KR100727049B1 - 마이크로전자 디바이스들의 제조시 최적의 공정 목표들을결정하는 방법 - Google Patents
마이크로전자 디바이스들의 제조시 최적의 공정 목표들을결정하는 방법 Download PDFInfo
- Publication number
- KR100727049B1 KR100727049B1 KR1020027008703A KR20027008703A KR100727049B1 KR 100727049 B1 KR100727049 B1 KR 100727049B1 KR 1020027008703 A KR1020027008703 A KR 1020027008703A KR 20027008703 A KR20027008703 A KR 20027008703A KR 100727049 B1 KR100727049 B1 KR 100727049B1
- Authority
- KR
- South Korea
- Prior art keywords
- change
- defining
- feature
- workpiece
- doping level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/477,464 | 2000-01-04 | ||
| US09/477,464 US6470230B1 (en) | 2000-01-04 | 2000-01-04 | Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020087047A KR20020087047A (ko) | 2002-11-21 |
| KR100727049B1 true KR100727049B1 (ko) | 2007-06-12 |
Family
ID=23896015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020027008703A Expired - Lifetime KR100727049B1 (ko) | 2000-01-04 | 2000-12-04 | 마이크로전자 디바이스들의 제조시 최적의 공정 목표들을결정하는 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6470230B1 (enExample) |
| EP (1) | EP1245044B1 (enExample) |
| JP (1) | JP5063846B2 (enExample) |
| KR (1) | KR100727049B1 (enExample) |
| WO (1) | WO2001050522A1 (enExample) |
Families Citing this family (76)
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| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
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| JP3708031B2 (ja) * | 2001-06-29 | 2005-10-19 | 株式会社日立製作所 | プラズマ処理装置および処理方法 |
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| TWI252516B (en) * | 2002-03-12 | 2006-04-01 | Toshiba Corp | Determination method of process parameter and method for determining at least one of process parameter and design rule |
| US7225047B2 (en) * | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
| JP4018438B2 (ja) | 2002-04-30 | 2007-12-05 | キヤノン株式会社 | 半導体露光装置を管理する管理システム |
| JP4353498B2 (ja) | 2002-04-30 | 2009-10-28 | キヤノン株式会社 | 管理装置及び方法、デバイス製造方法、並びにコンピュータプログラム |
| JP2003324055A (ja) * | 2002-04-30 | 2003-11-14 | Canon Inc | 管理システム及び装置及び方法並びに露光装置及びその制御方法 |
| US7069104B2 (en) * | 2002-04-30 | 2006-06-27 | Canon Kabushiki Kaisha | Management system, management apparatus, management method, and device manufacturing method |
| US6787376B1 (en) * | 2002-05-22 | 2004-09-07 | Advanced Micro Devices, Inc. | Creating a process recipe based on a desired result |
| US7330279B2 (en) * | 2002-07-25 | 2008-02-12 | Timbre Technologies, Inc. | Model and parameter selection for optical metrology |
| US7092110B2 (en) * | 2002-07-25 | 2006-08-15 | Timbre Technologies, Inc. | Optimized model and parameter selection for optical metrology |
| US6773931B2 (en) * | 2002-07-29 | 2004-08-10 | Advanced Micro Devices, Inc. | Dynamic targeting for a process control system |
| KR20050026099A (ko) | 2002-08-01 | 2005-03-14 | 어플라이드 머티어리얼즈 인코포레이티드 | 고급 처리 제어 시스템 내의 부정확한 계측 데이터의 취급방법, 시스템 및 매체 |
| US8185230B2 (en) * | 2002-08-22 | 2012-05-22 | Advanced Micro Devices, Inc. | Method and apparatus for predicting device electrical parameters during fabrication |
| JP3799314B2 (ja) * | 2002-09-27 | 2006-07-19 | 株式会社日立ハイテクノロジーズ | エッチング処理装置およびエッチング処理方法 |
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| US6912438B2 (en) * | 2002-10-21 | 2005-06-28 | Advanced Micro Devices, Inc. | Using scatterometry to obtain measurements of in circuit structures |
| US6959224B2 (en) | 2002-11-08 | 2005-10-25 | Advanced Micro Devices, Inc. | Probability constrained optimization for electrical fabrication control |
| US7272459B2 (en) | 2002-11-15 | 2007-09-18 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
