JP5027808B2 - ガス流処理方法 - Google Patents

ガス流処理方法 Download PDF

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Publication number
JP5027808B2
JP5027808B2 JP2008526530A JP2008526530A JP5027808B2 JP 5027808 B2 JP5027808 B2 JP 5027808B2 JP 2008526530 A JP2008526530 A JP 2008526530A JP 2008526530 A JP2008526530 A JP 2008526530A JP 5027808 B2 JP5027808 B2 JP 5027808B2
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chamber
temperature
gas
heat transfer
transfer fluid
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JP2008526530A
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Japanese (ja)
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JP2009504394A (ja
Inventor
ジェイムズ ロバート スミス
アンドリュー ジェイムズ シーリー
デレク マーティン ベイカー
マリレナ ラドイウ
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エドワーズ リミテッド
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Priority claimed from PCT/GB2006/002795 external-priority patent/WO2007020374A1/fr
Publication of JP2009504394A publication Critical patent/JP2009504394A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H01J37/32844—Treating effluent gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Plasma Technology (AREA)
  • Treating Waste Gases (AREA)
  • Drying Of Semiconductors (AREA)
  • Lasers (AREA)
JP2008526530A 2005-08-15 2006-07-27 ガス流処理方法 Active JP5027808B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB0516695.4 2005-08-15
GBGB0516695.4A GB0516695D0 (en) 2005-08-15 2005-08-15 Microwave plasma reactor
GBGB0521961.3A GB0521961D0 (en) 2005-08-15 2005-10-27 Method of treating a gas stream
GB0521961.3 2005-10-27
PCT/GB2006/002795 WO2007020374A1 (fr) 2005-08-15 2006-07-27 Procede de traitement d’un flux gazeux

Publications (2)

Publication Number Publication Date
JP2009504394A JP2009504394A (ja) 2009-02-05
JP5027808B2 true JP5027808B2 (ja) 2012-09-19

Family

ID=35098307

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008526530A Active JP5027808B2 (ja) 2005-08-15 2006-07-27 ガス流処理方法
JP2008526529A Active JP5600394B2 (ja) 2005-08-15 2006-07-27 マイクロ波プラズマ反応装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008526529A Active JP5600394B2 (ja) 2005-08-15 2006-07-27 マイクロ波プラズマ反応装置

Country Status (10)

