JP5063846B2 - 超小型電子機器製造において最適な加工ターゲットを定めるための方法 - Google Patents

超小型電子機器製造において最適な加工ターゲットを定めるための方法 Download PDF

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Publication number
JP5063846B2
JP5063846B2 JP2001550802A JP2001550802A JP5063846B2 JP 5063846 B2 JP5063846 B2 JP 5063846B2 JP 2001550802 A JP2001550802 A JP 2001550802A JP 2001550802 A JP2001550802 A JP 2001550802A JP 5063846 B2 JP5063846 B2 JP 5063846B2
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processing
machining
change
parameter
doping level
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JP2003519922A5 (enExample
JP2003519922A (ja
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トプラク，アンソニー・ジェイ
ミラー，マイケル・エル
ソンダーマン，トーマス
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2001550802A 2000-01-04 2000-12-04 超小型電子機器製造において最適な加工ターゲットを定めるための方法 Expired - Lifetime JP5063846B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/477,464 2000-01-04
US09/477,464 US6470230B1 (en) 2000-01-04 2000-01-04 Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication
PCT/US2000/032948 WO2001050522A1 (en) 2000-01-04 2000-12-04 Method for determining optimal process targets in microelectronic fabrication

Publications (3)

Publication Number Publication Date
JP2003519922A JP2003519922A (ja) 2003-06-24
JP2003519922A5 JP2003519922A5 (enExample) 2008-01-10
JP5063846B2 true JP5063846B2 (ja) 2012-10-31

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JP2001550802A Expired - Lifetime JP5063846B2 (ja) 2000-01-04 2000-12-04 超小型電子機器製造において最適な加工ターゲットを定めるための方法

Country Status (5)

