JP5048987B2 - 洗浄装置 - Google Patents
洗浄装置 Download PDFInfo
- Publication number
- JP5048987B2 JP5048987B2 JP2006264721A JP2006264721A JP5048987B2 JP 5048987 B2 JP5048987 B2 JP 5048987B2 JP 2006264721 A JP2006264721 A JP 2006264721A JP 2006264721 A JP2006264721 A JP 2006264721A JP 5048987 B2 JP5048987 B2 JP 5048987B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- frame
- rotary table
- negative pressure
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims description 63
- 230000002093 peripheral effect Effects 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 26
- 239000012530 fluid Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Landscapes
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
20 回転テーブル
21 洗浄流体供給ノズル
24 駆動源
26 フレーム保持部
27 ウエーハ領域保持部
33 規制部
34 圧力センサ
35 判定手段
37 規制部
281 振り子
281a 押さえ部
281b 重り部
F フレーム
T テープ
W ウエーハ
Claims (1)
- テープを介してフレームと一体となったウエーハを保持して回転可能な回転テーブルであって、
前記フレームを保持するフレーム保持部と、負圧源に連結されてウエーハ領域を負圧により吸引保持するウエーハ領域保持部と、前記フレーム保持部の外周部に回動自在に軸支され、当該回転テーブルの回転によって生ずる遠心力で外周側に揺動する重り部と該重り部の外周側への揺動に追従して内周側に揺動し前記フレームを前記フレーム保持部とで挟持する押さえ部とを有する振り子と、前記押さえ部が初期状態から外周側へ揺動しないように前記振り子の揺動を規制する規制部と、を備える回転テーブルと、
該回転テーブルを回転させる駆動源と、
前記回転テーブルに保持されたウエーハに洗浄流体を供給する洗浄流体供給ノズルと、
前記ウエーハ領域保持部に作用する負圧を検知する圧力センサと、
該圧力センサで検知された負圧値が所定の閾値以下の場合にエラーと判定する判定手段と、
を備え、該判定手段によりエラーと判定された場合に洗浄動作を停止させるようにしているとともに、
前記フレームと一体となったウエーハに位置ずれが生じて前記回転テーブル上に載置された際に、前記フレームが前記押さえ部の先端部に載るように、前記初期状態では、前記押さえ部の先端部の高さ位置は前記フレーム保持部の表面よりも上方に突出した位置となるように設定されていることを特徴とする洗浄装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006264721A JP5048987B2 (ja) | 2006-09-28 | 2006-09-28 | 洗浄装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006264721A JP5048987B2 (ja) | 2006-09-28 | 2006-09-28 | 洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008085146A JP2008085146A (ja) | 2008-04-10 |
JP5048987B2 true JP5048987B2 (ja) | 2012-10-17 |
Family
ID=39355672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006264721A Active JP5048987B2 (ja) | 2006-09-28 | 2006-09-28 | 洗浄装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5048987B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5384904B2 (ja) * | 2008-10-16 | 2014-01-08 | 株式会社ディスコ | 洗浄装置 |
JP5673929B2 (ja) * | 2010-10-14 | 2015-02-18 | 株式会社東京精密 | スピンナ洗浄装置及びスピンナ洗浄方法 |
US20230178414A1 (en) * | 2021-12-06 | 2023-06-08 | Skyworks Solutions, Inc. | Chuck table for a wafer cleaning tool |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197515A (ja) * | 1997-09-22 | 1999-04-09 | Toshiba Corp | ウエハ支持用回転テーブル |
JP2002367946A (ja) * | 2001-06-08 | 2002-12-20 | Rix Corp | ウエーハ洗浄用のスピンチャックテーブル |
JP4502260B2 (ja) * | 2004-10-28 | 2010-07-14 | 株式会社ディスコ | スピンナー洗浄装置及びダイシング装置 |
-
2006
- 2006-09-28 JP JP2006264721A patent/JP5048987B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008085146A (ja) | 2008-04-10 |
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