Country Link
US (2) US8518162B2 (fr)
EP (1) EP1915768B1 (fr)
JP (2) JP5027808B2 (fr)
KR (1) KR101286348B1 (fr)
CN (2) CN101243534B (fr)
AT (1) ATE509365T1 (fr)
GB (2) GB0516695D0 (fr)
SG (1) SG186661A1 (fr)
TW (2) TWI399454B (fr)
WO (1) WO2007020373A1 (fr)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4611409B2 (ja) * 2008-09-03 2011-01-12 晃俊 沖野 プラズマ温度制御装置
KR100965491B1 (ko) * 2009-11-02 2010-06-24 박영배 복합 플라스마 발생장치
EP2526339A4 (fr) 2010-01-21 2015-03-11 Powerdyne Inc Production de vapeur à partir d'une substance carbonée
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US9338871B2 (en) 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8880227B2 (en) * 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
GB2490355B (en) * 2011-04-28 2015-10-14 Gasplas As Method for processing a gas and a device for performing the method
US8653911B2 (en) 2011-07-22 2014-02-18 Triple Cores Korea Atmospheric plasma equipment and waveguide for the same
JP2013026118A (ja) * 2011-07-25 2013-02-04 Triplecores Korea 常圧プラズマ装置及びこのための導波管
CN102905456B (zh) * 2011-07-27 2015-05-20 韩国三重核心株式会社 大气等离子体设备和用于该设备的波导
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
KR101382003B1 (ko) * 2011-11-04 2014-04-21 (주)트리플코어스코리아 플라즈마 반응기 및 이를 이용한 가스스크러버
EP2900353A4 (fr) 2012-09-05 2016-05-18 Powerdyne Inc Procédé de séquestration de particules de métaux lourds à l'aide de h2o, co2, o2, et source de particules
KR20150053781A (ko) 2012-09-05 2015-05-18 파워다인, 인코포레이티드 고전압 전기장 방법을 사용하는 연료 생성
BR112015004824A2 (pt) 2012-09-05 2017-07-04 Powerdyne Inc método para produzir um fluido combustível
KR20150052226A (ko) 2012-09-05 2015-05-13 파워다인, 인코포레이티드 고전압 전기장 방법을 사용하는 연료 생성
EP2892984A4 (fr) 2012-09-05 2016-05-11 Powerdyne Inc Système de production de matières combustibles au moyen de catalyseurs fischer-tropsch et de sources de plasma
KR101581261B1 (ko) 2012-09-05 2015-12-31 파워다인, 인코포레이티드 H2o, co2, o2 및 탄소 공급 원료로부터 전력을 생성하는 방법
US9765270B2 (en) 2012-09-05 2017-09-19 Powerdyne, Inc. Fuel generation using high-voltage electric fields methods
CN102933016A (zh) * 2012-11-28 2013-02-13 吉林大学 车载燃料的等离子体微波功率合成系统
WO2014152908A1 (fr) 2013-03-14 2014-09-25 Mks Instruments, Inc. Appareil et procédé de réduction de plasma toroïdal
KR101427720B1 (ko) 2013-03-27 2014-08-13 (주)트리플코어스코리아 단차부 및 블록부를 이용한 플라즈마 도파관
GB2516267B (en) * 2013-07-17 2016-08-17 Edwards Ltd Head assembly
US9240308B2 (en) * 2014-03-06 2016-01-19 Applied Materials, Inc. Hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system
CN103968882B (zh) * 2014-05-22 2016-05-18 哈尔滨工业大学 微波与弱磁等离子体相互作用的测试装置
KR102235612B1 (ko) 2015-01-29 2021-04-02 삼성전자주식회사 일-함수 금속을 갖는 반도체 소자 및 그 형성 방법
US10153133B2 (en) * 2015-03-23 2018-12-11 Applied Materials, Inc. Plasma reactor having digital control over rotation frequency of a microwave field with direct up-conversion
US10340124B2 (en) 2015-10-29 2019-07-02 Applied Materials, Inc. Generalized cylindrical cavity system for microwave rotation and impedance shifting by irises in a power-supplying waveguide
EP3309815B1 (fr) * 2016-10-12 2019-03-20 Meyer Burger (Germany) AG Dispositif de traitement au plasma comprenant deux sources de plasma excitées par micro-ondes couplées ensemble et procédé de fonctionnement d'un tel dispositif de traitement au plasma
US10712005B2 (en) 2017-07-14 2020-07-14 Goodrich Corporation Ceramic matrix composite manufacturing
US10480065B2 (en) * 2017-09-19 2019-11-19 Goodrich Corporation Gas distribution for chemical vapor deposition/infiltration
US10818479B2 (en) * 2017-11-12 2020-10-27 Taiwan Semiconductor Manufacturing Company, Ltd. Grounding cap module, gas injection device and etching apparatus
US11469077B2 (en) * 2018-04-24 2022-10-11 FD3M, Inc. Microwave plasma chemical vapor deposition device and application thereof
JP2022508353A (ja) 2018-08-23 2022-01-19 トランスフォーム マテリアルズ エルエルシー 気体を処理するための系および方法
US11633710B2 (en) 2018-08-23 2023-04-25 Transform Materials Llc Systems and methods for processing gases
CN114560443B (zh) * 2022-03-02 2023-07-07 瓮福（集团）有限责任公司 一种同时制备氟化氢及晶体硅产品的微波等离子体装置
CN115665914B (zh) * 2022-12-22 2023-03-10 河北科技大学 多源微波加热装置
CN117373964B (zh) * 2023-12-05 2024-03-12 天津吉兆源科技有限公司 一种用于微波远程等离子体源自动点火装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2002002A (en) * 1931-11-20 1935-05-21 Deere & Co Tractor
JPS59103340A (ja) 1983-09-21 1984-06-14 Hitachi Ltd プラズマ処理装置
JPS62155934A (ja) * 1985-12-28 1987-07-10 Canon Inc 気相励起装置
US4866346A (en) * 1987-06-22 1989-09-12 Applied Science & Technology, Inc. Microwave plasma generator
US4970435A (en) 1987-12-09 1990-11-13 Tel Sagami Limited Plasma processing apparatus
US4893584A (en) * 1988-03-29 1990-01-16 Energy Conversion Devices, Inc. Large area microwave plasma apparatus
JPH03193880A (ja) * 1989-08-03 1991-08-23 Mikakutou Seimitsu Kogaku Kenkyusho:Kk 高圧力下でのマイクロ波プラズマｃｖｄによる高速成膜方法及びその装置
