JP5080971B2 - 結晶製造装置に溶融ソース材料を装入する方法および溶融装置アッセンブリ - Google Patents
結晶製造装置に溶融ソース材料を装入する方法および溶融装置アッセンブリ Download PDFInfo
- Publication number
- JP5080971B2 JP5080971B2 JP2007516754A JP2007516754A JP5080971B2 JP 5080971 B2 JP5080971 B2 JP 5080971B2 JP 2007516754 A JP2007516754 A JP 2007516754A JP 2007516754 A JP2007516754 A JP 2007516754A JP 5080971 B2 JP5080971 B2 JP 5080971B2
- Authority
- JP
- Japan
- Prior art keywords
- crucible
- crystal
- assembly
- silicon
- melter assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013078 crystal Substances 0.000 title claims description 218
- 238000002844 melting Methods 0.000 title claims description 127
- 230000008018 melting Effects 0.000 title claims description 127
- 238000004519 manufacturing process Methods 0.000 title claims description 75
- 239000000463 material Substances 0.000 title claims description 75
- 238000000034 method Methods 0.000 title claims description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 149
- 229910052710 silicon Inorganic materials 0.000 claims description 147
- 239000010703 silicon Substances 0.000 claims description 147
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 90
- 239000000155 melt Substances 0.000 claims description 66
- 239000007787 solid Substances 0.000 claims description 55
- 238000010438 heat treatment Methods 0.000 claims description 39
- 230000006698 induction Effects 0.000 claims description 33
- 230000001427 coherent effect Effects 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 69
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 238000005266 casting Methods 0.000 description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 229910002804 graphite Inorganic materials 0.000 description 11
- 239000010439 graphite Substances 0.000 description 11
- 230000005484 gravity Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 7
- 238000011049 filling Methods 0.000 description 7
- 238000003032 molecular docking Methods 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000012768 molten material Substances 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000011856 silicon-based particle Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Developing Agents For Electrophotography (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58130804P | 2004-06-18 | 2004-06-18 | |
| US60/581,308 | 2004-06-18 | ||
| US11/155,104 | 2005-06-17 | ||
| US11/155,105 | 2005-06-17 | ||
| US11/155,385 US7691199B2 (en) | 2004-06-18 | 2005-06-17 | Melter assembly and method for charging a crystal forming apparatus with molten source material |
| US11/155,385 | 2005-06-17 | ||
| US11/155,104 US7465351B2 (en) | 2004-06-18 | 2005-06-17 | Melter assembly and method for charging a crystal forming apparatus with molten source material |
| US11/155,105 US7344594B2 (en) | 2004-06-18 | 2005-06-17 | Melter assembly and method for charging a crystal forming apparatus with molten source material |
| PCT/US2005/021369 WO2006009802A2 (en) | 2004-06-18 | 2005-06-17 | A melter assembly and method for charging a crystal forming apparatus with molten source material |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008503427A JP2008503427A (ja) | 2008-02-07 |
| JP2008503427A5 JP2008503427A5 (enExample) | 2008-09-04 |
| JP5080971B2 true JP5080971B2 (ja) | 2012-11-21 |
Family
ID=35351655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007516754A Expired - Fee Related JP5080971B2 (ja) | 2004-06-18 | 2005-06-17 | 結晶製造装置に溶融ソース材料を装入する方法および溶融装置アッセンブリ |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1756337B1 (enExample) |
| JP (1) | JP5080971B2 (enExample) |
| KR (1) | KR101300309B1 (enExample) |
| CN (2) | CN101724903B (enExample) |
| DE (1) | DE602005014103D1 (enExample) |
| TW (1) | TWI347377B (enExample) |
| WO (1) | WO2006009802A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017014073A (ja) * | 2015-07-02 | 2017-01-19 | 株式会社Sumco | シリコン融液供給装置及び方法並びにシリコン単結晶製造装置 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1958925A1 (en) | 2007-02-13 | 2008-08-20 | Vivoxid Oy | A system and method for manufacturing fibres |
| DE102008013326B4 (de) * | 2008-03-10 | 2013-03-28 | Siltronic Ag | Induktionsheizspule und Verfahren zum Schmelzen von Granulat aus Halbleitermaterial |
| JP5152328B2 (ja) * | 2008-05-20 | 2013-02-27 | 信越半導体株式会社 | 単結晶製造装置 |
| JP5163386B2 (ja) * | 2008-09-17 | 2013-03-13 | 株式会社Sumco | シリコン融液形成装置 |
| DE102009005837B4 (de) * | 2009-01-21 | 2011-10-06 | Pv Silicon Forschungs Und Produktions Gmbh | Verfahren und Vorrichtung zur Herstellung von Siliziumdünnstäben |
