JP5054022B2 - 静電チャック装置 - Google Patents

静電チャック装置 Download PDF

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Publication number
JP5054022B2
JP5054022B2 JP2008542164A JP2008542164A JP5054022B2 JP 5054022 B2 JP5054022 B2 JP 5054022B2 JP 2008542164 A JP2008542164 A JP 2008542164A JP 2008542164 A JP2008542164 A JP 2008542164A JP 5054022 B2 JP5054022 B2 JP 5054022B2
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JP
Japan
Prior art keywords
organic film
insulating organic
electrostatic chuck
ceramic layer
chuck device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008542164A
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English (en)
Japanese (ja)
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JPWO2008053934A1 (ja
Inventor
征央 豊田
博 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
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Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP2008542164A priority Critical patent/JP5054022B2/ja
Publication of JPWO2008053934A1 publication Critical patent/JPWO2008053934A1/ja
Application granted granted Critical
Publication of JP5054022B2 publication Critical patent/JP5054022B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008542164A 2006-10-31 2007-10-31 静電チャック装置 Active JP5054022B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008542164A JP5054022B2 (ja) 2006-10-31 2007-10-31 静電チャック装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006295035 2006-10-31
JP2006295035 2006-10-31
JP2007273691 2007-10-22
JP2007273691 2007-10-22
JP2008542164A JP5054022B2 (ja) 2006-10-31 2007-10-31 静電チャック装置
PCT/JP2007/071252 WO2008053934A1 (fr) 2006-10-31 2007-10-31 Mandrin électrostatique

Publications (2)

Publication Number Publication Date
JPWO2008053934A1 JPWO2008053934A1 (ja) 2010-02-25
JP5054022B2 true JP5054022B2 (ja) 2012-10-24

Family

ID=39344275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008542164A Active JP5054022B2 (ja) 2006-10-31 2007-10-31 静電チャック装置

Country Status (3)

Country Link
JP (1) JP5054022B2 (fr)
TW (1) TW200832604A (fr)
WO (1) WO2008053934A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129625A1 (fr) * 2013-02-25 2014-08-28 京セラ株式会社 Outil de maintien d'échantillon
KR20170005113A (ko) * 2014-05-16 2017-01-11 어플라이드 머티어리얼스, 인코포레이티드 프로세싱을 위한 기판들을 핸들링하기 위한 정전 캐리어
KR20170133332A (ko) * 2015-03-31 2017-12-05 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
WO2020138179A1 (fr) * 2018-12-27 2020-07-02 株式会社巴川製紙所 Dispositif de mandrin électrostatique

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5193886B2 (ja) * 2009-01-14 2013-05-08 株式会社巴川製紙所 静電チャック装置の補修方法および補修装置、ならびに静電チャック装置
JP2014522572A (ja) * 2011-06-02 2014-09-04 アプライド マテリアルズ インコーポレイテッド 静電チャックの窒化アルミ誘電体の修復方法
JP6572788B2 (ja) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 静電チャック装置
JP7038497B2 (ja) * 2017-07-07 2022-03-18 東京エレクトロン株式会社 静電チャックの製造方法
KR102097501B1 (ko) * 2018-05-04 2020-04-09 (주)아폴로테크 보호 코팅층을 가지는 정전척
JP7401266B2 (ja) * 2018-12-27 2023-12-19 東京エレクトロン株式会社 基板載置台、及び、基板処理装置
JP7355512B2 (ja) * 2019-03-28 2023-10-03 株式会社巴川製紙所 溶射用マスキング材、静電チャック装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335732A (ja) * 1994-06-14 1995-12-22 Tokyo Electron Ltd 静電チャック、これを用いたプラズマ処理装置及びこの製造方法
JPH09134951A (ja) * 1995-09-06 1997-05-20 Ngk Insulators Ltd 静電チャック

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335732A (ja) * 1994-06-14 1995-12-22 Tokyo Electron Ltd 静電チャック、これを用いたプラズマ処理装置及びこの製造方法
JPH09134951A (ja) * 1995-09-06 1997-05-20 Ngk Insulators Ltd 静電チャック

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129625A1 (fr) * 2013-02-25 2014-08-28 京セラ株式会社 Outil de maintien d'échantillon
KR20170005113A (ko) * 2014-05-16 2017-01-11 어플라이드 머티어리얼스, 인코포레이티드 프로세싱을 위한 기판들을 핸들링하기 위한 정전 캐리어
KR102478514B1 (ko) * 2014-05-16 2022-12-15 어플라이드 머티어리얼스, 인코포레이티드 프로세싱을 위한 기판들을 핸들링하기 위한 정전 캐리어
KR20170133332A (ko) * 2015-03-31 2017-12-05 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
KR102526558B1 (ko) * 2015-03-31 2023-04-28 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
JP2022058894A (ja) * 2018-12-27 2022-04-12 株式会社巴川製紙所 静電チャック装置
JPWO2020138179A1 (ja) * 2018-12-27 2021-09-09 株式会社巴川製紙所 静電チャック装置
JP2022058892A (ja) * 2018-12-27 2022-04-12 株式会社巴川製紙所 静電チャック装置
JP2022058893A (ja) * 2018-12-27 2022-04-12 株式会社巴川製紙所 静電チャック装置
JP7100716B2 (ja) 2018-12-27 2022-07-13 株式会社巴川製紙所 静電チャック装置
KR20210013729A (ko) 2018-12-27 2021-02-05 가부시키가이샤 도모에가와 세이시쇼 정전 척 장치
JP7256310B2 (ja) 2018-12-27 2023-04-11 株式会社巴川製紙所 静電チャック装置
JP7256311B2 (ja) 2018-12-27 2023-04-11 株式会社巴川製紙所 静電チャック装置
WO2020138179A1 (fr) * 2018-12-27 2020-07-02 株式会社巴川製紙所 Dispositif de mandrin électrostatique
JP7335371B2 (ja) 2018-12-27 2023-08-29 株式会社巴川製紙所 静電チャック装置

Also Published As

Publication number Publication date
WO2008053934A1 (fr) 2008-05-08
JPWO2008053934A1 (ja) 2010-02-25
TW200832604A (en) 2008-08-01
TWI368292B (fr) 2012-07-11

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