Country Link
US (1) US6470230B1 (enExample)
EP (1) EP1245044B1 (enExample)
JP (1) JP5063846B2 (enExample)
KR (1) KR100727049B1 (enExample)
WO (1) WO2001050522A1 (enExample)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US7200459B1 (en) * 2000-01-04 2007-04-03 Advanced Micro Devices, Inc. Method for determining optimal photolithography overlay targets based on process performance and yield in microelectronic fabrication
US6622059B1 (en) * 2000-04-13 2003-09-16 Advanced Micro Devices, Inc. Automated process monitoring and analysis system for semiconductor processing
DE10037243C2 (de) * 2000-07-31 2002-06-20 Infineon Technologies Ag Regelsystem für photolithographische Prozesse
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US6728587B2 (en) * 2000-12-27 2004-04-27 Insyst Ltd. Method for global automated process control
US7123978B2 (en) * 2000-12-27 2006-10-17 Insyst Ltd. Method for dynamically targeting a batch process
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
JP3708031B2 (ja) * 2001-06-29 2005-10-19 株式会社日立製作所 プラズマ処理装置および処理方法
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
TWI252516B (en) * 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
US7225047B2 (en) * 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US7069104B2 (en) * 2002-04-30 2006-06-27 Canon Kabushiki Kaisha Management system, management apparatus, management method, and device manufacturing method
JP4353498B2 (ja) 2002-04-30 2009-10-28 キヤノン株式会社 管理装置及び方法、デバイス製造方法、並びにコンピュータプログラム
JP2003324055A (ja) 2002-04-30 2003-11-14 Canon Inc 管理システム及び装置及び方法並びに露光装置及びその制御方法
JP4018438B2 (ja) 2002-04-30 2007-12-05 キヤノン株式会社 半導体露光装置を管理する管理システム
US6787376B1 (en) * 2002-05-22 2004-09-07 Advanced Micro Devices, Inc. Creating a process recipe based on a desired result
US7092110B2 (en) * 2002-07-25 2006-08-15 Timbre Technologies, Inc. Optimized model and parameter selection for optical metrology
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
US6773931B2 (en) * 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
JP2005535130A (ja) 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
US8185230B2 (en) * 2002-08-22 2012-05-22 Advanced Micro Devices, Inc. Method and apparatus for predicting device electrical parameters during fabrication
JP3799314B2 (ja) * 2002-09-27 2006-07-19 株式会社日立ハイテクノロジーズ エッチング処理装置およびエッチング処理方法
US6842661B2 (en) * 2002-09-30 2005-01-11 Advanced Micro Devices, Inc. Process control at an interconnect level
US6912438B2 (en) * 2002-10-21 2005-06-28 Advanced Micro Devices, Inc. Using scatterometry to obtain measurements of in circuit structures
US6959224B2 (en) 2002-11-08 2005-10-25 Advanced Micro Devices, Inc. Probability constrained optimization for electrical fabrication control
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7424392B1 (en) * 2002-12-18 2008-09-09 Advanced Micro Devices, Inc. Applying a self-adaptive filter to a drifting process
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US20040167655A1 (en) * 2003-02-22 2004-08-26 Scott Middlebrooks Optimal model predictive control of overlay implemented in a ASIC fab
EP1471008B1 (de) * 2003-04-25 2010-06-09 SIG Technology Ltd. Verfahren und System zur Überwachung eines Verpackungs-oder Abfüllvorgangs
US7684887B2 (en) * 2003-04-30 2010-03-23 Infineon Technologies Ag Advanced process control method and advanced process control system for acquiring production data in a chip production installation
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7328126B2 (en) * 2003-09-12 2008-02-05 Tokyo Electron Limited Method and system of diagnosing a processing system using adaptive multivariate analysis
JP4769725B2 (ja) * 2003-10-08 2011-09-07 アプライド マテリアルズ イスラエル リミテッド 測定システム及び方法
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7263408B1 (en) * 2004-11-02 2007-08-28 Advanced Micro Devices, Inc. Method and system for converting tool process ability based upon work in progress characteristics
GB2437894B (en) * 2005-02-28 2011-04-13 Advanced Micro Devices Inc Automated Throughput Control System And Method Of Operating The Same
JP3732220B1 (ja) * 2005-03-28 2006-01-05 株式会社リコー イオン注入量分布評価方法
US7558986B2 (en) * 2005-05-26 2009-07-07 United Parcel Service Of America, Inc. Software process monitor
US8332826B2 (en) * 2005-05-26 2012-12-11 United Parcel Service Of America, Inc. Software process monitor
US7823021B2 (en) * 2005-05-26 2010-10-26 United Parcel Service Of America, Inc. Software process monitor
US7355728B2 (en) * 2005-06-16 2008-04-08 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US20070135956A1 (en) * 2005-12-13 2007-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Data location systems and methods
US8515567B2 (en) * 2005-12-21 2013-08-20 Globalfoundries Inc. Enhanced state estimation based upon information credibility
US20080140590A1 (en) * 2006-12-12 2008-06-12 Taiwan Semiconductor Manufacturing Co., Ltd. Process control integration systems and methods
US7424331B2 (en) * 2006-12-19 2008-09-09 Intel Corporation System for implementing intelligent and accurate updates to state-based advanced process control (APC) models
US7844927B2 (en) * 2007-01-19 2010-11-30 Globalfoundries Inc. Method for quality assured semiconductor device modeling
US8046086B2 (en) * 2007-05-15 2011-10-25 Fisher-Rosemount Systems, Inc. Methods and systems for batch processing and execution in a process system
US7991577B2 (en) * 2007-08-30 2011-08-02 HSB Solomon Associates, LLP Control asset comparative performance analysis system and methodology
JP2009224374A (ja) * 2008-03-13 2009-10-01 Oki Semiconductor Co Ltd Ｐｅｂ装置及びその制御方法
CN102625926B (zh) 2009-08-21 2015-01-07 维吉莱公司 用于高效地协调数据中心制冷单元的方法和设备
US8391999B2 (en) * 2010-06-09 2013-03-05 Taiwan Semiconductor Manufacturing Company, Ltd. Auto device skew manufacturing
KR20130098346A (ko) 2010-08-20 2013-09-04 비질런트 코포레이션 Ｈｖａｃ 시스템을 위한 에너지 최적화 제어 결정
US9822989B2 (en) 2011-12-12 2017-11-21 Vigilent Corporation Controlling air temperatures of HVAC units
US9308690B2 (en) * 2012-07-31 2016-04-12 Makerbot Industries, Llc Fabrication of objects with enhanced structural characteristics
JP6247746B2 (ja) 2013-05-08 2017-12-13 ヴィジレント コーポレイションＶｉｇｉｌｅｎｔ Ｃｏｒｐｏｒａｔｉｏｎ 環境に管理されるシステムにおける影響の学習
WO2015171624A1 (en) 2014-05-05 2015-11-12 Vigilent Corporation Point-based risk score for managing environmental systems
US10935962B2 (en) * 2015-11-30 2021-03-02 National Cheng Kung University System and method for identifying root causes of yield loss
WO2019120826A1 (en) * 2017-12-19 2019-06-27 Asml Netherlands B.V. Computational metrology based correction and control
EP3872567A1 (en) * 2020-02-25 2021-09-01 ASML Netherlands B.V. Systems and methods for process metric aware process control
KR102760991B1 (ko) * 2022-02-25 2025-01-24 포항공과대학교 산학협력단 반도체 파라미터 설정 장치 및 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150221A (en) * 1979-05-10 1980-11-22 Toshiba Corp Semiconductor fabricating process control system
JP2635566B2 (ja) * 1987-01-14 1997-07-30 株式会社東芝 半導体製造自動制御システム
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
US5711843A (en) 1995-02-21 1998-01-27 Orincon Technologies, Inc. System for indirectly monitoring and controlling a process with particular application to plasma processes
KR0174993B1 (ko) * 1996-02-23 1999-04-01 김광호 반도체 설비의 통계적 공정관리 시스템 및 그 방법
KR100213195B1 (ko) * 1996-03-07 1999-08-02 윤종용 반도체 공정의 제어방법
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
US6288431B1 (en) * 1997-04-04 2001-09-11 Nippon Steel Corporation Semiconductor device and a method of manufacturing the same
US5866437A (en) 1997-12-05 1999-02-02 Advanced Micro Devices, Inc. Dynamic process window control using simulated wet data from current and previous layer data
US6041270A (en) 1997-12-05 2000-03-21 Advanced Micro Devices, Inc. Automatic recipe adjust and download based on process control window
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
US6103559A (en) * 1999-03-30 2000-08-15 Amd, Inc. (Advanced Micro Devices) Method of making disposable channel masking for both source/drain and LDD implant and subsequent gate fabrication

Also Published As

Publication number Publication date
EP1245044A1 (en) 2002-10-02
KR20020087047A (ko) 2002-11-21
WO2001050522A1 (en) 2001-07-12
EP1245044B1 (en) 2011-05-11
KR100727049B1 (ko) 2007-06-12
JP2003519922A (ja) 2003-06-24
US6470230B1 (en) 2002-10-22

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