KR100727049B1 - 마이크로전자 디바이스들의 제조시 최적의 공정 목표들을결정하는 방법 - Google Patents

마이크로전자 디바이스들의 제조시 최적의 공정 목표들을결정하는 방법 Download PDF

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KR100727049B1
KR100727049B1 KR1020027008703A KR20027008703A KR100727049B1 KR 100727049 B1 KR100727049 B1 KR 100727049B1 KR 1020027008703 A KR1020027008703 A KR 1020027008703A KR 20027008703 A KR20027008703 A KR 20027008703A KR 100727049 B1 KR100727049 B1 KR 100727049B1
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workpiece
doping level
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KR20020087047A (ko
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톱랙안소니제이.
밀러마이클엘.
손더맨토마스
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어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020027008703A 2000-01-04 2000-12-04 마이크로전자 디바이스들의 제조시 최적의 공정 목표들을결정하는 방법 Expired - Lifetime KR100727049B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/477,464 2000-01-04
US09/477,464 US6470230B1 (en) 2000-01-04 2000-01-04 Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication

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KR20020087047A KR20020087047A (ko) 2002-11-21
KR100727049B1 true KR100727049B1 (ko) 2007-06-12

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US (1) US6470230B1 (enExample)
EP (1) EP1245044B1 (enExample)
JP (1) JP5063846B2 (enExample)
KR (1) KR100727049B1 (enExample)
WO (1) WO2001050522A1 (enExample)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US7200459B1 (en) * 2000-01-04 2007-04-03 Advanced Micro Devices, Inc. Method for determining optimal photolithography overlay targets based on process performance and yield in microelectronic fabrication
US6622059B1 (en) * 2000-04-13 2003-09-16 Advanced Micro Devices, Inc. Automated process monitoring and analysis system for semiconductor processing
DE10037243C2 (de) * 2000-07-31 2002-06-20 Infineon Technologies Ag Regelsystem für photolithographische Prozesse
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US6728587B2 (en) * 2000-12-27 2004-04-27 Insyst Ltd. Method for global automated process control
US7123978B2 (en) * 2000-12-27 2006-10-17 Insyst Ltd. Method for dynamically targeting a batch process
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
JP3708031B2 (ja) * 2001-06-29 2005-10-19 株式会社日立製作所 プラズマ処理装置および処理方法
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
TWI252516B (en) * 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
US7225047B2 (en) * 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US7069104B2 (en) * 2002-04-30 2006-06-27 Canon Kabushiki Kaisha Management system, management apparatus, management method, and device manufacturing method
JP4353498B2 (ja) 2002-04-30 2009-10-28 キヤノン株式会社 管理装置及び方法、デバイス製造方法、並びにコンピュータプログラム
JP2003324055A (ja) 2002-04-30 2003-11-14 Canon Inc 管理システム及び装置及び方法並びに露光装置及びその制御方法
JP4018438B2 (ja) 2002-04-30 2007-12-05 キヤノン株式会社 半導体露光装置を管理する管理システム
US6787376B1 (en) * 2002-05-22 2004-09-07 Advanced Micro Devices, Inc. Creating a process recipe based on a desired result
US7092110B2 (en) * 2002-07-25 2006-08-15 Timbre Technologies, Inc. Optimized model and parameter selection for optical metrology
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
US6773931B2 (en) * 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
JP2005535130A (ja) 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
US8185230B2 (en) * 2002-08-22 2012-05-22 Advanced Micro Devices, Inc. Method and apparatus for predicting device electrical parameters during fabrication
JP3799314B2 (ja) * 2002-09-27 2006-07-19 株式会社日立ハイテクノロジーズ エッチング処理装置およびエッチング処理方法
US6842661B2 (en) * 2002-09-30 2005-01-11 Advanced Micro Devices, Inc. Process control at an interconnect level
US6912438B2 (en) * 2002-10-21 2005-06-28 Advanced Micro Devices, Inc. Using scatterometry to obtain measurements of in circuit structures
US6959224B2 (en) 2002-11-08 2005-10-25 Advanced Micro Devices, Inc. Probability constrained optimization for electrical fabrication control
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7424392B1 (en) * 2002-12-18 2008-09-09 Advanced Micro Devices, Inc. Applying a self-adaptive filter to a drifting process
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US20040167655A1 (en) * 2003-02-22 2004-08-26 Scott Middlebrooks Optimal model predictive control of overlay implemented in a ASIC fab
EP1471008B1 (de) * 2003-04-25 2010-06-09 SIG Technology Ltd. Verfahren und System zur Überwachung eines Verpackungs-oder Abfüllvorgangs
US7684887B2 (en) * 2003-04-30 2010-03-23 Infineon Technologies Ag Advanced process control method and advanced process control system for acquiring production data in a chip production installation
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7328126B2 (en) * 2003-09-12 2008-02-05 Tokyo Electron Limited Method and system of diagnosing a processing system using adaptive multivariate analysis
JP4769725B2 (ja) * 2003-10-08 2011-09-07 アプライド マテリアルズ イスラエル リミテッド 測定システム及び方法
