JP2006203159A5 - - Google Patents
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- Publication number
- JP2006203159A5 JP2006203159A5 JP2005263863A JP2005263863A JP2006203159A5 JP 2006203159 A5 JP2006203159 A5 JP 2006203159A5 JP 2005263863 A JP2005263863 A JP 2005263863A JP 2005263863 A JP2005263863 A JP 2005263863A JP 2006203159 A5 JP2006203159 A5 JP 2006203159A5
- Authority
- JP
- Japan
- Prior art keywords
- heat exchanger
- coolant
- mesh plug
- thermal interface
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 10
- 239000002826 coolant Substances 0.000 claims 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 5
- 238000000576 coating method Methods 0.000 claims 5
- 229910052759 nickel Inorganic materials 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 3
- 229910052804 chromium Inorganic materials 0.000 claims 3
- 239000011651 chromium Substances 0.000 claims 3
- 239000004033 plastic Substances 0.000 claims 3
- 229920003023 plastic Polymers 0.000 claims 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910002804 graphite Inorganic materials 0.000 claims 2
- 239000010439 graphite Substances 0.000 claims 2
- 229930195733 hydrocarbon Natural products 0.000 claims 2
- 150000002430 hydrocarbons Chemical class 0.000 claims 2
- 229910001338 liquidmetal Inorganic materials 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- -1 polyethylene Polymers 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- PKQYSCBUFZOAPE-UHFFFAOYSA-N 1,2-dibenzyl-3-methylbenzene Chemical compound C=1C=CC=CC=1CC=1C(C)=CC=CC=1CC1=CC=CC=C1 PKQYSCBUFZOAPE-UHFFFAOYSA-N 0.000 claims 1
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- 229920000742 Cotton Polymers 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 239000004677 Nylon Substances 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 229920001973 fluoroelastomer Polymers 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229920001778 nylon Polymers 0.000 claims 1
- 239000003921 oil Substances 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- WTKKCYNZRWIVKL-UHFFFAOYSA-N tantalum Chemical compound [Ta+5] WTKKCYNZRWIVKL-UHFFFAOYSA-N 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- HHIQWSQEUZDONT-UHFFFAOYSA-N tungsten Chemical compound [W].[W].[W] HHIQWSQEUZDONT-UHFFFAOYSA-N 0.000 claims 1
- 210000002268 wool Anatomy 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/037,918 US20060157225A1 (en) | 2005-01-18 | 2005-01-18 | High turbulence heat exchanger |
| US11/037,918 | 2005-01-18 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006203159A JP2006203159A (ja) | 2006-08-03 |
| JP2006203159A5 true JP2006203159A5 (https=) | 2008-10-16 |
| JP5021919B2 JP5021919B2 (ja) | 2012-09-12 |
Family
ID=36682681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005263863A Expired - Fee Related JP5021919B2 (ja) | 2005-01-18 | 2005-09-12 | 半導体用熱交換器 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US20060157225A1 (https=) |
| JP (1) | JP5021919B2 (https=) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265977B2 (en) * | 2005-01-18 | 2007-09-04 | International Business Machines Corporation | Active liquid metal thermal spreader |
| US9412926B2 (en) * | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
