JP5021919B2 - 半導体用熱交換器 - Google Patents

半導体用熱交換器 Download PDF

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Publication number
JP5021919B2
JP5021919B2 JP2005263863A JP2005263863A JP5021919B2 JP 5021919 B2 JP5021919 B2 JP 5021919B2 JP 2005263863 A JP2005263863 A JP 2005263863A JP 2005263863 A JP2005263863 A JP 2005263863A JP 5021919 B2 JP5021919 B2 JP 5021919B2
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Japan
Prior art keywords
heat exchanger
mesh plug
coolant
passage
coating
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Japanese (ja)
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JP2006203159A (ja
JP2006203159A5 (https=
Inventor
イヴ・マーティン
セオドア・ジー・ファン・ケッセル
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International Business Machines Corp
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International Business Machines Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2005263863A 2005-01-18 2005-09-12 半導体用熱交換器 Expired - Fee Related JP5021919B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/037,918 US20060157225A1 (en) 2005-01-18 2005-01-18 High turbulence heat exchanger
US11/037,918 2005-01-18

Publications (3)

Publication Number Publication Date
JP2006203159A JP2006203159A (ja) 2006-08-03
JP2006203159A5 JP2006203159A5 (https=) 2008-10-16
JP5021919B2 true JP5021919B2 (ja) 2012-09-12

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ID=36682681

Family Applications (1)

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JP2005263863A Expired - Fee Related JP5021919B2 (ja) 2005-01-18 2005-09-12 半導体用熱交換器

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US (2) US20060157225A1 (https=)
JP (1) JP5021919B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12394690B2 (en) 2022-01-04 2025-08-19 Corning Research & Development Corporation Systems and methods of nano-particle bonding for electronics cooling

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US10775054B2 (en) 2009-03-13 2020-09-15 Treau, Inc. Modular air conditioning system
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
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US10988375B1 (en) * 2018-10-04 2021-04-27 EngeniusMicro, LLC Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors
US11253958B2 (en) 2019-01-29 2022-02-22 Treau, Inc. Polymer film heat exchanger sealing system and method
KR102202443B1 (ko) * 2019-03-08 2021-01-13 엘지전자 주식회사 방열판 모듈
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CN114746701A (zh) 2019-09-13 2022-07-12 特劳公司 分体式架构空调单元的窗户安装系统和方法
EP3792967A1 (en) * 2019-09-16 2021-03-17 Nokia Technologies Oy Heat sink
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
US12356585B2 (en) * 2020-12-23 2025-07-08 Abaco Systems, Inc. Cooling module for providing enhanced localized cooling of a heatsink
FR3122547A1 (fr) * 2021-04-29 2022-11-04 Valeo Siemens Eautomotive France Sas Module de refroidissement comprenant une structure de refroidissement pour la dissipation thermique
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CN119790720A (zh) 2022-08-29 2025-04-08 三星电子株式会社 包括包围多个集成电路的热管的电子装置
US20230025921A1 (en) * 2022-09-30 2023-01-26 Intel Corporation Cold plates and liquid cooling systems for electronic devices
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12394690B2 (en) 2022-01-04 2025-08-19 Corning Research & Development Corporation Systems and methods of nano-particle bonding for electronics cooling

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Publication number Publication date
JP2006203159A (ja) 2006-08-03
US20060157225A1 (en) 2006-07-20
US20070295014A1 (en) 2007-12-27

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