-09-26 | 2021-01-12 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
| JP7478742B2 (en) * | 2019-01-07 | 2024-05-07 | テスラ，インコーポレイテッド | PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS - Patent application |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630459A (en) * | 1996-12-19 | 2005-06-22 | 揖斐电株式会社 | Printed wiring board and method for manufacturing the same |
| CN1842254A (en) * | 2005-03-29 | 2006-10-04 | 日立电线株式会社 | Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor |
| CN1922340A (en) * | 2004-02-17 | 2007-02-28 | 泰科印刷电路集团有限公司 | Method of electroplating on aluminum |
| CN101654798A (en) * | 2008-08-21 | 2010-02-24 | 上村工业株式会社 | Method of surface treatment for aluminum or aluminum alloy |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045889A (en) * | 1990-04-23 | 1992-01-09 | Matsushita Electric Works Ltd | Printed wiring board |
| JP4327774B2 (en) * | 2005-07-21 | 2009-09-09 | 富士ネームプレート株式会社 | Printed wiring board and manufacturing method thereof |
-
2013
- 2013-04-12 KR KR20130040367A patent/KR20140123273A/en active IP Right Grant
-
2014
- 2014-04-11 CN CN201410144076.1A patent/CN104105334B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630459A (en) * | 1996-12-19 | 2005-06-22 | 揖斐电株式会社 | Printed wiring board and method for manufacturing the same |
| CN1922340A (en) * | 2004-02-17 | 2007-02-28 | 泰科印刷电路集团有限公司 | Method of electroplating on aluminum |
| CN1842254A (en) * | 2005-03-29 | 2006-10-04 | 日立电线株式会社 | Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor |
| CN101654798A (en) * | 2008-08-21 | 2010-02-24 | 上村工业株式会社 | Method of surface treatment for aluminum or aluminum alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104105334A (en) | 2014-10-15 |
| KR20140123273A (en) | 2014-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9295150B2 (en) | Method for manufacturing a printed circuit board | |
| CN101583239A (en) | Component-embedded printed circuit board, manufacture method thereof and electronic apparatus containing the same | |
| US9769921B2 (en) | Printed circuit board and manufacturing method therefor | |
| JP2014027284A (en) | Printed circuit board and manufacturing method of the same | |
| US6703564B2 (en) | Printing wiring board | |
| CN103687344A (en) | Circuit board manufacturing method | |
| JP2007281480A (en) | Printed-circuit board using bump, and its manufacturing method | |
| US10342126B2 (en) | Electronic device having a liquid crystal polymer solder mask and related devices | |
| JP2014502792A (en) | Electronic device having liquid crystal polymer solder mask and outer seal layer and related method | |
| US9655236B2 (en) | Method to make a multilayer circuit board with intermetallic compound and related circuit boards | |
| CN104105334B (en) | Printed circuit board and manufacturing methods | |
| JP2010232249A (en) | Multilayer printed wiring board and manufacturing method of the same | |
| US10779414B2 (en) | Electronic component embedded printed circuit board and method of manufacturing the same | |
| JP2009111331A (en) | Printed-circuit substrate and manufacturing method therefor | |
| US20150282297A1 (en) | Printed Circuit Board | |
| US9788421B2 (en) | Printed circuit board and method of manufacturing same | |
| KR20130113376A (en) | Printed circuit board and manufacture method thereof | |
| KR101854626B1 (en) | Method for manufacturing pcb and pcb manufactured using the same | |
| KR101177651B1 (en) | Printed circuit board and method of manufacturing the same | |
| WO2013137401A1 (en) | Electronic component mounting substrate fabrication method and electronic component mounting substrate | |
| CN214228531U (en) | Copper-nickel alloy flexible circuit board | |
| JP2004072125A (en) | Manufacturing method of printed wiring board, and printed wiring board | |
| JP3628313B2 (en) | Printed wiring board and manufacturing method thereof | |
| CN110769670B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| KR101927479B1 (en) | Method for manufacturing pcb and pcb manufactured using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181214 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |