JP5065221B2 - 端子配置構造およびその構造を用いたカード型装置 - Google Patents
端子配置構造およびその構造を用いたカード型装置 Download PDFInfo
- Publication number
- JP5065221B2 JP5065221B2 JP2008265368A JP2008265368A JP5065221B2 JP 5065221 B2 JP5065221 B2 JP 5065221B2 JP 2008265368 A JP2008265368 A JP 2008265368A JP 2008265368 A JP2008265368 A JP 2008265368A JP 5065221 B2 JP5065221 B2 JP 5065221B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plate portion
- lower substrate
- terminal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 179
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/08—Means for collapsing antennas or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
- H01Q1/2275—Supports; Mounting means by structural association with other equipment or articles used with computer equipment associated to expansion card or bus, e.g. in PCMCIA, PC cards, Wireless USB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
- H01Q1/244—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas extendable from a housing along a given path
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Support Of Aerials (AREA)
Description
2 スライドアンテナ基板
5 カード本体
7 平面型アンテナ
11 端子
13 下側基板
14 上側基板
16 導電部
17 穴部
18 バネ板部
19 支持部
27 切り欠き部
36 固定部
37 底板部
38 伸設板部
Claims (6)
- 2枚の基板が間隔を介して上下に配置され、上側基板の裏面側には導電部が形成され、下側基板には前記上側基板の導電部に導通接続される端子の取り付け用の貫通の穴部または切り欠き部が形成されており、該穴部または切り欠き部に取り付ける端子はバネ板部と該バネ板部を支持する支持部とを備え、該支持部は前記下側基板に固定される固定部と、前記穴部または切り欠き部の下端側において前記下側基板の底面側の位置に配置された底板部とを有し、前記端子のバネ板部は前記底板部に連接されて該底板部から立ち上がりの形態をもって形成され、前記穴部または切り欠き部の下端側から上側に向けて伸設されてその伸設頂上位置で前記上側基板の導電部と接触していることを特徴とする端子配置構造。
- 端子の支持部の底板部にはバネ板部を挟む両側にそれぞれ、前記底板部に連接してその連接部から折れ曲がって上側に立ち上がり下側基板の穴部または切り欠き部の内壁に沿って伸設された伸設板部が設けられ、それぞれの伸設板部は前記穴部または切り欠き部の上端部において伸設方向を変えて前記穴部または切り欠き部から離れる方向に向けて前記下側基板の表面側に沿って配設されて該下側基板の表面側に固定されていることを特徴とする請求項1記載の端子配置構造。
- 端子の支持部の底板部は下側基板の穴部または切り欠き部よりも幅方向と長さ方向の少なくとも一方に張り出し形成されて前記下側基板の裏面側に沿って配設されており、この下側基板の裏面側に配設された部位が該下側基板の裏面側に固定されていることを特徴とする請求項1記載の端子配置構造。
- 端子のバネ板部は下側基板の穴部または切り欠き部内において支持部の底板部の一端側に連接形成され、該底板部の一端側または他端側には前記底板部に連接してその連接部から折れ曲がって上側に立ち上がり下側基板の穴部または切り欠き部の内壁に沿って伸設された伸設板部が設けられ、該伸設板部は前記穴部または切り欠き部の上端部において伸設方向を変えて前記穴部または切り欠き部から離れる方向に向けて前記下側基板の表面側に沿って配設されて該下側基板の表面側に固定されていることを特徴とする請求項3記載の端子配置構造。
- 底板部は下側基板の穴部または切り欠き部の下側開口をふさぐ態様で設けられていることを特徴とする請求項1乃至請求項4のいずれか一つに記載の端子配置構造。
- カード挿入部に挿入されるカード本体と、該カード本体の挿入後端側に収容されたスライドアンテナ基板とを有し、該スライドアンテナ基板は前記カード本体のカード挿入方向にスライド自在に設けられて前記カード本体への収容状態と前記カード本体からの引き出し状態との間でスライド移動自在と成しており、前記スライドアンテナ基板には一つ以上の平面型アンテナが設けられており、前記カード本体側に設けられている基板と前記スライドアンテナ基板とが間隔を介して上下に配置されて、前記スライドアンテナ基板と前記カード本体の基板のいずれか一方が上側基板と成して他方が下側基板と成しており、請求項1乃至請求項5のいずれか一つに記載の端子配置構造を有して、前記スライドアンテナ基板と前記カード本体の基板とが電気的に接続されていることを特徴とするカード型装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008265368A JP5065221B2 (ja) | 2008-10-14 | 2008-10-14 | 端子配置構造およびその構造を用いたカード型装置 |
PCT/JP2009/067786 WO2010044424A1 (ja) | 2008-10-14 | 2009-10-14 | 端子配置構造およびその構造を用いたカード型装置 |
CN200980141634.6A CN102187526B (zh) | 2008-10-14 | 2009-10-14 | 端子配置结构及使用该结构的卡片型装置 |
