JP5052085B2 - ピックアップ装置 - Google Patents

ピックアップ装置 Download PDF

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Publication number
JP5052085B2
JP5052085B2 JP2006255148A JP2006255148A JP5052085B2 JP 5052085 B2 JP5052085 B2 JP 5052085B2 JP 2006255148 A JP2006255148 A JP 2006255148A JP 2006255148 A JP2006255148 A JP 2006255148A JP 5052085 B2 JP5052085 B2 JP 5052085B2
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JP
Japan
Prior art keywords
film
chip
jig
pressing
pressing jig
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Expired - Fee Related
Application number
JP2006255148A
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English (en)
Japanese (ja)
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JP2007123846A5 (enExample
JP2007123846A (ja
Inventor
大幹 山田
直人 楠本
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2006255148A priority Critical patent/JP5052085B2/ja
Publication of JP2007123846A publication Critical patent/JP2007123846A/ja
Publication of JP2007123846A5 publication Critical patent/JP2007123846A5/ja
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Publication of JP5052085B2 publication Critical patent/JP5052085B2/ja
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  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2006255148A 2005-09-29 2006-09-21 ピックアップ装置 Expired - Fee Related JP5052085B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006255148A JP5052085B2 (ja) 2005-09-29 2006-09-21 ピックアップ装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005284550 2005-09-29
JP2005284550 2005-09-29
JP2006255148A JP5052085B2 (ja) 2005-09-29 2006-09-21 ピックアップ装置

Publications (3)

Publication Number Publication Date
JP2007123846A JP2007123846A (ja) 2007-05-17
JP2007123846A5 JP2007123846A5 (enExample) 2009-10-22
JP5052085B2 true JP5052085B2 (ja) 2012-10-17

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ID=38147292

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JP2006255148A Expired - Fee Related JP5052085B2 (ja) 2005-09-29 2006-09-21 ピックアップ装置

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JP (1) JP5052085B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8368641B2 (en) 1995-11-30 2013-02-05 Immersion Corporation Tactile feedback man-machine interface device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5621354B2 (ja) * 2010-06-28 2014-11-12 カシオ計算機株式会社 圧着冶具及び表示装置の製造方法
JP6670683B2 (ja) * 2016-06-07 2020-03-25 株式会社Ｓｃｒｅｅｎラミナテック キャリア基板と樹脂層からなるワークの分離方法および分離装置
JP2021197400A (ja) * 2020-06-10 2021-12-27 三井化学株式会社 素子転写部材、素子転写部材の製造方法および半導体デバイスの製造方法
JP2025071928A (ja) * 2023-10-24 2025-05-09 Ｋｎｅ株式会社 半導体チップのピックアップ装置及び半導体チップのピックアップ方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3243391B2 (ja) * 1995-03-17 2002-01-07 岩手東芝エレクトロニクス株式会社 半導体製造装置
JPH11150133A (ja) * 1997-09-04 1999-06-02 Hitachi Ltd 半導体素子の搭載方法及びそのシステム、半導体素子分離装置並びにｉｃカードの製造方法
JP2003224088A (ja) * 2002-01-29 2003-08-08 Nec Electronics Corp 半導体チップピックアップ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8368641B2 (en) 1995-11-30 2013-02-05 Immersion Corporation Tactile feedback man-machine interface device
US9690379B2 (en) 1995-11-30 2017-06-27 Immersion Corporation Tactile feedback interface device

Also Published As

Publication number Publication date
JP2007123846A (ja) 2007-05-17

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