| US7365981B2 (en) * | 2005-06-28 | 2008-04-29 | Delphi Technologies, Inc. | Fluid-cooled electronic system |
| US7905275B2 (en) * | 2006-04-20 | 2011-03-15 | The Boeing Company | Ceramic foam cold plate |
| US8505616B2 (en) * | 2006-04-20 | 2013-08-13 | The Boeing Company | Hybrid ceramic core cold plate |
| JP4231081B2 (ja) * | 2007-01-31 | 2009-02-25 | 株式会社東芝 | 冷却装置 |
| US7942000B2 (en) * | 2007-09-25 | 2011-05-17 | Engine-Uity Limited | Rotary vane engine system |
| US8171986B2 (en) * | 2008-04-02 | 2012-05-08 | Northrop Grumman Systems Corporation | Foam metal heat exchanger system |
| CN101610664B (zh) * | 2008-06-20 | 2014-05-14 | 萨帕铝型材（上海）有限公司 | 液体冷却器及其制造方法 |
| US10775054B2 (en) | 2009-03-13 | 2020-09-15 | Treau, Inc. | Modular air conditioning system |
| US20100296249A1 (en) * | 2009-05-19 | 2010-11-25 | Beijing AVC Technology Research Center Co., Ltd. | Micro passage cold plate device for a liquid cooling radiator |
| US8081461B2 (en) * | 2009-06-25 | 2011-12-20 | International Business Machines Corporation | Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein |
| US8720828B2 (en) * | 2009-12-03 | 2014-05-13 | The Boeing Company | Extended plug cold plate |
| DE102009058673A1 (de) * | 2009-12-16 | 2011-06-22 | Behr GmbH & Co. KG, 70469 | Thermoelektrischer Wärmetauscher |
| CN102655129B (zh) * | 2012-02-07 | 2014-07-16 | 山东大学 | 具有莫尔条纹效应的电力电子集成模块微小通道液冷基板 |
| RU2640574C2 (ru) * | 2012-04-23 | 2018-01-10 | Конинклейке Филипс Н.В. | Интегральный электронный модуль с охлаждающей структурой |
| US9803938B2 (en) * | 2013-07-05 | 2017-10-31 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies having porous three dimensional surfaces |
| WO2016187598A1 (en) | 2015-05-20 | 2016-11-24 | Other Lab, Llc | Membrane heat exchanger system and method |
| WO2019075121A1 (en) | 2017-10-10 | 2019-04-18 | Other Lab, Llc | METHOD AND SYSTEM FOR CONFORMABLE HEAT EXCHANGER |
| KR102146491B1 (ko) * | 2018-08-27 | 2020-08-21 | 엘지전자 주식회사 | 방열판 모듈 |
| US10988375B1 (en) * | 2018-10-04 | 2021-04-27 | EngeniusMicro, LLC | Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors |
| US11253958B2 (en) | 2019-01-29 | 2022-02-22 | Treau, Inc. | Polymer film heat exchanger sealing system and method |
| KR102202443B1 (ko) * | 2019-03-08 | 2021-01-13 | 엘지전자 주식회사 | 방열판 모듈 |
| KR102202435B1 (ko) * | 2019-03-08 | 2021-01-13 | 엘지전자 주식회사 | 방열판 모듈 |
| DE102019204847A1 (de) * | 2019-04-04 | 2020-10-08 | Siemens Aktiengesellschaft | Vorrichtung zum Entwärmen elektrischer und/oder elektronischer Bauteile |
| SG10201904782SA (en) | 2019-05-27 | 2020-12-30 | Aem Singapore Pte Ltd | Cold plate and a method of manufacture thereof |
| CN114746701A (zh) | 2019-09-13 | 2022-07-12 | 特劳公司 | 分体式架构空调单元的窗户安装系统和方法 |
| EP3792967A1 (en) * | 2019-09-16 | 2021-03-17 | Nokia Technologies Oy | Heat sink |
| KR102604789B1 (ko) * | 2020-11-30 | 2023-11-21 | 세메스 주식회사 | 히터 조립체 및 이를 포함하는 본딩 헤드 |
| US12356585B2 (en) * | 2020-12-23 | 2025-07-08 | Abaco Systems, Inc. | Cooling module for providing enhanced localized cooling of a heatsink |
| FR3122547A1 (fr) * | 2021-04-29 | 2022-11-04 | Valeo Siemens Eautomotive France Sas | Module de refroidissement comprenant une structure de refroidissement pour la dissipation thermique |