| US7424392B1 (en) * | 2002-12-18 | 2008-09-09 | Advanced Micro Devices, Inc. | Applying a self-adaptive filter to a drifting process |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| US20040167655A1 (en) * | 2003-02-22 | 2004-08-26 | Scott Middlebrooks | Optimal model predictive control of overlay implemented in a ASIC fab |
| ATE470629T1 (de) * | 2003-04-25 | 2010-06-15 | Sig Technology Ltd | Verfahren und system zur überwachung eines verpackungs-oder abfüllvorgangs |
| US7684887B2 (en) * | 2003-04-30 | 2010-03-23 | Infineon Technologies Ag | Advanced process control method and advanced process control system for acquiring production data in a chip production installation |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
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| US7328126B2 (en) * | 2003-09-12 | 2008-02-05 | Tokyo Electron Limited | Method and system of diagnosing a processing system using adaptive multivariate analysis |
| US8013301B2 (en) * | 2003-10-08 | 2011-09-06 | Applied Materials Israel, Ltd. | Measurement system and a method |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US6980873B2 (en) | 2004-04-23 | 2005-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment |
| US7437404B2 (en) | 2004-05-20 | 2008-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for improving equipment communication in semiconductor manufacturing equipment |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| US7263408B1 (en) * | 2004-11-02 | 2007-08-28 | Advanced Micro Devices, Inc. | Method and system for converting tool process ability based upon work in progress characteristics |
| WO2006093604A2 (en) * | 2005-02-28 | 2006-09-08 | Advanced Micro Devices Inc | Automated throughput control system and method of operating the same |
| JP3732220B1 (ja) * | 2005-03-28 | 2006-01-05 | 株式会社リコー | イオン注入量分布評価方法 |
| US7823021B2 (en) * | 2005-05-26 | 2010-10-26 | United Parcel Service Of America, Inc. | Software process monitor |
| US7558986B2 (en) * | 2005-05-26 | 2009-07-07 | United Parcel Service Of America, Inc. | Software process monitor |
| US8332826B2 (en) * | 2005-05-26 | 2012-12-11 | United Parcel Service Of America, Inc. | Software process monitor |
| US7355728B2 (en) * | 2005-06-16 | 2008-04-08 | Timbre Technologies, Inc. | Optical metrology model optimization for repetitive structures |
| US20070135956A1 (en) * | 2005-12-13 | 2007-06-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Data location systems and methods |
| US8515567B2 (en) * | 2005-12-21 | 2013-08-20 | Globalfoundries Inc. | Enhanced state estimation based upon information credibility |
| US20080140590A1 (en) * | 2006-12-12 | 2008-06-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Process control integration systems and methods |
| US7424331B2 (en) * | 2006-12-19 | 2008-09-09 | Intel Corporation | System for implementing intelligent and accurate updates to state-based advanced process control (APC) models |
| US7844927B2 (en) * | 2007-01-19 | 2010-11-30 | Globalfoundries Inc. | Method for quality assured semiconductor device modeling |
| US8046086B2 (en) * | 2007-05-15 | 2011-10-25 | Fisher-Rosemount Systems, Inc. | Methods and systems for batch processing and execution in a process system |
| US7991577B2 (en) * | 2007-08-30 | 2011-08-02 | HSB Solomon Associates, LLP | Control asset comparative performance analysis system and methodology |
| JP2009224374A (ja) * | 2008-03-13 | 2009-10-01 | Oki Semiconductor Co Ltd | Peb装置及びその制御方法 |
| EP2467763B1 (en) * | 2009-08-21 | 2020-03-18 | Vigilent Corporation | Method and apparatus for efficiently coordinating data center cooling units |
| US8391999B2 (en) * | 2010-06-09 | 2013-03-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Auto device skew manufacturing |
