JP5013846B2 - リレーモジュール - Google Patents
リレーモジュール Download PDFInfo
- Publication number
- JP5013846B2 JP5013846B2 JP2006342543A JP2006342543A JP5013846B2 JP 5013846 B2 JP5013846 B2 JP 5013846B2 JP 2006342543 A JP2006342543 A JP 2006342543A JP 2006342543 A JP2006342543 A JP 2006342543A JP 5013846 B2 JP5013846 B2 JP 5013846B2
- Authority
- JP
- Japan
- Prior art keywords
- relay
- bus bar
- semiconductor relay
- control circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
11 バスバ
12 半導体リレー
13 制御回路部
20 ICチップ
22 端子部
26 印刷配線板
27 回路部品
Claims (1)
- 半導体リレーと、前記半導体リレーを駆動する制御回路部と、外部機器と接続されるとともに当該外部機器と前記半導体リレーと前記制御回路部とを接続するバスバと、を備えたリレーモジュールにおいて、
前記半導体リレーは、金属で構成された平板状の端子部と、該端子部に重ねられて当該端子部に取り付けられたICチップとを備え、前記端子部が前記バスバ上に重ねられて当該バスバに直接固定されており、
前記制御回路部が、印刷配線板と、前記印刷配線板上に実装された少なくとも一つの回路部品とを備え、
前記印刷配線板が、前記半導体リレーからみて前記バスバの裏面上に重ねられて、当該バスバに取り付けられており、
前記回路部品が、前記半導体リレーとの間に前記バスバ及び前記印刷配線板を位置付ける前記印刷配線板の表面に実装されている
ことを特徴とするリレーモジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006342543A JP5013846B2 (ja) | 2006-12-20 | 2006-12-20 | リレーモジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006342543A JP5013846B2 (ja) | 2006-12-20 | 2006-12-20 | リレーモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008153582A JP2008153582A (ja) | 2008-07-03 |
JP5013846B2 true JP5013846B2 (ja) | 2012-08-29 |
Family
ID=39655403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006342543A Active JP5013846B2 (ja) | 2006-12-20 | 2006-12-20 | リレーモジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5013846B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011076273A1 (de) | 2011-05-23 | 2012-11-29 | Continental Automotive Gmbh | Leiterplatte für elektrische Bauelemente und Leiterplattensystem |
JP6297342B2 (ja) * | 2013-05-23 | 2018-03-20 | 株式会社ミツバ | 半導体リレー |
EP3605761B1 (en) | 2017-03-24 | 2021-12-08 | Yazaki Corporation | Electrical junction box and wiring harness |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3927017B2 (ja) * | 2001-11-26 | 2007-06-06 | 株式会社オートネットワーク技術研究所 | 回路構成体及びその製造方法 |
JP4391959B2 (ja) * | 2005-03-24 | 2009-12-24 | 三菱電機株式会社 | 電力変換装置 |
JP4732789B2 (ja) * | 2005-04-28 | 2011-07-27 | 株式会社オートネットワーク技術研究所 | スイッチングユニット |
-
2006
- 2006-12-20 JP JP2006342543A patent/JP5013846B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008153582A (ja) | 2008-07-03 |
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