JP5017913B2 - 熱処理装置及び熱処理方法 - Google Patents

熱処理装置及び熱処理方法 Download PDF

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JP5017913B2
JP5017913B2 JP2006114979A JP2006114979A JP5017913B2 JP 5017913 B2 JP5017913 B2 JP 5017913B2 JP 2006114979 A JP2006114979 A JP 2006114979A JP 2006114979 A JP2006114979 A JP 2006114979A JP 5017913 B2 JP5017913 B2 JP 5017913B2
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reaction vessel
gas supply
gas
heat treatment
supply nozzle
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JP2007081365A5 (enExample
JP2007081365A (ja
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寿 加藤
繁博 牛窪
勝利 石井
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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JP2006114979A 2005-08-17 2006-04-18 熱処理装置及び熱処理方法 Active JP5017913B2 (ja)

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JP2006114979A JP5017913B2 (ja) 2005-08-17 2006-04-18 熱処理装置及び熱処理方法

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JP2005236928 2005-08-17
JP2005236928 2005-08-17
JP2006114979A JP5017913B2 (ja) 2005-08-17 2006-04-18 熱処理装置及び熱処理方法

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JP2007081365A JP2007081365A (ja) 2007-03-29
JP2007081365A5 JP2007081365A5 (enExample) 2010-08-12
JP5017913B2 true JP5017913B2 (ja) 2012-09-05

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4465398B2 (ja) * 2007-07-20 2010-05-19 株式会社日立国際電気 基板処理装置
US8354135B2 (en) 2008-03-17 2013-01-15 Tokyo Electron Limited Thermal processing apparatus, method for regulating temperature of thermal processing apparatus, and program
JP5049303B2 (ja) * 2008-03-17 2012-10-17 東京エレクトロン株式会社 熱処理装置、熱処理装置の温度調整方法、及び、プログラム
JP5049302B2 (ja) * 2008-03-17 2012-10-17 東京エレクトロン株式会社 熱処理装置、熱処理装置の温度調整方法、及び、プログラム
JP4895228B2 (ja) * 2008-07-31 2012-03-14 株式会社エピクエスト 局所加圧分子線エピタキシー装置と分子線エピタキシー装置の運転方法
JP5403984B2 (ja) * 2008-10-08 2014-01-29 光洋サーモシステム株式会社 基板の熱処理装置
JP4954176B2 (ja) * 2008-10-08 2012-06-13 光洋サーモシステム株式会社 基板の熱処理装置
JP2011195863A (ja) * 2010-03-18 2011-10-06 Mitsui Eng & Shipbuild Co Ltd 原子層堆積装置及び原子層堆積方法
JP6706901B2 (ja) * 2015-11-13 2020-06-10 東京エレクトロン株式会社 処理装置
JP2018125466A (ja) 2017-02-02 2018-08-09 東京エレクトロン株式会社 オゾンガス加温機構、基板処理装置及び基板処理方法
JP7340170B2 (ja) * 2019-06-25 2023-09-07 東京エレクトロン株式会社 ガス導入構造、熱処理装置及びガス供給方法
WO2021033461A1 (ja) * 2019-08-20 2021-02-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
JP7000393B2 (ja) * 2019-09-25 2022-01-19 株式会社Kokusai Electric 基板処理装置、ガスボックス及び半導体装置の製造方法
JP2024126238A (ja) 2023-03-07 2024-09-20 東京エレクトロン株式会社 基板処理装置、および基板処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3129777B2 (ja) * 1990-11-16 2001-01-31 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JPH0585890A (ja) * 1991-09-25 1993-04-06 Matsushita Electric Ind Co Ltd 薄膜形成装置
JPH0593274A (ja) * 1991-09-30 1993-04-16 Kokusai Electric Co Ltd 縦型ｃｖｄ膜生成方法及び装置
JP3423131B2 (ja) * 1995-11-20 2003-07-07 東京エレクトロン株式会社 熱処理装置及び処理装置
JPH1187327A (ja) * 1997-06-25 1999-03-30 Ebara Corp 液体原料気化装置
JP3626421B2 (ja) * 2001-04-05 2005-03-09 株式会社東芝 金属酸化物薄膜の成膜方法、及び成膜装置

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