JP2006222382A5 - - Google Patents

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Publication number
JP2006222382A5
JP2006222382A5 JP2005036483A JP2005036483A JP2006222382A5 JP 2006222382 A5 JP2006222382 A5 JP 2006222382A5 JP 2005036483 A JP2005036483 A JP 2005036483A JP 2005036483 A JP2005036483 A JP 2005036483A JP 2006222382 A5 JP2006222382 A5 JP 2006222382A5
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JP
Japan
Prior art keywords
light emitting
emitting element
semiconductor device
lead electrode
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005036483A
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English (en)
Japanese (ja)
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JP2006222382A (ja
JP5032747B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2005036483A priority Critical patent/JP5032747B2/ja
Priority claimed from JP2005036483A external-priority patent/JP5032747B2/ja
Publication of JP2006222382A publication Critical patent/JP2006222382A/ja
Publication of JP2006222382A5 publication Critical patent/JP2006222382A5/ja
Application granted granted Critical
Publication of JP5032747B2 publication Critical patent/JP5032747B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005036483A 2005-02-14 2005-02-14 半導体装置 Expired - Fee Related JP5032747B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005036483A JP5032747B2 (ja) 2005-02-14 2005-02-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005036483A JP5032747B2 (ja) 2005-02-14 2005-02-14 半導体装置

Publications (3)

Publication Number Publication Date
JP2006222382A JP2006222382A (ja) 2006-08-24
JP2006222382A5 true JP2006222382A5 (enExample) 2008-02-14
JP5032747B2 JP5032747B2 (ja) 2012-09-26

Family

ID=36984458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005036483A Expired - Fee Related JP5032747B2 (ja) 2005-02-14 2005-02-14 半導体装置

Country Status (1)

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JP (1) JP5032747B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5380774B2 (ja) * 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP4976167B2 (ja) * 2007-03-06 2012-07-18 豊田合成株式会社 発光装置
JP4976168B2 (ja) * 2007-03-06 2012-07-18 豊田合成株式会社 発光装置
JP2008218764A (ja) * 2007-03-06 2008-09-18 Toyoda Gosei Co Ltd 発光装置
JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
JP5161504B2 (ja) 2007-07-12 2013-03-13 ローム株式会社 半導体発光装置
KR100981214B1 (ko) * 2008-01-28 2010-09-10 알티전자 주식회사 발광다이오드 패키지
JP2010003743A (ja) * 2008-06-18 2010-01-07 Toshiba Corp 発光装置
TWI456784B (zh) * 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
JP5444654B2 (ja) * 2008-07-29 2014-03-19 日亜化学工業株式会社 発光装置
JP5507330B2 (ja) * 2010-04-27 2014-05-28 ローム株式会社 Ledモジュール
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
JP6107136B2 (ja) * 2012-12-29 2017-04-05 日亜化学工業株式会社 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置
DE102013206963A1 (de) 2013-04-17 2014-11-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
US10243107B2 (en) 2016-09-28 2019-03-26 Nichia Corporation Light emitting device and method for manufacturing thereof
JP6508276B2 (ja) * 2016-09-28 2019-05-08 日亜化学工業株式会社 発光装置及びその製造方法
JP7257610B2 (ja) * 2019-07-25 2023-04-14 日亜化学工業株式会社 発光モジュール
JP7460911B2 (ja) * 2020-12-21 2024-04-03 日亜化学工業株式会社 発光装置及びそれを用いたディスプレイ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08335720A (ja) * 1995-06-08 1996-12-17 Nichia Chem Ind Ltd 窒化物半導体発光ダイオード
JPH09307046A (ja) * 1996-05-15 1997-11-28 Nec Corp 金型及び該金型を用いたタイバ−切断方法
JP3708026B2 (ja) * 2001-04-12 2005-10-19 豊田合成株式会社 Ledランプ

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