| US8924026B2 (en) | 2010-08-20 | 2014-12-30 | Vigilent Corporation | Energy-optimal control decisions for systems |
| US9822989B2 (en) | 2011-12-12 | 2017-11-21 | Vigilent Corporation | Controlling air temperatures of HVAC units |
| US20140039662A1 (en) * | 2012-07-31 | 2014-02-06 | Makerbot Industries, Llc | Augmented three-dimensional printing |
| EP2994872B1 (en) | 2013-05-08 | 2019-07-24 | Vigilent Corporation | Influence learning in an environmentally managed system |
| WO2015171624A1 (en) | 2014-05-05 | 2015-11-12 | Vigilent Corporation | Point-based risk score for managing environmental systems |
| US10935962B2 (en) * | 2015-11-30 | 2021-03-02 | National Cheng Kung University | System and method for identifying root causes of yield loss |
| JP2021508078A (ja) * | 2017-12-19 | 2021-02-25 | エーエスエムエル ネザーランズ ビー.ブイ. | 計算メトロロジに基づく補正および制御 |
| EP3872567A1 (en) * | 2020-02-25 | 2021-09-01 | ASML Netherlands B.V. | Systems and methods for process metric aware process control |
| KR102760991B1 (ko) * | 2022-02-25 | 2025-01-24 | 포항공과대학교 산학협력단 | 반도체 파라미터 설정 장치 및 방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0174993B1 (ko) * | 1996-02-23 | 1999-04-01 | 김광호 | 반도체 설비의 통계적 공정관리 시스템 및 그 방법 |
| KR100213195B1 (ko) * | 1996-03-07 | 1999-08-02 | 윤종용 | 반도체 공정의 제어방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS55150221A (en) * | 1979-05-10 | 1980-11-22 | Toshiba Corp | Semiconductor fabricating process control system |
| JP2635566B2 (ja) * | 1987-01-14 | 1997-07-30 | 株式会社東芝 | 半導体製造自動制御システム |
| JPH0616475B2 (ja) * | 1987-04-03 | 1994-03-02 | 三菱電機株式会社 | 物品の製造システム及び物品の製造方法 |
| US5711843A (en) | 1995-02-21 | 1998-01-27 | Orincon Technologies, Inc. | System for indirectly monitoring and controlling a process with particular application to plasma processes |
| US5859964A (en) * | 1996-10-25 | 1999-01-12 | Advanced Micro Devices, Inc. | System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes |
| US6288431B1 (en) * | 1997-04-04 | 2001-09-11 | Nippon Steel Corporation | Semiconductor device and a method of manufacturing the same |
| US6041270A (en) | 1997-12-05 | 2000-03-21 | Advanced Micro Devices, Inc. | Automatic recipe adjust and download based on process control window |
| US5866437A (en) | 1997-12-05 | 1999-02-02 | Advanced Micro Devices, Inc. | Dynamic process window control using simulated wet data from current and previous layer data |
| US6263255B1 (en) * | 1998-05-18 | 2001-07-17 | Advanced Micro Devices, Inc. | Advanced process control for semiconductor manufacturing |
| US6103559A (en) * | 1999-03-30 | 2000-08-15 | Amd, Inc. (Advanced Micro Devices) | Method of making disposable channel masking for both source/drain and LDD implant and subsequent gate fabrication |
-
2000
- 2000-01-04 US US09/477,464 patent/US6470230B1/en not_active Expired - Lifetime
- 2000-12-04 WO PCT/US2000/032948 patent/WO2001050522A1/en not_active Ceased
- 2000-12-04 KR KR1020027008703A patent/KR100727049B1/ko not_active Expired - Lifetime
- 2000-12-04 JP JP2001550802A patent/JP5063846B2/ja not_active Expired - Lifetime
- 2000-12-04 EP EP00983907A patent/EP1245044B1/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0174993B1 (ko) * | 1996-02-23 | 1999-04-01 | 김광호 | 반도체 설비의 통계적 공정관리 시스템 및 그 방법 |
| KR100213195B1 (ko) * | 1996-03-07 | 1999-08-02 | 윤종용 | 반도체 공정의 제어방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1245044A1 (en) | 2002-10-02 |
| WO2001050522A1 (en) | 2001-07-12 |
| KR20020087047A (ko) | 2002-11-21 |
| JP5063846B2 (ja) | 2012-10-31 |
| US6470230B1 (en) | 2002-10-22 |
| JP2003519922A (ja) | 2003-06-24 |
| EP1245044B1 (en) | 2011-05-11 |
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