JP5051322B1 - 冷却器 - Google Patents
冷却器 Download PDFInfo
- Publication number
- JP5051322B1 JP5051322B1 JP2011536675A JP2011536675A JP5051322B1 JP 5051322 B1 JP5051322 B1 JP 5051322B1 JP 2011536675 A JP2011536675 A JP 2011536675A JP 2011536675 A JP2011536675 A JP 2011536675A JP 5051322 B1 JP5051322 B1 JP 5051322B1
- Authority
- JP
- Japan
- Prior art keywords
- flow
- wall surface
- refrigerant
- side wall
- cooling case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 104
- 239000003507 refrigerant Substances 0.000 claims abstract description 84
- 230000002265 prevention Effects 0.000 claims abstract description 16
- 230000005489 elastic deformation Effects 0.000 claims description 22
- 229920001971 elastomer Polymers 0.000 description 42
- 239000004065 semiconductor Substances 0.000 description 12
- 239000002826 coolant Substances 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000010273 cold forging Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【選択図】図3
Description
2 半導体素子
3 絶縁基板
4 冷却器
10 天板
20 ピンフィン
20a 端部分
20b 先端
20c 対向面
21 ゴム片
30 冷却ケース
30a 開口部
31 底壁面
32 側壁面
32a 連通口
35 突起
36 ゴムシート
37 ゴムカバー
40 冷媒
50 Oリング
60 第2ケース
MS 主流
NS 副流
S1,S2 隙間
BW 底壁部
Claims (4)
- 天板と冷却ケースとの間に配置されているフィン部材に対して冷媒が流れる冷却器において、
前記冷却ケースにおいて前記冷媒が流れる流れ方向に延びる側壁面と、前記フィン部材において前記側壁面に一番近い端部分との間の隙間で、前記流れ方向における前記冷媒の直線状流れを防止する流動防止手段が設けられ、
前記流動防止手段は、前記流れ方向に延びていて前記冷却ケースの側壁面と前記フィン部材の端部分との間に介装される第1弾性変形部材であることを特徴とする冷却器。 - 天板と冷却ケースとの間に配置されているフィン部材に対して冷媒が流れる冷却器において、
前記冷却ケースにおいて前記冷媒が流れる流れ方向に延びる側壁面と、前記フィン部材において前記側壁面に一番近い端部分との間の隙間で、前記流れ方向における前記冷媒の直線状流れを防止する流動防止手段が設けられ、
前記流動防止手段は、前記フィン部材の端部分のうち前記冷却ケースの側壁面に対向する対向面に組付けられていて前記冷却ケースの側壁面を押圧する第2弾性変形部材であることを特徴とする冷却器。 - 天板と冷却ケースとの間に配置されているフィン部材に対して冷媒が流れる冷却器において、
前記冷却ケースにおいて前記冷媒が流れる流れ方向に延びる側壁面と、前記フィン部材において前記側壁面に一番近い端部分との間の隙間で、前記流れ方向における前記冷媒の直線状流れを防止する流動防止手段が設けられ、
前記冷却ケースの底壁部には、前記隙間に連通していて前記隙間に向けて冷媒を供給する連通口が設けられ、
前記流動防止手段は、前記連通口から前記隙間に向けて流れる冷媒の流れであることを特徴とする冷却器。 - 請求項1乃至請求項3の何れかに記載された冷却器において、
前記フィン部材は、前記天板に一体成形されていて前記天板に対向する前記冷却ケースの底壁面に向けて延びる複数のピンフィンであり、
前記複数のピンフィンの先端に、前記冷却ケースの底壁面を押圧する第3弾性変形部材がそれぞれ組付けられていることを特徴とする冷却器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/053986 WO2012114475A1 (ja) | 2011-02-23 | 2011-02-23 | 冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5051322B1 true JP5051322B1 (ja) | 2012-10-17 |
JPWO2012114475A1 JPWO2012114475A1 (ja) | 2014-07-07 |
Family
ID=46720294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011536675A Expired - Fee Related JP5051322B1 (ja) | 2011-02-23 | 2011-02-23 | 冷却器 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5051322B1 (ja) |
WO (1) | WO2012114475A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014109235A1 (ja) * | 2013-01-11 | 2014-07-17 | フタバ産業株式会社 | 冷却器及び放熱部材の製造方法 |
EP4283666A4 (en) * | 2021-01-27 | 2024-07-24 | Resonac Corp | COOLING STRUCTURE |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014056982A (ja) * | 2012-09-13 | 2014-03-27 | Mitsubishi Electric Corp | パワー半導体装置およびその製造方法 |
JP6262422B2 (ja) * | 2012-10-02 | 2018-01-17 | 昭和電工株式会社 | 冷却装置および半導体装置 |
WO2014092655A1 (en) * | 2012-12-10 | 2014-06-19 | Sieva, Podjetje Za Razvoj In Trženje V Avtomobilski Industriji, D.O.O. | Advanced heat exchanger with integrated coolant fluid flow deflector |
JP2015126207A (ja) * | 2013-12-27 | 2015-07-06 | 三菱電機株式会社 | 半導体装置 |
JP5897760B1 (ja) * | 2015-02-27 | 2016-03-30 | カルソニックカンセイ株式会社 | 冷却装置 |
JP6447449B2 (ja) * | 2015-10-08 | 2019-01-09 | 株式会社デンソー | 熱交換チューブ |
CN105555105B (zh) * | 2016-02-24 | 2018-08-03 | 新乡市特美特热控技术股份有限公司 | 一种蒸发器均温冷板 |
JP6662242B2 (ja) * | 2016-08-24 | 2020-03-11 | トヨタ自動車株式会社 | 半導体装置 |
JP6616264B2 (ja) * | 2016-08-30 | 2019-12-04 | 本田技研工業株式会社 | 冷却器及びそれを備えた冷却装置 |
JP2018084726A (ja) * | 2016-11-25 | 2018-05-31 | セイコーエプソン株式会社 | 光学装置およびプロジェクター |