US13/086,198 US8599103B2 (en) | 2008-10-14 | 2011-04-13 | Terminal arrangement structure and card-shaped device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008265368A JP5065221B2 (ja) | 2008-10-14 | 2008-10-14 | 端子配置構造およびその構造を用いたカード型装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010097717A JP2010097717A (ja) | 2010-04-30 |
JP5065221B2 true JP5065221B2 (ja) | 2012-10-31 |
Family
ID=42106587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008265368A Expired - Fee Related JP5065221B2 (ja) | 2008-10-14 | 2008-10-14 | 端子配置構造およびその構造を用いたカード型装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8599103B2 (ja) |
JP (1) | JP5065221B2 (ja) |
CN (1) | CN102187526B (ja) |
WO (1) | WO2010044424A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107453065A (zh) * | 2016-05-31 | 2017-12-08 | 泰科电子(上海)有限公司 | 沉板型弹片连接器及其制造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5602117B2 (ja) * | 2011-10-13 | 2014-10-08 | 日本航空電子工業株式会社 | コネクタ |
JP5349652B2 (ja) * | 2012-06-12 | 2013-11-20 | 株式会社東芝 | カプラを備えたカード装置 |
KR102360456B1 (ko) * | 2015-05-26 | 2022-02-09 | 삼성전자 주식회사 | 전자 장치 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6042468Y2 (ja) * | 1981-03-03 | 1985-12-26 | 日産自動車株式会社 | 電気接続子 |
JPH09199242A (ja) * | 1996-01-24 | 1997-07-31 | Japan Aviation Electron Ind Ltd | プリント配線板一体型コネクタ及びその製造方法 |
US6619966B2 (en) * | 1996-06-14 | 2003-09-16 | Seiko Epson Corporation | Card-shaped electronic apparatus |
US6129579A (en) | 1998-06-15 | 2000-10-10 | Segate Technology Inc. | Low inductance flex-to-PCB spring connector for a disc drive |
JP2001332914A (ja) | 2000-05-22 | 2001-11-30 | Honda Tsushin Kogyo Co Ltd | アンテナユニット付きカード |
JP4310941B2 (ja) * | 2001-07-09 | 2009-08-12 | パナソニック電工株式会社 | コネクタ |
JP3847227B2 (ja) | 2001-10-02 | 2006-11-22 | 日本碍子株式会社 | コンタクトシート |
JP4276882B2 (ja) | 2003-04-30 | 2009-06-10 | 日本圧着端子製造株式会社 | 多層プリント配線板の接続構造 |
JP4276881B2 (ja) | 2003-04-30 | 2009-06-10 | 日本圧着端子製造株式会社 | 多層プリント配線板の接続構造 |
US6938482B2 (en) * | 2003-06-03 | 2005-09-06 | General Electric Co. | Humidity sensor element containing polyphenylsulfone |
TW200903912A (en) * | 2007-03-13 | 2009-01-16 | Alps Electric Co Ltd | Contact sheet and connection device having same |
-
2008
- 2008-10-14 JP JP2008265368A patent/JP5065221B2/ja not_active Expired - Fee Related
-
2009
- 2009-10-14 CN CN200980141634.6A patent/CN102187526B/zh not_active Expired - Fee Related
- 2009-10-14 WO PCT/JP2009/067786 patent/WO2010044424A1/ja active Application Filing
-
2011
- 2011-04-13 US US13/086,198 patent/US8599103B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107453065A (zh) * | 2016-05-31 | 2017-12-08 | 泰科电子(上海)有限公司 | 沉板型弹片连接器及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102187526A (zh) | 2011-09-14 |
US20110187626A1 (en) | 2011-08-04 |
US8599103B2 (en) | 2013-12-03 |
WO2010044424A1 (ja) | 2010-04-22 |
JP2010097717A (ja) | 2010-04-30 |
CN102187526B (zh) | 2014-03-12 |
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