| US12394690B2 (en) | 2022-01-04 | 2025-08-19 | Corning Research & Development Corporation | Systems and methods of nano-particle bonding for electronics cooling |
| EP4550409A4 (en) * | 2022-06-28 | 2025-10-29 | Jatco Ltd | UNIT |
| CN119487631A (zh) * | 2022-06-28 | 2025-02-18 | 加特可株式会社 | 组件 |
| JPWO2024004459A1 (https=) * | 2022-07-01 | 2024-01-04 | ||
| CN119790720A (zh) | 2022-08-29 | 2025-04-08 | 三星电子株式会社 | 包括包围多个集成电路的热管的电子装置 |
| US20230025921A1 (en) * | 2022-09-30 | 2023-01-26 | Intel Corporation | Cold plates and liquid cooling systems for electronic devices |
| DE102024205695A1 (de) * | 2024-06-20 | 2025-11-20 | Zf Friedrichshafen Ag | Kühlelement, Herstellungsverfahren für ein Kühlelement, Halbleitervorrichtung und Verfahren zum Betreiben einer Halbleitervorrichtung |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4222434A (en) * | 1978-04-27 | 1980-09-16 | Clyde Robert A | Ceramic sponge heat-exchanger member |
| JPS5936827B2 (ja) * | 1979-01-12 | 1984-09-06 | 日本電信電話株式会社 | 集積回路素子の冷却装置 |
| JPS60160149A (ja) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | 集積回路装置の冷却方式 |
| JPH06101523B2 (ja) * | 1985-03-04 | 1994-12-12 | 株式会社日立製作所 | 集積回路チツプ冷却装置 |
| US4689104A (en) * | 1985-06-24 | 1987-08-25 | Lockheed Missiles & Space Company, Inc. | Method of bonding two substrate faces utilizing boron-silicon-hydrogen alloy films |
| JPH02162795A (ja) * | 1988-12-16 | 1990-06-22 | Mitsubishi Electric Corp | 電子部品冷却装置 |
| JP2724033B2 (ja) * | 1990-07-11 | 1998-03-09 | 株式会社日立製作所 | 半導体モジユール |
| EP0471552B1 (en) * | 1990-08-14 | 1997-07-02 | Texas Instruments Incorporated | Heat transfer module for ultra high density and silicon on silicon packaging applications |
| US5381944A (en) * | 1993-11-04 | 1995-01-17 | The Regents Of The University Of California | Low temperature reactive bonding |
| US5761037A (en) * | 1996-02-12 | 1998-06-02 | International Business Machines Corporation | Orientation independent evaporator |
| US6301100B1 (en) * | 1998-06-23 | 2001-10-09 | Citizen Watch Co., Ltd. | Portable electronic device having a connector and a cable for connecting with an external device |
| FR2805036B1 (fr) * | 2000-02-10 | 2002-06-14 | Valeo Thermique Moteur Sa | Echangeur de chaleur avec joint d'etancheite ameliore, en particulier pour vehicule automobile |
| DE10253625A1 (de) * | 2002-11-15 | 2004-05-27 | Nordson Corp., Westlake | Verfahren und Vorrichtung zum Abgeben von Fluid sowie Patrone |
| US20050083655A1 (en) * | 2003-10-15 | 2005-04-21 | Visteon Global Technologies, Inc. | Dielectric thermal stack for the cooling of high power electronics |
| US7044199B2 (en) * | 2003-10-20 | 2006-05-16 | Thermal Corp. | Porous media cold plate |
| US20050111188A1 (en) * | 2003-11-26 | 2005-05-26 | Anandaroop Bhattacharya | Thermal management device for an integrated circuit |
| US20050224212A1 (en) * | 2004-04-02 | 2005-10-13 | Par Technologies, Llc | Diffusion bonded wire mesh heat sink |
| US20060096738A1 (en) * | 2004-11-05 | 2006-05-11 | Aavid Thermalloy, Llc | Liquid cold plate heat exchanger |
-
2005
- 2005-01-18 US US11/037,918 patent/US20060157225A1/en not_active Abandoned
- 2005-09-12 JP JP2005263863A patent/JP5021919B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-04 US US11/849,725 patent/US20070295014A1/en not_active Abandoned
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