SG10201904782SA - Cold plate and a method of manufacture thereof - Google Patents

Cold plate and a method of manufacture thereof

Info

Publication number
SG10201904782SA
SG10201904782SA SG10201904782SA SG10201904782SA SG10201904782SA SG 10201904782S A SG10201904782S A SG 10201904782SA SG 10201904782S A SG10201904782S A SG 10201904782SA SG 10201904782S A SG10201904782S A SG 10201904782SA SG 10201904782S A SG10201904782S A SG 10201904782SA
Authority
SG
Singapore
Prior art keywords
manufacture
cold plate
cold
plate
Prior art date
Application number
SG10201904782SA
Inventor
See Jean Chan
zhao meng Wang
Original Assignee
Aem Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aem Singapore Pte Ltd filed Critical Aem Singapore Pte Ltd
Priority to SG10201904782SA priority Critical patent/SG10201904782SA/en
Priority to EP20150686.2A priority patent/EP3745068B1/en
Priority to EP22210500.9A priority patent/EP4163578A1/en
Priority to US16/774,274 priority patent/US11129297B2/en
Publication of SG10201904782SA publication Critical patent/SG10201904782SA/en
Priority to US17/406,277 priority patent/US11706902B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG10201904782SA 2019-05-27 2019-05-27 Cold plate and a method of manufacture thereof SG10201904782SA (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG10201904782SA SG10201904782SA (en) 2019-05-27 2019-05-27 Cold plate and a method of manufacture thereof
EP20150686.2A EP3745068B1 (en) 2019-05-27 2020-01-08 Cold plate and a method of manufacture thereof
EP22210500.9A EP4163578A1 (en) 2019-05-27 2020-01-08 Cold plate and a method of manufacture thereof
US16/774,274 US11129297B2 (en) 2019-05-27 2020-01-28 Cold plate with porus thermal conductive structure
US17/406,277 US11706902B2 (en) 2019-05-27 2021-08-19 Cold plate with porous thermal conductive structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201904782SA SG10201904782SA (en) 2019-05-27 2019-05-27 Cold plate and a method of manufacture thereof

Publications (1)

Publication Number Publication Date
SG10201904782SA true SG10201904782SA (en) 2020-12-30

Family

ID=69147530

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201904782SA SG10201904782SA (en) 2019-05-27 2019-05-27 Cold plate and a method of manufacture thereof

Country Status (3)

Country Link
US (2) US11129297B2 (en)
EP (2) EP4163578A1 (en)
SG (1) SG10201904782SA (en)

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JP6901722B2 (en) * 2017-03-30 2021-07-14 東京エレクトロン株式会社 How to manufacture fluid heaters, fluid controllers, and fluid heaters
TWI810461B (en) * 2019-06-12 2023-08-01 雙鴻科技股份有限公司 Cold plate
US11439039B2 (en) * 2020-12-07 2022-09-06 Hamilton Sundstrand Corporation Thermal management of electronic devices on a cold plate
US11946702B2 (en) * 2021-03-23 2024-04-02 Terrapower, Llc Heat exchanger configuration with porous layer
FR3122547A1 (en) * 2021-04-29 2022-11-04 Valeo Siemens Eautomotive France Sas Cooling module including a cooling structure for heat dissipation
US11877422B2 (en) 2021-08-11 2024-01-16 Hewlett Packard Enterprise Development Lp Memory cooler
US11920877B2 (en) * 2021-11-18 2024-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. 3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards
CN116653076A (en) * 2023-05-29 2023-08-29 深圳大学 Manufacturing method of ceramic vapor chamber based on 3D printing technology

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US3613778A (en) 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3755543A (en) 1971-08-16 1973-08-28 Continental Carbon Co Air cooled porous metal pipe for use in feedstock injection assembly
US4359086A (en) 1981-05-18 1982-11-16 The Trane Company Heat exchange surface with porous coating and subsurface cavities
US5125451A (en) * 1991-04-02 1992-06-30 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5267611A (en) 1993-01-08 1993-12-07 Thermacore, Inc. Single phase porous layer heat exchanger
US6018459A (en) 1997-11-17 2000-01-25 Cray Research, Inc. Porous metal heat sink
US6216343B1 (en) 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
KR20010076991A (en) 2000-01-29 2001-08-17 박호군 Foam metal heat sink
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
US6438964B1 (en) 2001-09-10 2002-08-27 Percy Giblin Thermoelectric heat pump appliance with carbon foam heat sink
US6888720B2 (en) 2002-06-18 2005-05-03 Sun Microsystems, Inc. Distributed graphitic foam heat exchanger system
US6735083B2 (en) 2002-08-07 2004-05-11 Inventec Corporation Porous CPU cooler
US8464781B2 (en) * 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
TWI300466B (en) * 2002-11-01 2008-09-01 Cooligy Inc Channeled flat plate fin heat exchange system, device and method
US6994152B2 (en) 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
US7013956B2 (en) * 2003-09-02 2006-03-21 Thermal Corp. Heat pipe evaporator with porous valve
US7044199B2 (en) 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US7032652B2 (en) * 2004-07-06 2006-04-25 Augux Co., Ltd. Structure of heat conductive plate
US20060096738A1 (en) * 2004-11-05 2006-05-11 Aavid Thermalloy, Llc Liquid cold plate heat exchanger
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US7905275B2 (en) * 2006-04-20 2011-03-15 The Boeing Company Ceramic foam cold plate
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Also Published As

Publication number Publication date
US11129297B2 (en) 2021-09-21
EP4163578A1 (en) 2023-04-12
EP3745068B1 (en) 2023-05-10
EP3745068A1 (en) 2020-12-02
US20210385968A1 (en) 2021-12-09
US20200383238A1 (en) 2020-12-03
US11706902B2 (en) 2023-07-18

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