JP5053102B2 - 窒化物半導体発光素子、窒化物半導体発光装置及びその製造方法 - Google Patents
窒化物半導体発光素子、窒化物半導体発光装置及びその製造方法 Download PDFInfo
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- JP5053102B2 JP5053102B2 JP2007553877A JP2007553877A JP5053102B2 JP 5053102 B2 JP5053102 B2 JP 5053102B2 JP 2007553877 A JP2007553877 A JP 2007553877A JP 2007553877 A JP2007553877 A JP 2007553877A JP 5053102 B2 JP5053102 B2 JP 5053102B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
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- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
- H01S5/04253—Electrodes, e.g. characterised by the structure characterised by the material having specific optical properties, e.g. transparent electrodes
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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Description
以下、図面を参照しながら、本発明による窒化物半導体素子及びその製造方法の第1の実施形態を説明する。
図8を参照しながら、上記実施形態1による窒化物半導体装置の比較例を説明する。
図9を参照しながら、本発明による窒化物半導体装置の第2の実施形態を説明する。
図11を参照しながら、本発明による窒化物半導体装置の第3の実施形態を説明する。
図12を参照しながら、本発明による窒化物半導体装置の第4の実施形態を説明する。
12 n型GaN層
14 n型AlGaNクラッド層
16 GaN光ガイド層
18 InGaN多重量子井戸層
20 InGaN中間層
22 p型AlGaNキャップ層
24 p型GaN光ガイド層
26 p型AlGaNクラッド層
28 p型GaNコンタクト層
30 SiO2層
32 p側コンタクト電極(Pd/Pt)
34 p側配線電極(Ti/Pt/Au)
36 n側電極(Ti/Pt/Au)
38 p側コンタクト電極露出部
40 p側配線電極くびれ部
42 へき開ガイド
44 1次へき開ライン
46 サブマウント
48 サブマウント上配線電極
50 半田
52 Auワイヤー
54 Au系パッド電極
100 半導体積層構造
Claims (7)
- n型不純物を含有する窒化物系半導体基板と、
前記半導体基板の主面に配置され、p型領域およびn型領域と、その間に配置された活性層とを含む半導体積層構造と、
前記半導体積層構造の上面に配置され、開口部を有する絶縁膜と、
前記半導体積層構造の上面側に配置され、前記絶縁膜の前記開口部において前記半導体積層構造に含まれる前記p型領域の一部に接触するp側電極と、
前記半導体基板の裏面に設けられたn側電極と、
を備えた窒化物半導体素子であって、
前記p側電極は、前記p型領域の一部に接触する第1のp側電極層と、前記第1のp側電極層上に配置された第2のp側電極層とを含んでおり、
前記第1のp側電極層の一部が前記第2のp側電極層から露出している窒化物半導体発光素子を用意する工程と、
前記第1のp側電極層の第2のp側電極層から露出する部分を認識して、前記窒化物半導体発光素子を放熱台に実装する工程と、
を含む窒化物半導体発光装置の製造方法。 - 前記第1のp側電極層のうち前記第2のp側電極層から露出する部分は、前記開口部の上方に位置していない、請求項1に記載の窒化物半導体発光装置の製造方法。
- 前記第1のp側電極層のうち第2のp側電極層から露出する部分の個数は複数である、請求項1に記載の窒化物半導体発光装置の製造方法。
- 前記絶縁膜の開口部がストライプ状であり、前記第1のp側電極層の第2のp側電極層からの露出箇所が前記絶縁膜の開口部を挟んで複数個配置されている、請求項1に記載の窒化物半導体発光装置の製造方法。
- 前記第1のp側電極層の最表層の色相、彩度、および/または明度と前記第2のp側電極層の最表層の色相、彩度、および/または明度とが異なる、請求項1に記載の窒化物半導体発光装置の製造方法。
- 前記第1のp側電極層の最表層の反射率と前記第2のp側電極層の最表層の反射率と前記絶縁膜の反射率とがそれぞれ異なる、請求項1に記載の窒化物半導体発光装置の製造方法。
- 前記実装工程において、前記窒化物半導体素子の前記半導体基板の裏面側を前記放熱台に実装する請求項1に記載の窒化物半導体発光装置の製造方法。
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JP2007553877A JP5053102B2 (ja) | 2006-01-11 | 2006-12-27 | 窒化物半導体発光素子、窒化物半導体発光装置及びその製造方法 |
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JP2007553877A JP5053102B2 (ja) | 2006-01-11 | 2006-12-27 | 窒化物半導体発光素子、窒化物半導体発光装置及びその製造方法 |
PCT/JP2006/326097 WO2007080795A1 (ja) | 2006-01-11 | 2006-12-27 | 窒化物半導体発光素子、窒化物半導体発光装置及びその製造方法 |
