JP5050241B2 - 流体温調装置 - Google Patents
流体温調装置Info
- Publication number
- JP5050241B2 JP5050241B2 JP2007017815A JP2007017815A JP5050241B2 JP 5050241 B2 JP5050241 B2 JP 5050241B2 JP 2007017815 A JP2007017815 A JP 2007017815A JP 2007017815 A JP2007017815 A JP 2007017815A JP 5050241 B2 JP5050241 B2 JP 5050241B2
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- heat transfer
- temperature control
- main body
- body block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012530 fluid Substances 0.000 title claims description 101
- 238000012546 transfer Methods 0.000 claims description 66
- 238000005192 partition Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 description 32
- 239000007788 liquid Substances 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Weting (AREA)
Description
図1〜図3は、本発明に関わる流体温調装置を、半導体の製造プロセスにおいて使用される薬液(被温調流体)、具体的にはアンモニア過水や塩酸過水等、ウェットプロセス(RCA洗浄)やウェットエッチング等に使用される酸系の薬液を対象として温度調節を行なうための流体温調装置に適用した例を示している。
なお、図中の符号2Pは、排出通路2yの端部開口を閉止するべく、本体ブロック2に固設されたプラグである。
因みに、上記耐蝕プレート3Pは、酸性の薬液に対する耐蝕性とともに良好な熱伝導性を備えたアモルファスカーボンから形成されている。
2、2′…本体ブロック、
2a、2a′…表面、
2i、2i′…流体入口、
2o、2o′…流体出口、
2g、2g′…流路溝、
2w、2w′…隔壁、
2d、2d′…ドレン通路、
2I、2I′…導入パイプ、
2O、2O′…排出パイプ、
3、3′…伝熱板、
3P、3P′…耐蝕プレート、
4、4′…ペルチェモジュール(温調手段)、
5、5′…ウォータジャケット、
10、10′…流路。
Claims (3)
- 表面に流路溝を形成した本体ブロックと、前記本体ブロックの表面に設置されて前記流路溝を覆う伝熱板と、前記伝熱板で前記本体プロックの前記流路溝を覆うことにより形成される流路と、前記伝熱板を介在して前記流路を通過する被温調流体との間で熱交換を行うペルチェモジュールとを具備して成る流体温調装置であって、
前記伝熱板に臨む前記流路が、前記本体ブロックに形成された流体入口と流体出口とを繋ぎ、かつ全長に亘って略一定の流路断面積を有する1本の渦巻き形状を呈して成る流路であることを特徴とする流体温調装置。 - 前記本体ブロックの内部に導入通路が形成され、該導入通路は前記流体入口を介して前記流路と連通されることを特徴とする請求項1記載の流体温調装置。
- 前記本体ブロックにおける隣合う前記流路溝の間の隔壁に、隣合う前記流路を互いに連通するドレン通路を形成して成ることを特徴とする請求項1または請求項2記載の流体温調装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007017815A JP5050241B2 (ja) | 2007-01-29 | 2007-01-29 | 流体温調装置 |
US12/011,296 US7938577B2 (en) | 2007-01-29 | 2008-01-25 | Fluid temperature control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007017815A JP5050241B2 (ja) | 2007-01-29 | 2007-01-29 | 流体温調装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008186913A JP2008186913A (ja) | 2008-08-14 |
JP5050241B2 true JP5050241B2 (ja) | 2012-10-17 |
Family
ID=39729764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007017815A Active JP5050241B2 (ja) | 2007-01-29 | 2007-01-29 | 流体温調装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7938577B2 (ja) |
JP (1) | JP5050241B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5390324B2 (ja) * | 2009-09-29 | 2014-01-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
TWI410595B (zh) | 2010-09-29 | 2013-10-01 | Ind Tech Res Inst | 熱電式飲用裝置及熱電式熱泵 |
US9059184B2 (en) * | 2011-12-19 | 2015-06-16 | Rkd Engineering Corporation | Apparatus and method for decapsulating packaged integrated circuits |
EP2858104B1 (en) * | 2012-05-30 | 2020-07-29 | Kyocera Corporation | Flow path member, and adsorption device and refrigeration device employing same |
EP2816439B1 (en) * | 2013-04-22 | 2018-10-03 | Huawei Device Co., Ltd. | Device for preventing deformation of communication card |
US10486232B2 (en) * | 2015-04-21 | 2019-11-26 | Varian Semiconductor Equipment Associates, Inc. | Semiconductor manufacturing device with embedded fluid conduits |
