JP5079192B2 - 可撓性基板上への半導体チップの取り付け方法及び装置 - Google Patents

可撓性基板上への半導体チップの取り付け方法及び装置 Download PDF

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Publication number
JP5079192B2
JP5079192B2 JP2001197085A JP2001197085A JP5079192B2 JP 5079192 B2 JP5079192 B2 JP 5079192B2 JP 2001197085 A JP2001197085 A JP 2001197085A JP 2001197085 A JP2001197085 A JP 2001197085A JP 5079192 B2 JP5079192 B2 JP 5079192B2
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JP
Japan
Prior art keywords
substrate
flexible substrate
adhesive
semiconductor chip
heating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001197085A
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English (en)
Japanese (ja)
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JP2002050643A (ja
JP2002050643A5 (https=
Inventor
ルネ・ヨセフ・ウルリッヒ
Original Assignee
エセック・アーゲー
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Publication date
Application filed by エセック・アーゲー filed Critical エセック・アーゲー
Publication of JP2002050643A publication Critical patent/JP2002050643A/ja
Publication of JP2002050643A5 publication Critical patent/JP2002050643A5/ja
Application granted granted Critical
Publication of JP5079192B2 publication Critical patent/JP5079192B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting

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  • Die Bonding (AREA)
JP2001197085A 2000-07-03 2001-06-28 可撓性基板上への半導体チップの取り付け方法及び装置 Expired - Fee Related JP5079192B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20000810577 EP1170787A1 (de) 2000-07-03 2000-07-03 Verfahren und Einrichtung zur Montage von Halbleiterchips auf einem flexiblen Substrat
EP00810577.7 2000-07-03

Publications (3)

Publication Number Publication Date
JP2002050643A JP2002050643A (ja) 2002-02-15
JP2002050643A5 JP2002050643A5 (https=) 2008-08-14
JP5079192B2 true JP5079192B2 (ja) 2012-11-21

Family

ID=8174785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001197085A Expired - Fee Related JP5079192B2 (ja) 2000-07-03 2001-06-28 可撓性基板上への半導体チップの取り付け方法及び装置

Country Status (2)

Country Link
EP (1) EP1170787A1 (https=)
JP (1) JP5079192B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10245398B3 (de) 2002-09-28 2004-06-03 Mühlbauer Ag Vorrichtung und Verfahren zur Aufbringung von Halbleiterchips auf Trägern
KR100673543B1 (ko) * 2006-02-15 2007-01-25 노드슨상산 주식회사 연료전지용 전해질막 큐어링장치
US8444328B2 (en) 2009-12-11 2013-05-21 International Business Machines Corporation Electro-optical assembly fabrication

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63114220A (ja) * 1986-10-31 1988-05-19 Matsushita Electric Ind Co Ltd チツプボンデイング装置
JPS6384939U (https=) * 1986-11-21 1988-06-03
JPS63190400A (ja) * 1987-02-03 1988-08-05 株式会社東芝 フレキシブルプリント基板位置決め装置
JPH0250441A (ja) * 1988-08-12 1990-02-20 Nec Kyushu Ltd 半導体製造装置
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
US5548091A (en) * 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
JPH11121499A (ja) * 1997-10-13 1999-04-30 Matsushita Electron Corp 半導体装置の製造方法および製造装置

Also Published As

Publication number Publication date
JP2002050643A (ja) 2002-02-15
EP1170787A1 (de) 2002-01-09

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