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US (1) | US7880192B2 (ja) |
JP (1) | JP5053102B2 (ja) |
CN (1) | CN101356701A (ja) |
WO (1) | WO2007080795A1 (ja) |
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JP4835662B2 (ja) * | 2008-08-27 | 2011-12-14 | 住友電気工業株式会社 | 窒化物系半導体発光素子を作製する方法、及びエピタキシャルウエハを作製する方法 |
DE102016120685A1 (de) * | 2016-10-28 | 2018-05-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterlasers und Halbleiterlaser |
Citations (3)
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JPH11330610A (ja) * | 1998-05-11 | 1999-11-30 | Nichia Chem Ind Ltd | 窒化物半導体レーザー |
JP2002158405A (ja) * | 2000-11-17 | 2002-05-31 | Sharp Corp | 窒化物半導体発光素子、光ピックアップ装置、および、発光装置 |
JP2004281432A (ja) * | 2003-03-12 | 2004-10-07 | Nichia Chem Ind Ltd | 窒化物半導体素子及びその製造方法 |
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CA2044717A1 (en) | 1990-06-18 | 1991-12-19 | Candadai S. Ramadoss | Process for the separation of proteins, polypeptides or metals |
JPH0679172U (ja) * | 1993-04-14 | 1994-11-04 | 松下電器産業株式会社 | 半導体レーザ |
JP3896723B2 (ja) | 1999-03-26 | 2007-03-22 | 松下電器産業株式会社 | 窒化物半導体レーザ素子およびその製造方法 |
JP2001298243A (ja) | 2000-04-14 | 2001-10-26 | Sharp Corp | 半導体レーザ素子、半導体レーザ装置および光学式情報再生装置 |
JP3650000B2 (ja) | 2000-07-04 | 2005-05-18 | 三洋電機株式会社 | 窒化物系半導体レーザ素子および窒化物半導体レーザ装置の製造方法 |
KR100550158B1 (ko) * | 2000-09-21 | 2006-02-08 | 샤프 가부시키가이샤 | 질화물 반도체 발광소자 및 그것을 포함한 광학장치 |
JP2002314205A (ja) * | 2001-04-19 | 2002-10-25 | Sharp Corp | 窒化物半導体発光素子ならびにそれを用いた光学装置および発光装置 |
US6787435B2 (en) * | 2001-07-05 | 2004-09-07 | Gelcore Llc | GaN LED with solderable backside metal |
JP4043794B2 (ja) | 2002-02-05 | 2008-02-06 | 住友電気工業株式会社 | 窒化物系化合物半導体素子の実装方法 |
JP4504610B2 (ja) * | 2002-03-01 | 2010-07-14 | 株式会社日立製作所 | リッジ型半導体レーザ素子 |
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- 2006-12-27 WO PCT/JP2006/326097 patent/WO2007080795A1/ja active Application Filing
- 2006-12-27 US US12/159,786 patent/US7880192B2/en active Active
- 2006-12-27 CN CNA2006800509231A patent/CN101356701A/zh active Pending
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JPH11330610A (ja) * | 1998-05-11 | 1999-11-30 | Nichia Chem Ind Ltd | 窒化物半導体レーザー |
JP2002158405A (ja) * | 2000-11-17 | 2002-05-31 | Sharp Corp | 窒化物半導体発光素子、光ピックアップ装置、および、発光装置 |
JP2004281432A (ja) * | 2003-03-12 | 2004-10-07 | Nichia Chem Ind Ltd | 窒化物半導体素子及びその製造方法 |
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JPWO2007080795A1 (ja) | 2009-06-11 |
WO2007080795A1 (ja) | 2007-07-19 |
CN101356701A (zh) | 2009-01-28 |
US20090159921A1 (en) | 2009-06-25 |
US7880192B2 (en) | 2011-02-01 |
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