JP5069787B2 - マスキング材料を用いて基板上に機能材料のパターンを形成する方法 - Google Patents
マスキング材料を用いて基板上に機能材料のパターンを形成する方法 Download PDFInfo
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- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
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Images
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
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- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
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Description
以下の実施例は、マスキング材料を印刷するためのエラストマースタンプを使用して、パターンを基板上に形成する方法の実例である。銀ナノ粒子は、機能ソースドレインレベルの薄膜トランジスタを提供することのできる可撓性ベース上にパターンに形成された。
ヘキサメチルジシラザン薄層(HMDS)(Aldrich製)を、2インチ(5.1cm)のシリコンウェハに、3000rpmで60秒間スパンコートした。HMDSは、シリコンウェハ上のフォトレジスト材料のための接着促進剤である。Shipleyフォトレジスト、タイプ1811(Rohm and Haas製)を、HMDS層上に、3000rpmで60秒間スパンコートした。フォトレジストフィルムを、完全に乾燥するまで、ホットプレートで、115℃で1分間プリベークした。プリベークしたフォトレジストフィルムを、365nmの紫外線に、8秒間、I−ライナ(OAI Mask Aligner、型番200)に像様に露光した。露光後、フォトレジストを、水酸化テトラメチルアンモニウム(TMAH)溶液である現像液タイプMF−319(Rohm and Haas製)で、60秒間現像した。現像したフィルムを、希釈水で洗い、窒素で乾燥し、ホットプレートで、115℃まで5分間加熱して、レリーフパターンを備えたマスターを形成した。作製したマスターのレリーフパターンは、隆起表面領域とリセス領域とを有していた。マスターの隆起表面領域は、基板上に形成された機能銀材料のパターンとなるポジ画像を形成する。パターン化フォトレジストマスターの層の厚さは、表面プロファイラ(LKA−Tencor,San Jose,CA)により測定したところ1.1ミクロンであった。HMDSは、マスターのリセス領域に残った。
エラストマースタンプのための支持体を、UV硬化性の光学的に透明な接着剤、タイプNOA73(Norland Products;Cranbury,NJより購入)の層を、厚さ5ミクロンで、5ミル(0.0127cm)のMelinex(登録商標)561ポリエステルフィルム支持体上に、スピンコーティングにより、3000rpmで適用し、紫外線(350〜400nm)に、1.6ワット出力(20mワット/cm2)で、90秒間、窒素環境で露光により硬化することにより作製した。
500mLの丸底フラスコに、α−ヒドロキシメチルベンゾイン(20.14g)、トリエチルアミン(Fluka、8.40g)および塩化メチレン(100mL)を添加した。混合物を窒素正圧、室温で磁気的に攪拌した。別のフラスコに、HFPOダイマー酸フッ化物(32.98g)およびFreon−113(CFCl2CF2Cl、Aldrich、60mL)を添加した。酸フッ化物溶液を、攪拌しているα−ヒドロキシメチルベンゾイン溶液に、4〜5℃で、30分間にわたって、滴下して加えて、発熱反応を制御した。添加完了後、反応ポットを、2.5時間、室温で攪拌した。
