JP5023781B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5023781B2
JP5023781B2 JP2007106386A JP2007106386A JP5023781B2 JP 5023781 B2 JP5023781 B2 JP 5023781B2 JP 2007106386 A JP2007106386 A JP 2007106386A JP 2007106386 A JP2007106386 A JP 2007106386A JP 5023781 B2 JP5023781 B2 JP 5023781B2
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JP
Japan
Prior art keywords
light emitting
metal member
emitting device
wire
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007106386A
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English (en)
Japanese (ja)
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JP2008147611A5 (https=
JP2008147611A (ja
Inventor
宏明 宇川
義尚 板東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2007106386A priority Critical patent/JP5023781B2/ja
Publication of JP2008147611A publication Critical patent/JP2008147611A/ja
Publication of JP2008147611A5 publication Critical patent/JP2008147611A5/ja
Application granted granted Critical
Publication of JP5023781B2 publication Critical patent/JP5023781B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2007106386A 2006-11-13 2007-04-13 発光装置 Active JP5023781B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007106386A JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006306996 2006-11-13
JP2006306996 2006-11-13
JP2007106386A JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Publications (3)

Publication Number Publication Date
JP2008147611A JP2008147611A (ja) 2008-06-26
JP2008147611A5 JP2008147611A5 (https=) 2010-05-20
JP5023781B2 true JP5023781B2 (ja) 2012-09-12

Family

ID=39607406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007106386A Active JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Country Status (1)

Country Link
JP (1) JP5023781B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240379926A1 (en) * 2021-09-24 2024-11-14 Stanley Electric Co., Ltd. Light-emitting device, and method for producing light-emitting device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
US7923739B2 (en) * 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
JP5691681B2 (ja) * 2010-03-15 2015-04-01 日亜化学工業株式会社 発光装置
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
JP5941249B2 (ja) 2011-02-02 2016-06-29 日亜化学工業株式会社 発光装置
JP2013004905A (ja) * 2011-06-21 2013-01-07 Mitsubishi Chemicals Corp 半導体発光装置用パッケージ及び半導体発光装置
KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
JP5732619B2 (ja) * 2012-06-27 2015-06-10 パナソニックＩｐマネジメント株式会社 発光装置及びそれを用いた照明装置
CN103904207A (zh) * 2014-04-04 2014-07-02 利亚德光电股份有限公司 晶片电路
DE102017100165A1 (de) 2017-01-05 2018-07-05 Jabil Optics Germany GmbH Lichtemittierende Anordnung und lichtemittierendes System
KR102261288B1 (ko) * 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
JP6669217B2 (ja) * 2018-08-30 2020-03-18 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP7054008B2 (ja) * 2019-08-27 2022-04-13 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332809B2 (ja) * 1997-07-10 2002-10-07 三洋電機株式会社 光素子
JP3472450B2 (ja) * 1997-09-04 2003-12-02 シャープ株式会社 発光装置
JP3908383B2 (ja) * 1998-05-29 2007-04-25 ローム株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240379926A1 (en) * 2021-09-24 2024-11-14 Stanley Electric Co., Ltd. Light-emitting device, and method for producing light-emitting device

Also Published As

Publication number Publication date
JP2008147611A (ja) 2008-06-26

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