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7263408B1 (en) * 2004-11-02 2007-08-28 Advanced Micro Devices, Inc. Method and system for converting tool process ability based upon work in progress characteristics
GB2437894B (en) * 2005-02-28 2011-04-13 Advanced Micro Devices Inc Automated Throughput Control System And Method Of Operating The Same
JP3732220B1 (ja) * 2005-03-28 2006-01-05 株式会社リコー イオン注入量分布評価方法
US7558986B2 (en) * 2005-05-26 2009-07-07 United Parcel Service Of America, Inc. Software process monitor
US8332826B2 (en) * 2005-05-26 2012-12-11 United Parcel Service Of America, Inc. Software process monitor
US7823021B2 (en) * 2005-05-26 2010-10-26 United Parcel Service Of America, Inc. Software process monitor
US7355728B2 (en) * 2005-06-16 2008-04-08 Timbre Technologies, Inc. Optical metrology model optimization for repetitive structures
US20070135956A1 (en) * 2005-12-13 2007-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Data location systems and methods
US8515567B2 (en) * 2005-12-21 2013-08-20 Globalfoundries Inc. Enhanced state estimation based upon information credibility
US20080140590A1 (en) * 2006-12-12 2008-06-12 Taiwan Semiconductor Manufacturing Co., Ltd. Process control integration systems and methods
US7424331B2 (en) * 2006-12-19 2008-09-09 Intel Corporation System for implementing intelligent and accurate updates to state-based advanced process control (APC) models
US7844927B2 (en) * 2007-01-19 2010-11-30 Globalfoundries Inc. Method for quality assured semiconductor device modeling
US8046086B2 (en) * 2007-05-15 2011-10-25 Fisher-Rosemount Systems, Inc. Methods and systems for batch processing and execution in a process system
US7991577B2 (en) * 2007-08-30 2011-08-02 HSB Solomon Associates, LLP Control asset comparative performance analysis system and methodology
JP2009224374A (ja) * 2008-03-13 2009-10-01 Oki Semiconductor Co Ltd Ｐｅｂ装置及びその制御方法
CN102625926B (zh) 2009-08-21 2015-01-07 维吉莱公司 用于高效地协调数据中心制冷单元的方法和设备
US8391999B2 (en) * 2010-06-09 2013-03-05 Taiwan Semiconductor Manufacturing Company, Ltd. Auto device skew manufacturing
KR20130098346A (ko) 2010-08-20 2013-09-04 비질런트 코포레이션 Ｈｖａｃ 시스템을 위한 에너지 최적화 제어 결정
US9822989B2 (en) 2011-12-12 2017-11-21 Vigilent Corporation Controlling air temperatures of HVAC units
US9308690B2 (en) * 2012-07-31 2016-04-12 Makerbot Industries, Llc Fabrication of objects with enhanced structural characteristics
JP6247746B2 (ja) 2013-05-08 2017-12-13 ヴィジレント コーポレイションＶｉｇｉｌｅｎｔ Ｃｏｒｐｏｒａｔｉｏｎ 環境に管理されるシステムにおける影響の学習
WO2015171624A1 (en) 2014-05-05 2015-11-12 Vigilent Corporation Point-based risk score for managing environmental systems
US10935962B2 (en) * 2015-11-30 2021-03-02 National Cheng Kung University System and method for identifying root causes of yield loss
WO2019120826A1 (en) * 2017-12-19 2019-06-27 Asml Netherlands B.V. Computational metrology based correction and control
EP3872567A1 (en) * 2020-02-25 2021-09-01 ASML Netherlands B.V. Systems and methods for process metric aware process control
KR102760991B1 (ko) * 2022-02-25 2025-01-24 포항공과대학교 산학협력단 반도체 파라미터 설정 장치 및 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0174993B1 (ko) * 1996-02-23 1999-04-01 김광호 반도체 설비의 통계적 공정관리 시스템 및 그 방법
KR100213195B1 (ko) * 1996-03-07 1999-08-02 윤종용 반도체 공정의 제어방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150221A (en) * 1979-05-10 1980-11-22 Toshiba Corp Semiconductor fabricating process control system
JP2635566B2 (ja) * 1987-01-14 1997-07-30 株式会社東芝 半導体製造自動制御システム
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
US5711843A (en) 1995-02-21 1998-01-27 Orincon Technologies, Inc. System for indirectly monitoring and controlling a process with particular application to plasma processes
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
US6288431B1 (en) * 1997-04-04 2001-09-11 Nippon Steel Corporation Semiconductor device and a method of manufacturing the same
US5866437A (en) 1997-12-05 1999-02-02 Advanced Micro Devices, Inc. Dynamic process window control using simulated wet data from current and previous layer data
US6041270A (en) 1997-12-05 2000-03-21 Advanced Micro Devices, Inc. Automatic recipe adjust and download based on process control window
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
US6103559A (en) * 1999-03-30 2000-08-15 Amd, Inc. (Advanced Micro Devices) Method of making disposable channel masking for both source/drain and LDD implant and subsequent gate fabrication

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0174993B1 (ko) * 1996-02-23 1999-04-01 김광호 반도체 설비의 통계적 공정관리 시스템 및 그 방법
KR100213195B1 (ko) * 1996-03-07 1999-08-02 윤종용 반도체 공정의 제어방법

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Publication number Publication date
EP1245044A1 (en) 2002-10-02
JP5063846B2 (ja) 2012-10-31
KR20020087047A (ko) 2002-11-21
WO2001050522A1 (en) 2001-07-12
EP1245044B1 (en) 2011-05-11
JP2003519922A (ja) 2003-06-24
US6470230B1 (en) 2002-10-22

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