DE102017101126B4 (de) * | 2017-01-20 | 2021-08-19 | Danfoss Silicon Power Gmbh | Leistungselektroniksystem und Verfahren zu dessen Herstellung |
JP6462737B2 (ja) | 2017-01-24 | 2019-01-30 | 三菱電機株式会社 | ヒートシンク |
CN107731767A (zh) * | 2017-10-09 | 2018-02-23 | 上海工程技术大学 | 一种具有水平方向及垂直方向扰流结构的微通道散热器 |
JP6563161B1 (ja) * | 2018-03-15 | 2019-08-21 | 三菱電機株式会社 | 冷却器、電力変換装置ユニット及び冷却システム |
WO2019176620A1 (ja) * | 2018-03-15 | 2019-09-19 | 三菱電機株式会社 | 冷却器、電力変換装置ユニット及び冷却システム |
CN109788724B (zh) * | 2019-03-20 | 2020-10-27 | 浪潮商用机器有限公司 | 一种通风稳定机柜 |
FR3098081B1 (fr) * | 2019-06-30 | 2023-06-16 | Valeo Systemes De Controle Moteur | Circuit de refroidissement pour logement électronique avec module de puissance |
CN112292007A (zh) * | 2020-11-02 | 2021-01-29 | 阳光电源股份有限公司 | 水冷散热装置及电器装置 |
EP4282234A1 (en) * | 2021-01-21 | 2023-11-29 | Hydraspecma AS | A method for cooling an object, a cooling device and use of a cooling device |
JP2023004273A (ja) * | 2021-06-25 | 2023-01-17 | 日立Astemo株式会社 | 電力変換装置 |
DE102022205733A1 (de) * | 2022-06-07 | 2023-12-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kühlvorrichtung zur Kühlung von einer elektrischen und/oder elektronischen Baugruppe |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003047258A (ja) * | 2001-07-30 | 2003-02-14 | Hiroshima Aluminum Industry Co Ltd | 水冷式ヒートシンク |
JP2008187754A (ja) * | 2007-01-26 | 2008-08-14 | Aisin Aw Co Ltd | 発熱体冷却構造及び駆動装置 |
JP2009152455A (ja) * | 2007-12-21 | 2009-07-09 | Denso Corp | 半導体冷却構造 |
JP2009260037A (ja) * | 2008-04-16 | 2009-11-05 | Toyota Motor Corp | 熱交換器 |
-
2011
- 2011-02-23 WO PCT/JP2011/053986 patent/WO2012114475A1/ja active Application Filing
- 2011-02-23 JP JP2011536675A patent/JP5051322B1/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003047258A (ja) * | 2001-07-30 | 2003-02-14 | Hiroshima Aluminum Industry Co Ltd | 水冷式ヒートシンク |
JP2008187754A (ja) * | 2007-01-26 | 2008-08-14 | Aisin Aw Co Ltd | 発熱体冷却構造及び駆動装置 |
JP2009152455A (ja) * | 2007-12-21 | 2009-07-09 | Denso Corp | 半導体冷却構造 |
JP2009260037A (ja) * | 2008-04-16 | 2009-11-05 | Toyota Motor Corp | 熱交換器 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014109235A1 (ja) * | 2013-01-11 | 2014-07-17 | フタバ産業株式会社 | 冷却器及び放熱部材の製造方法 |
JPWO2014109235A1 (ja) * | 2013-01-11 | 2017-01-19 | フタバ産業株式会社 | 冷却器及び放熱部材の製造方法 |
EP4283666A4 (en) * | 2021-01-27 | 2024-07-24 | Resonac Corp | COOLING STRUCTURE |
Also Published As
Publication number | Publication date |
---|---|
WO2012114475A1 (ja) | 2012-08-30 |
JPWO2012114475A1 (ja) | 2014-07-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5051322B1 (ja) | 冷却器 | |
JP4046703B2 (ja) | ヒートシンク | |
WO2012086058A1 (ja) | 冷却器 | |
JP5454586B2 (ja) | 冷却器 | |
CN205119894U (zh) | 热管 | |
JP6062516B1 (ja) | ヒートシンク | |
JP2010056131A (ja) | 液冷式冷却装置 | |
JP2017108045A (ja) | 液冷式冷却装置 | |
JP2017017133A (ja) | 液冷式冷却装置 | |
JP2008288330A (ja) | 半導体装置 | |
JP2018107365A (ja) | 液冷式冷却装置用放熱器およびその製造方法 | |
JP6917230B2 (ja) | 放熱器およびこれを用いた液冷式冷却装置 | |
JP6932632B2 (ja) | 液冷式冷却装置 | |
JP2011171569A (ja) | 冷却器 | |
JP4016851B2 (ja) | モジュール部品 | |
JP2014175568A (ja) | 半導体素子の冷却装置 | |
JP6623120B2 (ja) | 液冷式冷却装置 | |
JP5589647B2 (ja) | 冷却装置 | |
JP5772171B2 (ja) | 熱交換器 | |
TWI566670B (zh) | 散熱裝置 | |
JP2013069959A (ja) | パワーモジュールの冷却構造 | |
JP6414187B2 (ja) | 電力変換装置 | |
JP2010109016A (ja) | 冷却器 | |
JP5274426B2 (ja) | 液冷式冷却装置 | |
JP2021097134A (ja) | 冷却装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120626 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120709 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5051322 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150803 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |