JP5007063B2 - 荷電粒子ビーム装置、ｄａ変換装置の異常検出方法、荷電粒子ビーム描画方法及びマスク - Google Patents

荷電粒子ビーム装置、ｄａ変換装置の異常検出方法、荷電粒子ビーム描画方法及びマスク Download PDF

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Publication number
JP5007063B2
JP5007063B2 JP2006097370A JP2006097370A JP5007063B2 JP 5007063 B2 JP5007063 B2 JP 5007063B2 JP 2006097370 A JP2006097370 A JP 2006097370A JP 2006097370 A JP2006097370 A JP 2006097370A JP 5007063 B2 JP5007063 B2 JP 5007063B2
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value
output
converter
amplifier unit
analog
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Japanese (ja)
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JP2007271919A (ja
JP2007271919A5 (enExample
Inventor
嘉政 三宮
昭 野間
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Nuflare Technology Inc
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Nuflare Technology Inc
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Priority to JP2006097370A priority Critical patent/JP5007063B2/ja
Priority to US11/692,409 priority patent/US7463173B2/en
Priority to DE102007015232A priority patent/DE102007015232A1/de
Priority to KR1020070031394A priority patent/KR100866203B1/ko
Publication of JP2007271919A publication Critical patent/JP2007271919A/ja
Publication of JP2007271919A5 publication Critical patent/JP2007271919A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/10—Calibration or testing
    • H03M1/1071—Measuring or testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
    • H01J23/02—Electrodes; Magnetic control means; Screens
    • H01J23/09—Electric systems for directing or deflecting the discharge along a desired path, e.g. E-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/08—Ion sources; Ion guns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3005—Observing the objects or the point of impact on the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/66—Digital/analogue converters

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Electron Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2006097370A 2006-03-31 2006-03-31 荷電粒子ビーム装置、ｄａ変換装置の異常検出方法、荷電粒子ビーム描画方法及びマスク Active JP5007063B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006097370A JP5007063B2 (ja) 2006-03-31 2006-03-31 荷電粒子ビーム装置、ｄａ変換装置の異常検出方法、荷電粒子ビーム描画方法及びマスク
US11/692,409 US7463173B2 (en) 2006-03-31 2007-03-28 Charged particle beam apparatus, abnormality detecting method for DA converter unit, charged particle beam writing method, and mask
DE102007015232A DE102007015232A1 (de) 2006-03-31 2007-03-29 Ladungspartikelstrahlenvorrichtung, Anomalieerfassungsverfahren für eine DA-Wandlereinheit, Ladungspartikelstrahlenschreibverfahren und Maske
KR1020070031394A KR100866203B1 (ko) 2006-03-31 2007-03-30 하전 입자 빔 장치, ｄａ 변환 장치의 이상 검출 방법,하전 입자 빔 묘화 방법 및 마스크

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006097370A JP5007063B2 (ja) 2006-03-31 2006-03-31 荷電粒子ビーム装置、ｄａ変換装置の異常検出方法、荷電粒子ビーム描画方法及びマスク

Publications (3)

Publication Number Publication Date
JP2007271919A JP2007271919A (ja) 2007-10-18
JP2007271919A5 JP2007271919A5 (enExample) 2008-11-27
JP5007063B2 true JP5007063B2 (ja) 2012-08-22

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JP2006097370A Active JP5007063B2 (ja) 2006-03-31 2006-03-31 荷電粒子ビーム装置、ｄａ変換装置の異常検出方法、荷電粒子ビーム描画方法及びマスク

Country Status (4)

Country Link
US (1) US7463173B2 (enExample)
JP (1) JP5007063B2 (enExample)
KR (1) KR100866203B1 (enExample)
DE (1) DE102007015232A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7508331B2 (en) * 2007-01-31 2009-03-24 Wolfson Microelectronics Plc Digital-to-analog converter with dynamic element matching to minimize mismatch error
JP5123730B2 (ja) * 2008-05-01 2013-01-23 株式会社ニューフレアテクノロジー 偏向アンプのセトリング時間検査方法及び偏向アンプの故障判定方法
JP5174531B2 (ja) * 2008-05-16 2013-04-03 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置および荷電粒子ビーム描画装置における描画方法
JP5107812B2 (ja) * 2008-07-08 2012-12-26 株式会社日立ハイテクノロジーズ 検査装置
JP5461799B2 (ja) * 2008-07-30 2014-04-02 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置および荷電粒子ビーム描画装置におけるｄａｃアンプユニットの診断方法
US7898447B2 (en) * 2009-07-16 2011-03-01 Nuflare Technology, Inc. Methods and systems for testing digital-to-analog converter/amplifier circuits
JP5881972B2 (ja) * 2011-05-12 2016-03-09 株式会社ニューフレアテクノロジー Ｄａｃアンプの評価方法及び荷電粒子ビーム描画装置
JP5855390B2 (ja) * 2011-08-30 2016-02-09 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及びブランキングタイミングの調整方法
JP5819140B2 (ja) * 2011-08-30 2015-11-18 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及びｄａｃアンプの評価方法
EP2575159B1 (en) * 2011-09-30 2016-04-20 Carl Zeiss Microscopy GmbH Particle beam system and method for operating the same
JP6087154B2 (ja) * 2013-01-18 2017-03-01 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置、試料面へのビーム入射角調整方法、および荷電粒子ビーム描画方法
JP5970394B2 (ja) * 2013-02-27 2016-08-17 株式会社日立ハイテクノロジーズ 検査装置
JP6057797B2 (ja) 2013-03-21 2017-01-11 株式会社ニューフレアテクノロジー セトリング時間の取得方法
JP6349944B2 (ja) * 2014-05-13 2018-07-04 株式会社ニューフレアテクノロジー 電子ビーム描画装置及び電子ビーム描画方法
KR102247563B1 (ko) 2014-06-12 2021-05-03 삼성전자 주식회사 전자빔을 이용한 노광 방법과 그 노광 방법을 이용한 마스크 및 반도체 소자 제조방법
JP6240045B2 (ja) * 2014-08-25 2017-11-29 株式会社ニューフレアテクノロジー 異常検出方法及び電子線描画装置
JP2016096204A (ja) * 2014-11-13 2016-05-26 株式会社ニューフレアテクノロジー 出力調整方法及び電子線描画装置
KR102404639B1 (ko) 2015-02-02 2022-06-03 삼성전자주식회사 전자 빔 노광 방법 및 그를 포함하는 기판 제조 방법
JP7356605B2 (ja) * 2020-12-30 2023-10-04 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
US11810749B2 (en) * 2021-12-06 2023-11-07 Carl Zeiss Smt Gmbh Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods

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JPS6424351A (en) * 1987-07-20 1989-01-26 Fujitsu Ltd Self-diagonosis device of da converting output unit for electron beam device
DE68920281T2 (de) * 1988-10-31 1995-05-11 Fujitsu Ltd Vorrichtung und Verfahren zur Lithographie mittels eines Strahls geladener Teilchen.
EP0433993B1 (en) * 1989-12-21 1997-03-19 Fujitsu Limited Method and apparatus for controlling charged particle beams in charged particle beam exposure system
JPH05190432A (ja) * 1992-01-17 1993-07-30 Fujitsu Ltd 荷電粒子線露光装置
US5528048A (en) * 1994-03-15 1996-06-18 Fujitsu Limited Charged particle beam exposure system and method
JP3453004B2 (ja) * 1995-06-08 2003-10-06 富士通株式会社 荷電粒子ビーム露光方法及び装置
JP3584962B2 (ja) 1999-02-03 2004-11-04 東芝機械株式会社 荷電ビーム描画方法及びその装置
JP2002094380A (ja) * 2000-09-20 2002-03-29 Matsushita Electric Ind Co Ltd Ｄａ変換装置
JP2004259812A (ja) 2003-02-25 2004-09-16 Hitachi High-Technologies Corp 電子線描画装置および電子線描画装置のセトリングタイム測定方法
JP2005129614A (ja) * 2003-10-22 2005-05-19 Jeol Ltd 荷電粒子ビーム装置。
US7209055B1 (en) * 2005-10-03 2007-04-24 Applied Materials, Inc. Electrostatic particle beam deflector

Also Published As

Publication number Publication date
US7463173B2 (en) 2008-12-09
US20070229337A1 (en) 2007-10-04
DE102007015232A1 (de) 2007-10-18
KR100866203B1 (ko) 2008-10-30
KR20070098709A (ko) 2007-10-05
JP2007271919A (ja) 2007-10-18

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