JP5052350B2 - マイクロチャネル冷却を備えたヒートシンク - Google Patents

マイクロチャネル冷却を備えたヒートシンク Download PDF

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Publication number
JP5052350B2
JP5052350B2 JP2007543147A JP2007543147A JP5052350B2 JP 5052350 B2 JP5052350 B2 JP 5052350B2 JP 2007543147 A JP2007543147 A JP 2007543147A JP 2007543147 A JP2007543147 A JP 2007543147A JP 5052350 B2 JP5052350 B2 JP 5052350B2
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Japan
Prior art keywords
inlet
microchannel
outlet
manifold
plenum
Prior art date
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Expired - Fee Related
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JP2007543147A
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English (en)
Japanese (ja)
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JP2008522406A (ja
JP2008522406A5 (cg-RX-API-DMAC7.html
Inventor
ステヴァノヴィク，リュビサ・ドラゴルジャブ
ソロヴィッツ，スティーブン・アダム
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General Electric Co
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General Electric Co
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Publication of JP2008522406A5 publication Critical patent/JP2008522406A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2007543147A 2004-11-24 2005-11-14 マイクロチャネル冷却を備えたヒートシンク Expired - Fee Related JP5052350B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/998,707 2004-11-24
US10/998,707 US7353859B2 (en) 2004-11-24 2004-11-24 Heat sink with microchannel cooling for power devices
PCT/US2005/041087 WO2007001456A1 (en) 2004-11-24 2005-11-14 Heat sink with microchannel cooling for power devices

Publications (3)

Publication Number Publication Date
JP2008522406A JP2008522406A (ja) 2008-06-26
JP2008522406A5 JP2008522406A5 (cg-RX-API-DMAC7.html) 2009-01-08
JP5052350B2 true JP5052350B2 (ja) 2012-10-17

Family

ID=36459885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007543147A Expired - Fee Related JP5052350B2 (ja) 2004-11-24 2005-11-14 マイクロチャネル冷却を備えたヒートシンク

Country Status (8)

Country Link
US (2) US7353859B2 (cg-RX-API-DMAC7.html)
EP (1) EP1825730B1 (cg-RX-API-DMAC7.html)
JP (1) JP5052350B2 (cg-RX-API-DMAC7.html)
CN (1) CN100559926C (cg-RX-API-DMAC7.html)
CA (1) CA2589183C (cg-RX-API-DMAC7.html)
DE (1) DE602005025923D1 (cg-RX-API-DMAC7.html)
IL (1) IL183311A0 (cg-RX-API-DMAC7.html)
WO (1) WO2007001456A1 (cg-RX-API-DMAC7.html)

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