US5144199A (en) 1990-01-11 1992-09-01 Mitsubishi Denki Kabushiki Kaisha Microwave discharge light source device
DE4132558C1 (fr) * 1991-09-30 1992-12-03 Secon Halbleiterproduktionsgeraete Ges.M.B.H., Wien, At
US5349154A (en) * 1991-10-16 1994-09-20 Rockwell International Corporation Diamond growth by microwave generated plasma flame
JPH0653170A (ja) 1992-03-18 1994-02-25 Nec Corp Ｅｃｒプラズマエッチング装置
JPH0673567A (ja) 1992-08-28 1994-03-15 Hitachi Ltd マイクロ波プラズマ処理装置
FR2695944B1 (fr) * 1992-09-24 1994-11-18 Onera (Off Nat Aerospatiale) Appareil de dépôt chimique en phase vapeur activé par un plasma micro-ondes.
JP3328844B2 (ja) 1992-09-24 2002-09-30 株式会社日立製作所 プラズマプロセス装置
DE4235914A1 (de) 1992-10-23 1994-04-28 Juergen Prof Dr Engemann Vorrichtung zur Erzeugung von Mikrowellenplasmen
GB9224745D0 (en) 1992-11-26 1993-01-13 Atomic Energy Authority Uk Microwave plasma generator
JP3337266B2 (ja) 1993-04-15 2002-10-21 三菱重工業株式会社 電子サイクロトロン共鳴プラズマの科学蒸着装置
US5453125A (en) 1994-02-17 1995-09-26 Krogh; Ole D. ECR plasma source for gas abatement
GB9414561D0 (en) * 1994-07-19 1994-09-07 Ea Tech Ltd Method of and apparatus for microwave-plasma production
US5793013A (en) * 1995-06-07 1998-08-11 Physical Sciences, Inc. Microwave-driven plasma spraying apparatus and method for spraying
US6045618A (en) * 1995-09-25 2000-04-04 Applied Materials, Inc. Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment
US5825485A (en) * 1995-11-03 1998-10-20 Cohn; Daniel R. Compact trace element sensor which utilizes microwave generated plasma and which is portable by an individual
US5902404A (en) * 1997-03-04 1999-05-11 Applied Materials, Inc. Resonant chamber applicator for remote plasma source
TW376547B (en) * 1997-03-27 1999-12-11 Matsushita Electric Ind Co Ltd Method and apparatus for plasma processing
FR2766321B1 (fr) 1997-07-16 1999-09-03 Air Liquide Dispositif d'excitation d'un gaz par plasma d'onde de surface
US6390019B1 (en) * 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
JP2000133494A (ja) * 1998-10-23 2000-05-12 Mitsubishi Heavy Ind Ltd マイクロ波プラズマ発生装置及び方法
US6263830B1 (en) * 1999-04-12 2001-07-24 Matrix Integrated Systems, Inc. Microwave choke for remote plasma generator
JP2000296326A (ja) * 1999-04-12 2000-10-24 Mitsubishi Heavy Ind Ltd 有機ハロゲン化合物分解装置の運転制御方法
US20020007912A1 (en) * 1999-04-12 2002-01-24 Mohammad Kamarehi Coolant for plasma generator
US6614000B1 (en) * 1999-04-12 2003-09-02 Mitsubishi Heavy Industries, Ltd. Organic halogen compound decomposing device and operation control method therefor, and organic halogen compound decomposing method
WO2000061286A1 (fr) 1999-04-12 2000-10-19 Mitsubishi Heavy Industries, Ltd. Procede de traitement par decomposition d'un compose halogene organique et dispositif de decomposition
DE19943953A1 (de) * 1999-09-14 2001-04-12 Bosch Gmbh Robert Vorrichtung und Verfahren zur Erzeugung eines lokalen Plasmas durch Mikrostrukturelektrodenentladungen mit Mikrowellen
KR100767762B1 (ko) 2000-01-18 2007-10-17 에이에스엠 저펜 가부시기가이샤 자가 세정을 위한 원격 플라즈마 소스를 구비한 cvd 반도체 공정장치
JP4252702B2 (ja) 2000-02-14 2009-04-08 株式会社荏原製作所 反応副生成物の配管内付着防止装置及び付着防止方法
JP4377510B2 (ja) 2000-03-02 2009-12-02 東京エレクトロン株式会社 プラズマ処理装置
US6673323B1 (en) * 2000-03-24 2004-01-06 Applied Materials, Inc. Treatment of hazardous gases in effluent
WO2001093315A2 (fr) * 2000-05-25 2001-12-06 Jewett Russell F Procedes et appareillages de traitement par plasma
US7378062B2 (en) 2000-05-29 2008-05-27 Three Tec Co., Ltd. Object processing apparatus and plasma facility comprising the same
CN1754409B (zh) * 2002-08-30 2010-07-28 积水化学工业株式会社 等离子处理装置
JP2004216231A (ja) 2003-01-10 2004-08-05 Toshiba Corp 高周波プラズマによる化合物分解方法および化合物分解装置
US6872909B2 (en) * 2003-04-16 2005-03-29 Applied Science And Technology, Inc. Toroidal low-field reactive gas and plasma source having a dielectric vacuum vessel
GB0309932D0 (en) 2003-04-30 2003-06-04 Boc Group Plc Apparatus and method for forming a plasma

Also Published As

Publication number Publication date
CN101243534A (zh) 2008-08-13
SG186661A1 (en) 2013-01-30
ATE509365T1 (de) 2011-05-15
TW200727325A (en) 2007-07-16
GB0516695D0 (en) 2005-09-21
EP1915768A1 (fr) 2008-04-30
EP1915768B1 (fr) 2014-09-10
KR101286348B1 (ko) 2013-07-23
TWI399454B (zh) 2013-06-21
CN101248506B (zh) 2011-09-07
JP5600394B2 (ja) 2014-10-01
US8776719B2 (en) 2014-07-15
JP2009504394A (ja) 2009-02-05
KR20080033408A (ko) 2008-04-16
US20100006227A1 (en) 2010-01-14
US8518162B2 (en) 2013-08-27
TW200712249A (en) 2007-04-01
CN101248506A (zh) 2008-08-20
GB0521961D0 (en) 2005-12-07
TWI405239B (zh) 2013-08-11
JP2009504393A (ja) 2009-02-05
CN101243534B (zh) 2010-05-26
US20110197759A1 (en) 2011-08-18
WO2007020373A1 (fr) 2007-02-22

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