| DE102011007149A1 (de) * | 2011-04-11 | 2012-10-11 | Streicher Maschinenbau GmbH & Co. KG | Verfahren und Vorrichtung zur Herstellung von Material mit mono- oder multikristalliner Struktur |
| EP2522764A3 (en) * | 2011-05-12 | 2013-08-14 | Korea Institute of Energy Research | Reusable dual crucible for silicon melting and manufacturing apparatus of silicon thin film including the same |
| CN102718221B (zh) * | 2012-06-28 | 2014-06-11 | 厦门大学 | 多晶硅自封堵浇铸装置 |
| US9664448B2 (en) * | 2012-07-30 | 2017-05-30 | Solar World Industries America Inc. | Melting apparatus |
| DE102013203740B4 (de) * | 2013-03-05 | 2020-06-18 | Solarworld Industries Gmbh | Vorrichtung und Vefahren zur Herstellung von Silizium-Blöcken |
| JP6372079B2 (ja) * | 2013-12-27 | 2018-08-15 | シンフォニアテクノロジー株式会社 | 加熱溶解装置、加熱溶解システムおよび出湯制御装置 |
| US10030317B2 (en) * | 2014-10-17 | 2018-07-24 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and method for controlling thickness of a crystalline sheet grown on a melt |
| KR101671593B1 (ko) * | 2014-12-31 | 2016-11-01 | 주식회사 티씨케이 | 잉곳 성장장치의 리플렉터 |
| TWI630365B (zh) * | 2016-11-11 | 2018-07-21 | 財團法人金屬工業研究發展中心 | Radon device with temperature control design and temperature control method thereof |
| KR102135061B1 (ko) * | 2017-12-21 | 2020-07-17 | 주식회사 포스코 | 고휘발성 원소의 표준 시료 제조 장치 및 방법 |
| CN111041554B (zh) * | 2020-01-16 | 2021-05-25 | 江苏大学 | 一种用于晶硅铸锭炉的载气导流装置及其导流方法 |
| US12480853B2 (en) * | 2021-09-28 | 2025-11-25 | University Of Central Florida Research Foundation, Inc. | Crucibles for thermogravimetric analysis (TGA) |
| CN115852484B (zh) * | 2023-02-27 | 2023-05-16 | 杭州天桴光电技术有限公司 | 一种高效制备氟化镁多晶光学镀膜材料的装置和方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4106589C2 (de) * | 1991-03-01 | 1997-04-24 | Wacker Siltronic Halbleitermat | Kontinuierliches Nachchargierverfahren mit flüssigem Silicium beim Tiegelziehen nach Czochralski |
| US5178719A (en) * | 1991-08-20 | 1993-01-12 | Horiba Instruments, Inc. | Continuous refill crystal growth method |
| US5993540A (en) * | 1995-06-16 | 1999-11-30 | Optoscint, Inc. | Continuous crystal plate growth process and apparatus |
| US6800137B2 (en) * | 1995-06-16 | 2004-10-05 | Phoenix Scientific Corporation | Binary and ternary crystal purification and growth method and apparatus |
| JPH10279390A (ja) * | 1997-02-04 | 1998-10-20 | Komatsu Electron Metals Co Ltd | 石英るつぼへの原料装填装置及び原料装填方法 |
| JPH1192276A (ja) * | 1997-09-22 | 1999-04-06 | Super Silicon Kenkyusho:Kk | 半導体単結晶の製造装置及び半導体単結晶の製造方法 |
| FR2772741B1 (fr) * | 1997-12-19 | 2000-03-10 | Centre Nat Rech Scient | Procede et installation d'affinage du silicium |
| US6402840B1 (en) * | 1999-08-10 | 2002-06-11 | Optoscint, Inc. | Crystal growth employing embedded purification chamber |
| FR2831881B1 (fr) * | 2001-11-02 | 2004-01-16 | Hubert Lauvray | Procede de purification de silicium metallurgique par plasma inductif couple a une solidification directionnelle et obtention directe de silicium de qualite solaire |
| FR2869028B1 (fr) * | 2004-04-20 | 2006-07-07 | Efd Induction Sa Sa | Procede et installation de fabrication de blocs d'un materiau semiconducteur |
-
2005
- 2005-06-17 DE DE602005014103T patent/DE602005014103D1/de not_active Expired - Lifetime
- 2005-06-17 EP EP05788988A patent/EP1756337B1/en not_active Expired - Lifetime
- 2005-06-17 KR KR1020077001156A patent/KR101300309B1/ko not_active Expired - Fee Related
- 2005-06-17 JP JP2007516754A patent/JP5080971B2/ja not_active Expired - Fee Related
- 2005-06-17 WO PCT/US2005/021369 patent/WO2006009802A2/en not_active Ceased
- 2005-06-17 CN CN2009102657267A patent/CN101724903B/zh not_active Expired - Fee Related
- 2005-06-17 CN CN2005800280995A patent/CN101006205B/zh not_active Expired - Fee Related
- 2005-06-20 TW TW094120512A patent/TWI347377B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017014073A (ja) * | 2015-07-02 | 2017-01-19 | 株式会社Sumco | シリコン融液供給装置及び方法並びにシリコン単結晶製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101006205B (zh) | 2011-11-09 |
| WO2006009802A2 (en) | 2006-01-26 |
| WO2006009802A3 (en) | 2006-08-24 |
| CN101724903A (zh) | 2010-06-09 |
| TW200617220A (en) | 2006-06-01 |
| JP2008503427A (ja) | 2008-02-07 |
| EP1756337A2 (en) | 2007-02-28 |
| EP1756337B1 (en) | 2009-04-22 |
| CN101006205A (zh) | 2007-07-25 |
| DE602005014103D1 (de) | 2009-06-04 |
| KR101300309B1 (ko) | 2013-08-28 |
| CN101724903B (zh) | 2013-02-13 |
| KR20070042971A (ko) | 2007-04-24 |
| TWI347377B (en) | 2011-08-21 |
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