JP5032747B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5032747B2
JP5032747B2 JP2005036483A JP2005036483A JP5032747B2 JP 5032747 B2 JP5032747 B2 JP 5032747B2 JP 2005036483 A JP2005036483 A JP 2005036483A JP 2005036483 A JP2005036483 A JP 2005036483A JP 5032747 B2 JP5032747 B2 JP 5032747B2
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JP
Japan
Prior art keywords
semiconductor device
light emitting
package member
emitting element
lead electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005036483A
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English (en)
Japanese (ja)
Other versions
JP2006222382A (ja
JP2006222382A5 (enExample
Inventor
英夫 朝川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2005036483A priority Critical patent/JP5032747B2/ja
Publication of JP2006222382A publication Critical patent/JP2006222382A/ja
Publication of JP2006222382A5 publication Critical patent/JP2006222382A5/ja
Application granted granted Critical
Publication of JP5032747B2 publication Critical patent/JP5032747B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005036483A 2005-02-14 2005-02-14 半導体装置 Expired - Fee Related JP5032747B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005036483A JP5032747B2 (ja) 2005-02-14 2005-02-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005036483A JP5032747B2 (ja) 2005-02-14 2005-02-14 半導体装置

Publications (3)

Publication Number Publication Date
JP2006222382A JP2006222382A (ja) 2006-08-24
JP2006222382A5 JP2006222382A5 (enExample) 2008-02-14
JP5032747B2 true JP5032747B2 (ja) 2012-09-26

Family

ID=36984458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005036483A Expired - Fee Related JP5032747B2 (ja) 2005-02-14 2005-02-14 半導体装置

Country Status (1)

Country Link
JP (1) JP5032747B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140088021A (ko) * 2012-12-29 2014-07-09 니치아 카가쿠 고교 가부시키가이샤 발광 장치용 패키지 및 그것을 구비하는 발광 장치, 및 그 발광 장치를 구비하는 조명 장치

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5380774B2 (ja) * 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP4976167B2 (ja) * 2007-03-06 2012-07-18 豊田合成株式会社 発光装置
JP4976168B2 (ja) * 2007-03-06 2012-07-18 豊田合成株式会社 発光装置
JP2008218764A (ja) * 2007-03-06 2008-09-18 Toyoda Gosei Co Ltd 発光装置
JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
JP5161504B2 (ja) 2007-07-12 2013-03-13 ローム株式会社 半導体発光装置
KR100981214B1 (ko) * 2008-01-28 2010-09-10 알티전자 주식회사 발광다이오드 패키지
JP2010003743A (ja) * 2008-06-18 2010-01-07 Toshiba Corp 発光装置
TWI456784B (zh) * 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
JP5444654B2 (ja) * 2008-07-29 2014-03-19 日亜化学工業株式会社 発光装置
JP5507330B2 (ja) * 2010-04-27 2014-05-28 ローム株式会社 Ｌｅｄモジュール
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
DE102013206963A1 (de) 2013-04-17 2014-11-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
US10243107B2 (en) 2016-09-28 2019-03-26 Nichia Corporation Light emitting device and method for manufacturing thereof
JP6508276B2 (ja) * 2016-09-28 2019-05-08 日亜化学工業株式会社 発光装置及びその製造方法
JP7257610B2 (ja) * 2019-07-25 2023-04-14 日亜化学工業株式会社 発光モジュール
JP7460911B2 (ja) * 2020-12-21 2024-04-03 日亜化学工業株式会社 発光装置及びそれを用いたディスプレイ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335720A (ja) * 1995-06-08 1996-12-17 Nichia Chem Ind Ltd 窒化物半導体発光ダイオード
JPH09307046A (ja) * 1996-05-15 1997-11-28 Nec Corp 金型及び該金型を用いたタイバ−切断方法
JP3708026B2 (ja) * 2001-04-12 2005-10-19 豊田合成株式会社 Ｌｅｄランプ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140088021A (ko) * 2012-12-29 2014-07-09 니치아 카가쿠 고교 가부시키가이샤 발광 장치용 패키지 및 그것을 구비하는 발광 장치, 및 그 발광 장치를 구비하는 조명 장치
KR102109651B1 (ko) 2012-12-29 2020-05-12 니치아 카가쿠 고교 가부시키가이샤 발광 장치용 패키지 및 그것을 구비하는 발광 장치, 및 그 발광 장치를 구비하는 조명 장치

Also Published As

Publication number Publication date
JP2006222382A (ja) 2006-08-24

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