JP5016182B2 - ジェットポンプ立上り管のクランプ装置 - Google Patents

ジェットポンプ立上り管のクランプ装置 Download PDF

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Publication number
JP5016182B2
JP5016182B2 JP2004027895A JP2004027895A JP5016182B2 JP 5016182 B2 JP5016182 B2 JP 5016182B2 JP 2004027895 A JP2004027895 A JP 2004027895A JP 2004027895 A JP2004027895 A JP 2004027895A JP 5016182 B2 JP5016182 B2 JP 5016182B2
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JP
Japan
Prior art keywords
temperature region
sensor element
support surface
high temperature
low temperature
Prior art date
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Expired - Fee Related
Application number
JP2004027895A
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English (en)
Japanese (ja)
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JP2004361386A (ja
JP2004361386A5 (enExample
Inventor
セオドア・ジェイ・クレルナー
インシク・キム
ホンナム・リム
ギュルル・チャン
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General Electric Co
Original Assignee
General Electric Co
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Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2004361386A publication Critical patent/JP2004361386A/ja
Publication of JP2004361386A5 publication Critical patent/JP2004361386A5/ja
Application granted granted Critical
Publication of JP5016182B2 publication Critical patent/JP5016182B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Geophysics And Detection Of Objects (AREA)
JP2004027895A 2003-02-05 2004-02-04 ジェットポンプ立上り管のクランプ装置 Expired - Fee Related JP5016182B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44516903P 2003-02-05 2003-02-05
US60/445,169 2003-02-05
US10/707,981 US20040187904A1 (en) 2003-02-05 2004-01-29 Apparatus for infrared radiation detection
US10/707,981 2004-01-29

Publications (3)

Publication Number Publication Date
JP2004361386A JP2004361386A (ja) 2004-12-24
JP2004361386A5 JP2004361386A5 (enExample) 2009-04-23
JP5016182B2 true JP5016182B2 (ja) 2012-09-05

Family

ID=32850973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004027895A Expired - Fee Related JP5016182B2 (ja) 2003-02-05 2004-02-04 ジェットポンプ立上り管のクランプ装置

Country Status (6)

Country Link
US (1) US20040187904A1 (enExample)
EP (1) EP1464933B1 (enExample)
JP (1) JP5016182B2 (enExample)
AT (1) ATE378578T1 (enExample)
DE (1) DE602004009980T2 (enExample)
ES (1) ES2295779T3 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107224274A (zh) * 2016-03-23 2017-10-03 原相科技股份有限公司 穿戴式装置
US10670465B2 (en) 2015-03-20 2020-06-02 Pixart Imaging Inc. Wearable infrared temperature sensing device
US10732049B2 (en) 2015-03-20 2020-08-04 Pixart Imaging Inc. Thermopile module

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DE102004002164A1 (de) * 2004-01-15 2005-08-04 Robert Bosch Gmbh Strahlungsdetektor, Sensormodul mit einem Strahlungsdetektor und Verfahren zum Herstellen eines Strahlungsdetektors
US20070095380A1 (en) * 2005-10-31 2007-05-03 Dewes Brian E Infrared detecting device with a circular membrane
US7785002B2 (en) * 2006-12-05 2010-08-31 Delphi Technologies, Inc. P-N junction based thermal detector
USD597863S1 (en) * 2007-07-09 2009-08-11 Omron Corporation Infrared radiation sensor
GB2466288B (en) * 2008-12-19 2013-01-09 Qhi Group Ltd Temperature sensor
EP2447705A1 (en) * 2009-06-25 2012-05-02 Panasonic Corporation Infrared gas detector and infrared gas measuring device
US8410946B2 (en) * 2010-03-05 2013-04-02 General Electric Company Thermal measurement system and method for leak detection
CN102564603A (zh) * 2010-12-07 2012-07-11 南阳森霸光电有限公司 热释电红外传感器
DE102011077005B4 (de) 2011-06-06 2017-11-16 Rehm Thermal Systems Gmbh Anlage zur Wärmebehandlung von Substraten und Verfahren zum Erfassen von Messdaten darin
JP5853476B2 (ja) 2011-08-04 2016-02-09 セイコーエプソン株式会社 赤外線検出素子及び電子機器
US9250126B2 (en) * 2012-10-26 2016-02-02 Excelitas Technologies Singapore Pte. Ltd Optical sensing element arrangement with integral package
GB2521474A (en) * 2013-12-22 2015-06-24 Melexis Technologies Nv Infrared thermal sensor with beams having different widths
GB2527348A (en) * 2014-06-19 2015-12-23 Melexis Technologies Nv Infrared sensor with sensor temperature compensation
JP6398810B2 (ja) * 2015-03-12 2018-10-03 オムロン株式会社 内部温度測定装置及び温度差測定モジュール
JP6398808B2 (ja) * 2015-03-12 2018-10-03 オムロン株式会社 内部温度測定装置及びセンサパッケージ
CN106500835B (zh) * 2016-09-22 2017-12-22 北京空间机电研究所 一种适于低温环境的单元型双波段红外探测组件
US10914636B2 (en) * 2018-03-16 2021-02-09 Ams Sensors Uk Limited Thermopile self-test and/or self-calibration

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2213492B1 (enExample) * 1972-10-09 1975-03-28 Sodern
US4922116A (en) * 1988-08-04 1990-05-01 Hughes Aircraft Company Flicker free infrared simulator with resistor bridges
US5010251A (en) * 1988-08-04 1991-04-23 Hughes Aircraft Company Radiation detector array using radiation sensitive bridges
DE4102524C2 (de) * 1990-01-30 2000-05-25 Citizen Watch Co Ltd Infrarotsensor
JP2725965B2 (ja) * 1992-10-15 1998-03-11 松下電工株式会社 赤外線センサ
JPH07301679A (ja) * 1994-05-02 1995-11-14 Nissan Motor Co Ltd 人体検出装置
JPH08278192A (ja) * 1995-04-07 1996-10-22 Ishizuka Denshi Kk 赤外線検出器
JP3101190B2 (ja) * 1995-09-26 2000-10-23 松下電工株式会社 赤外線検出装置
DE19735379B4 (de) * 1997-08-14 2008-06-05 Perkinelmer Optoelectronics Gmbh Sensorsystem und Herstellungsverfahren
KR100239494B1 (ko) * 1998-02-28 2000-01-15 구자홍 써모파일 센서 및 그 제조방법
JP2001330511A (ja) * 2000-05-18 2001-11-30 Murata Mfg Co Ltd 赤外線センサ
US6670538B2 (en) * 2001-01-05 2003-12-30 Endevco Corporation Thermal radiation sensor
US6828560B2 (en) * 2002-01-31 2004-12-07 Delphi Technologies, Inc. Integrated light concentrator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10670465B2 (en) 2015-03-20 2020-06-02 Pixart Imaging Inc. Wearable infrared temperature sensing device
US10732049B2 (en) 2015-03-20 2020-08-04 Pixart Imaging Inc. Thermopile module
CN107224274A (zh) * 2016-03-23 2017-10-03 原相科技股份有限公司 穿戴式装置

Also Published As

Publication number Publication date
ATE378578T1 (de) 2007-11-15
DE602004009980D1 (de) 2007-12-27
JP2004361386A (ja) 2004-12-24
EP1464933A3 (en) 2005-02-16
DE602004009980T2 (de) 2008-07-31
EP1464933A2 (en) 2004-10-06
US20040187904A1 (en) 2004-09-30
ES2295779T3 (es) 2008-04-16
EP1464933B1 (en) 2007-11-14

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