Covion Super−Yellow(商標)、置換ポリフェニレン−ビニレン−1−4コポリマー(Merck製)の0.5重量%溶液のマスキング材料を、トルエンに溶解し、1.5−ミクロンPTFEフィルタを用いてろ過した。マスキング材料溶液を、作製したPFPEスタンプのレリーフ表面に、3000rpmで、60秒間、スパンコートした。溶液は、全レリーフ表面を被覆し、空気中、室温で約1分間乾燥させた。基板、5ミルのMelinex(登録商標)フィルムタイプST504を、65℃に維持したホットプレートに置いた。マスキング材料の層を有するPFPEスタンプを、追加の圧力を加えずに、基板のアクリル側に(ホットプレート上にしたままで)ラミネートした。スタンプおよび基板をホットプレートから外し、スタンプを、室温で基板から分離した。エラストマースタンプのレリーフパターンの隆起表面のマスキング材料は、基板に転写して、基板上にマスキングパターンを形成した。スタンプのリセス領域は、基板と接触しなかったため、基板は、マスキング材料のない開口領域を有していた。マスキング材料のパターンの、プロファイラにより測定した厚さは27nmであった。印刷犠牲マスキング材料のマスキングパターンは、マスター上のパターンの正パターンであった。
45%固体のタイプDGP−MP−40LTの銀インクを、ANP Co.Ltd.(韓国)より購入した。銀インクは、直径50nmの銀ナノ粒子を有していた。インクは、エタノールにより17重量%まで希釈した。希釈した銀分散液を、5分間、チップ超音波適用装置により、超音波を適用し、0.2ミクロンのPTFEフィルタで2回ろ過した。銀分散液を、マスキング材料のパターンを有する基板に、3000rpmで60秒間コートした。基板の全表面は、銀分散液により被覆されていた。すなわち、銀材料が、マスキングパターンおよび開口領域上に層として堆積した。銀を、65℃で1分間アニールして、溶剤を除去し、140℃で、5分間、ホットプレート上で焼結した。
本発明は以下の実施の態様を含むものである。
1.機能材料のパターンを基板上に形成する方法であって、
a)隆起表面を備えたレリーフ構造を有するエラストマースタンプを準備し、
b)マスキング材料を前記レリーフ構造の少なくとも前記隆起表面に適用し、
c)前記マスキング材料を前記隆起表面から基板に転写させて、前記基板上に開口領域のパターンを形成し、
d)機能材料を前記基板上の少なくとも前記開口領域に適用して、前記基板の反対側に機能材料の外側表面を形成し、
e)接着剤を前記機能材料の前記外側表面と接触させ、
f)前記接着剤を前記基板から分離して、少なくとも前記マスキング材料を前記基板から除去すること
を含む方法。
2.前記適用する工程が、前記開口領域および前記マスキングの両方を被覆する機能材料の層を形成し、前記分離する工程が、前記マスキング材料および前記マスキング材料を被覆する前記機能材料の両方を除去する前記1に記載の方法。
3.前記接着剤が前記マスキング材料と接触する前記1に記載の方法。
4.前記適用する工程が、前記開口領域および前記マスキング材料の両方を被覆する機能材料の層を形成し、前記方法が、別の接着剤を前記外側表面と接触させることをさらに含み、前記分離する工程が、最初に、前記マスキング材料を被覆する前記機能材料のみを除去する前記1に記載の方法。
5.前記接着剤を、放射線、熱、圧力およびこれらの組み合わせからなる群に露出することにより、前記接着剤を活性化することをさらに含む前記1に記載の方法。
6.前記接触させる工程が、前記接着剤と前記外側表面との間に、真空接触を提供することを含む前記1に記載の方法。
7.前記接触させる工程が、前記接着剤を前記外側表面にラミネートすることを含む前記1に記載の方法。
8.ラミネートすることが、高温、加圧またはこれらの組み合わせで実施される前記7に記載の方法。
9.前記接触させる工程が、前記接着剤が前記外部表面に隣接した状態で、前記接着剤を前記外側表面に付着可能な放射線に前記接着剤を露光することをさらに含む前記1に記載の方法。
10.前記接着剤が、デンプン系接着剤、セルロース、ゴム、ブチルゴム、ポリイソブチレン、ニトリルゴム、カルボン酸ポリマー、ネオプレン、フェノール樹脂、レゾルシノール材料、エポキシ樹脂、酢酸ビニルエマルジョン、酢酸ビニル−エチレンコポリマー、芳香族ポリイミド、ポリアミド、ポリアクリレート、ポリメタクリレート、ポリオレフィン、ポリウレタン、ポリイソブチレン、ポリスチレン、ポリビニル樹脂、ポリエステル樹脂、ポリ(アクリル酸)、これらおよび他のポリマーのコポリマー、およびブレンドからなる群から選択される前記1に記載の方法。