AT516611B1 (de) * | 2015-06-23 | 2016-07-15 | Avl List Gmbh | Temperiereinheit für ein gasförmiges oder flüssiges Medium |
AT516385B1 (de) * | 2015-06-23 | 2016-05-15 | Avl List Gmbh | Temperiereinheit für ein gasförmiges oder flüssiges Medium |
JP7236845B2 (ja) * | 2018-11-15 | 2023-03-10 | 株式会社Kelk | 温調装置 |
JP7236846B2 (ja) * | 2018-11-15 | 2023-03-10 | 株式会社Kelk | 温調装置及び温調装置の製造方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2800793A (en) * | 1955-04-28 | 1957-07-30 | Joseph J Oliver | Calorimeters |
JPS55146311A (en) * | 1979-04-30 | 1980-11-14 | Matsushita Electric Works Ltd | Electric heater evaporator |
US4504156A (en) * | 1982-07-06 | 1985-03-12 | Sperry Corporation | Cooling system monitor assembly and method |
US4522511A (en) * | 1982-09-13 | 1985-06-11 | Scientech, Inc. | Method and apparatus for measuring radiant energy |
US4595824A (en) * | 1984-09-19 | 1986-06-17 | The United States Of America As Represented By The Secretary Of The Air Force | Heater block assembly for use in thermal oxidation testing of jet fuel |
GB8528517D0 (en) * | 1985-11-20 | 1985-12-24 | United Biscuits Ltd | Radiant heat measurement |
JPH0322653U (ja) * | 1989-07-14 | 1991-03-08 | ||
EP0616210A1 (en) * | 1993-03-17 | 1994-09-21 | Ciba-Geigy Ag | Flow cell for calorimetric measurements |
US5833365A (en) * | 1995-03-24 | 1998-11-10 | Interuniversitair Micro-Electronika Centrum Vzw | Method for local temperature sensing for use in performing high resolution in-situ parameter measurements |
US5779363A (en) * | 1995-09-27 | 1998-07-14 | The Johns Hopkins University | Capillary calorimetric cell and method of manufacturing same |
AT405685B (de) * | 1996-04-17 | 1999-10-25 | Andritz Patentverwaltung | Wärmetauscher |
JPH10151936A (ja) * | 1996-11-21 | 1998-06-09 | Toyota Autom Loom Works Ltd | 流体摩擦熱利用ヒータ |
JP3724763B2 (ja) * | 1997-08-19 | 2005-12-07 | 小松エレクトロニクス株式会社 | 半導体処理液用冷却加熱装置 |
JPH1167717A (ja) * | 1997-08-19 | 1999-03-09 | Komatsu Electron Kk | 半導体処理液用冷却加熱装置 |
JP2001355994A (ja) * | 2000-06-12 | 2001-12-26 | Toyo Radiator Co Ltd | 気体冷却用積層型熱交換器 |
DE10042746A1 (de) * | 2000-08-31 | 2002-03-28 | Degussa | Verfahren und Vorrichtung zum Durchführen von Reaktionen in einem Reaktor mit spaltförmigen Reaktionsräumen |
US6938688B2 (en) * | 2001-12-05 | 2005-09-06 | Thomas & Betts International, Inc. | Compact high efficiency clam shell heat exchanger |
US6912357B2 (en) * | 2002-01-29 | 2005-06-28 | Valeo Electrical Systems, Inc. | Fluid heater |
US6666031B2 (en) | 2002-03-14 | 2003-12-23 | Komatsu, Ltd. | Fluid temperature control apparatus |
CN1892206A (zh) * | 2005-07-08 | 2007-01-10 | 鸿富锦精密工业(深圳)有限公司 | 热管量测装置 |
CN1979147B (zh) * | 2005-12-09 | 2010-05-26 | 富准精密工业(深圳)有限公司 | 热管性能检测装置 |
CN2926973Y (zh) * | 2006-06-15 | 2007-07-25 | 刘袆拉 | 一种螺旋板式气液热交换器 |
-
2007
- 2007-01-29 JP JP2007017815A patent/JP5050241B2/ja active Active
-
2008
- 2008-01-25 US US12/011,296 patent/US7938577B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008186913A (ja) | 2008-08-14 |
US20080212642A1 (en) | 2008-09-04 |
US7938577B2 (en) | 2011-05-10 |
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