11.支持体上に前記接着剤の層を含む材料捕捉要素を形成することをさらに含む前記1に記載の方法。
12.前記接着剤が、厚さ約10〜500ナノメートルの層を形成する前記1に記載の方法。
13.前記機能材料が溶液中にあり、前記方法が、前記機能材料のフィルムを前記基板上に乾燥させて形成することをさらに含む前記1に記載の方法。
14.前記機能材料が、導体、半導体、誘電体およびこれらの組み合わせからなる群から選択される前記1に記載の方法。
15.前記機能材料がナノ粒子を含む前記1に記載の方法。
16.前記ナノ粒子が、導体、誘電体、半導体およびこれらの組み合わせからなる群から選択される前記14に記載の方法。
17.前記ナノ粒子が、銀、金、銅、パラジウム、酸化インジウム錫およびこれらの組み合わせからなる群から選択される金属を含む前記14に記載の方法。
18.前記ナノ粒子が、シリコン、ゲルマニウム、ヒ化ガリウム、酸化亜鉛、セレン化亜鉛およびこれらの組み合わせからなる群から選択される半導体ナノ粒子である前記14に記載の方法。
19.前記ナノ粒子が、カーボンナノチューブ、導体カーボンナノチューブ、半導体カーボンナノチューブおよびこれらの組み合わせからなる群から選択される前記14に記載の方法。
20.前記機能材料が、液体キャリア中の金属ナノ粒子を含み、前記方法が、前記ナノ粒子を前記基板上で加熱することをさらに含む前記1に記載の方法。
21.前記機能材料を適用する工程d)が、注入、流し込み、液体鋳造、ジェッティング、浸漬、吹付け、蒸着およびコーティングからなる群から選択される前記1に記載の方法。
22.前記マスキング材料が液体中のポリマー材料を含み、前記方法が、少なくとも前記隆起表面に前記マスキング材料のフィルムが十分に形成されるように、前記液体を除去することをさらに含む前記1に記載の方法。
23.前記マスキング材料が溶液中にあり、前記方法が、前記マスキング材料の層を、前記スタンプの前記隆起表面に乾燥させて形成することをさらに含む前記1に記載の方法。
24.前記基板上の前記マスキング材料の厚さが100〜10000オングストロームである前記1に記載の方法。
25.前記マスキング材料が、アクリロニトリル−ブタジエンエラストマー、ポリ(アクリロニトリル)、スチレンホモポリマーおよびコポリマー、アクリレートおよびメタクリレートのホモポリマーおよびコポリマー、ポリカーボネート、ポリウレタン、ポリチオフェン、置換および非置換ポリフェニレン−ビニレンホモポリマーおよびコポリマー、ポリ(4−ビニルピリジン)、ポリ(n−ヘキシルイソシアネート)、ポリ(1,4−フェニレンビニレン)、エポキシベース系、ポリ(n−カルバゾール)、ポリノルボルネンのホモポリマーおよびコポリマー、ポリ(フェニレンオキシド)、ポリ(フェニレンスルフィド)、ポリ(テトラフルオロエチレン)、アルキド樹脂、ゼラチン、ポリ(アクリル酸)、ポリペプチド、プロテイン、ポリ(ビニルピリジン)、ポリ(ビニルピロリドン)、ヒドロキシポリスチレン、ポリ(ビニルアルコール)、ポリエチレングリコール、キトサン、ポリ(スチレン−コ−ビニルピリジン)、ポリ(ブチルアクリレート−コ−ビニルピリジン)、アリールアミンおよびフッ素化アリールアミン、セルロースおよびセルロース誘導体、アクリレートおよび/またはメタクリレートエマルジョンの分散液ならびにこれらの組み合わせおよびコポリマーからなる群から選択される前記1に記載の方法。
26.前記エラストマースタンプが、シリコーンポリマー、エポキシポリマー、共役ジオレフィンハイドロカーボンのポリマー、A−B−A型ブロックコポリマーのエラストマーブロックコポリマー(Aは、非エラストマーブロックを表し、Bはエラストマーブロックを表す)、アクリレートポリマー、フルオロポリマーおよびこれらの組み合わせからなる群から選択される組成物の層を含む前記1に記載の方法。
27.前記エラストマースタンプを、感光性組成物の層から形成することをさらに含む前記1に記載の方法。
28.前記エラストマースタンプを、化学放射線への露光により重合可能なフッ素化化合物を含有する組成物の層から形成することをさらに含む前記1に記載の方法。
29.前記フッ素化化合物が、パーフルオロポリエーテル化合物である前記28に記載の方法。
30.前記エラストマースタンプが、加熱により硬化可能な組成物の層を含む前記1に記載の方法。
31.前記エラストマースタンプが、可撓性フィルムの支持体をさらに含む前記1に記載の方法。
32.前記基板が、プラスチック、ポリマーフィルム、金属、シリコン、ガラス、布帛、紙およびこれらの組み合わせからなる群から選択される前記1に記載の方法。
Claims (4)
- 機能材料のパターンを基板上に形成する方法であって、
a)隆起表面を備えたレリーフ構造を有するエラストマースタンプを準備し、
b)マスキング材料を前記レリーフ構造の少なくとも前記隆起表面に適用し、
c)前記マスキング材料を前記隆起表面から基板に転写させて、前記基板上に開口領域のパターンを形成し、
d)機能材料を前記基板上の少なくとも前記開口領域に適用して、前記基板の反対側に機能材料の外側表面を形成し、
e)接着剤を前記機能材料の前記外側表面と接触させ、
f)前記接着剤を前記基板から分離して、少なくとも前記マスキング材料を前記基板から除去すること
を含み、
前記適用する工程が、前記開口領域および前記マスキング材料の両方を被覆する機能材料の層を形成し、
前記方法が、別の接着剤を前記外側表面と接触させることをさらに含み、
前記分離する工程が、最初に、前記マスキング材料を被覆する前記機能材料のみを除去する、ことを特徴とする方法。 - 前記機能材料が溶液中にあり、前記方法が、前記機能材料のフィルムを前記基板上に乾燥させて形成することをさらに含む請求項1に記載の方法。
- 前記機能材料が、導体、半導体、誘電体およびこれらの組み合わせからなる群から選択される請求項1に記載の方法。
- 前記機能材料がナノ粒子を含む請求項1に記載の方法。
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-
2007
- 2007-04-05 US US11/784,067 patent/US7875313B2/en not_active Expired - Fee Related
-
2008
- 2008-04-07 EP EP08742625.0A patent/EP2129530B1/en not_active Not-in-force
- 2008-04-07 CN CN2008800091817A patent/CN101641219B/zh not_active Expired - Fee Related
- 2008-04-07 KR KR1020097021452A patent/KR20100015571A/ko not_active Application Discontinuation
- 2008-04-07 JP JP2010502157A patent/JP5069787B2/ja not_active Expired - Fee Related
- 2008-04-07 WO PCT/US2008/004510 patent/WO2008124130A1/en active Application Filing
Also Published As
Publication number | Publication date |
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JP2010527508A (ja) | 2010-08-12 |
CN101641219A (zh) | 2010-02-03 |
CN101641219B (zh) | 2012-05-09 |
EP2129530A1 (en) | 2009-12-09 |
US20080248205A1 (en) | 2008-10-09 |
EP2129530B1 (en) | 2013-06-19 |
WO2008124130A1 (en) | 2008-10-16 |
KR20100015571A (ko) | 2010-02-12 |
US7875313B2 (en) | 2011-01-25 |
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