JP5004515B2 - Carrier jig - Google Patents

Description

  The present invention relates to a carrier jig used in a dicing process of a semiconductor wafer.

  In the semiconductor wafer dicing process, a carrier jig for protecting and fixing the semiconductor wafer is used. Although not shown, this carrier jig includes a frame for housing the semiconductor wafer thinned by back grinding, The semiconductor wafer is separated into individual chips by a blade that rotates at high speed (see Patent Documents 1 and 2).

  The frame is formed into a hollow ring using a material such as SUS, and has a weight of about 300 g. The dicing tape is made of, for example, a UV tape that is cured by irradiation with ultraviolet rays or has a reduced adhesive force, and is peeled off from the back surface of the frame after use.

When manufacturing such a carrier jig, a frame is set on a dicing tape attaching device, the dicing tape is bonded to the back surface thereof, and the excess portion of the dicing tape protruding from the outer peripheral portion of the back surface of the frame is dicing tape. If it cuts and removes with the cutter blade of a sticking apparatus, a carrier jig can be manufactured.
JP 2005-251986 A Japanese Patent Laid-Open No. 2005-203540

  The conventional carrier jig is configured as described above, and the frame is manufactured using heavy SUS or the like that adversely affects the communication characteristics. Therefore, the cassette for housing the semiconductor wafer is heavy as a whole (for example, about 18 kg). In addition, there is a problem that history management cannot be performed using an RFID system that has been attracting attention in recent years.

  To solve this problem, the frame may be molded from a molding material containing resin, but in simple molding, when cutting the excess part of the dicing tape that protrudes from the outer periphery of the back surface of the frame with a cutter blade, the frame In this case, a new problem arises in that cutting is generated by the cutter blade, and chips are generated to cause contamination of the semiconductor wafer. Further, when the used dicing tape is peeled off, there is a high possibility that the cutting waste adheres to the cutting trace by the cutter blade.

In the present invention, in order to solve the above problems, a hollow frame that accommodates a semiconductor wafer sliced to a thickness of 100 μm or less, and a dicing tape that is attached to the frame and that holds the semiconductor wafer in an adhesive manner are provided. A dicing tape is attached to the back of the frame, and the excess part protruding from the frame is removed with a blade.
The frame is molded from a resin-containing molding material, and a hole for attaching an RF tag is recessed on the surface, and the outer periphery of the back surface of the frame is cut away in the thickness direction to form a step for cutting the blade. In addition, a cutting dust generation prevention layer made of a soft material is bonded to a region extending from the inner periphery of the back surface of the frame to the step portion, and dicing is performed on the bonding portion of the cutting dust generation prevention layer bonded to the inner periphery of the back surface of the frame. The tape is bonded, and the excess portion of the dicing tape that protrudes outward from the bonded portion of the cutting dust generation prevention layer is cut and removed with a blade that moves along the inner periphery of the back surface of the frame. Yes.

In order to solve the above-described problems, the present invention includes a hollow frame that accommodates a semiconductor wafer, and a dicing tape that is attached to the frame and holds the semiconductor wafer. The dicing tape is attached to the back surface of the frame. The excess part protruding from the frame is removed with a blade ,
The frame is formed of a molding material containing resin, and the stepped portion for avoiding the cutter is recessed by cutting out the outer peripheral portion of the back surface in the thickness direction, and in the region extending from the inner peripheral portion of the frame to the stepped portion, Adhering a cutting dust generation prevention layer made of a metal material or a soft material, adhering a dicing tape to the bonding portion of the cutting dust generation prevention layer bonded to the inner periphery of the back surface of the frame, and an adhesion portion of the cutting dust generation prevention layer The excess portion of the dicing tape that protrudes outward from the cutting edge is cut and removed by a blade that moves along the inner periphery of the back surface of the frame .

  Here, the frame in the claims may be a ring shape or a frame shape as long as it is hollow. Further, the semiconductor wafer is not particularly limited to 200 mm, 300 mm, 450 mm type and the like. A dicing tape does not ask | require in particular types, such as a PVC type | mold type and an ultraviolet curing type. In addition to the resin, various fillers such as an antistatic agent can be added to the molding material as necessary.

  According to the present invention, since the frame is formed from a molding material containing a resin that does not adversely affect the communication characteristics, the weight of the cassette when storing the semiconductor wafer can be reduced, and the RFID system can be effectively utilized. History management can be performed. In addition, when the surplus portion of the dicing tape is cut with the blade, the stepped portion cut out on the back surface of the frame avoids contact with the blade, so that the generation of foreign matters such as cutting waste can be prevented.

According to the present invention, the frame is not manufactured using heavy SUS or the like, but is thinly and lightly molded with a molding material containing an insulating resin, so that the weight of the entire cassette during semiconductor wafer storage can be reduced. In addition, there is an effect that history management can be performed by effectively utilizing the RFID system. In addition, when cutting unnecessary excess portion of the dicing tape that protrudes from the frame with the blade, the blade does not come into contact with the recessed stepped portion, so the back surface of the frame is less likely to be cut with the blade. Can be prevented. Accordingly, it is possible to effectively prevent the cutting waste from being attached to the cutting trace by the blade when the cutting waste is generated and the semiconductor wafer is contaminated or the used dicing tape is peeled off .
Further, since the structure is not different from the conventional structure except that a step portion is formed on the back surface of the frame, it can be effectively used as it is without improving the existing dicing tape attaching device and the post-processing device. Also, since the RFID tag of the RFID system can be attached to the surface of the frame with the same height, the smoothness of the frame can be maintained and improved, and the RF tag remains attached. It can be used repeatedly. Furthermore , since a separate cutting waste generation prevention layer is bonded to the region extending from the inner periphery of the back surface to the step portion of the frame for protection, there is a blade on the step wall or step portion between the inner surface of the back surface and the step portion. It becomes possible to prevent contact .

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In this embodiment, as shown in FIGS. 1 to 5, a frame 1 for housing a thinned semiconductor wafer W, and the frame And a dicing tape 10 for adhering and holding the semiconductor wafer W accommodated in 1, and a stepped portion 20 for avoiding a cutter blade is formed on a part of the back surface 4 of the frame 1.

  The semiconductor wafer W is, for example, sliced into a round shape with a diameter of 300 mm (12 inches) and a circuit pattern is drawn and formed on the surface. Is sliced to a thickness of

  As shown in FIGS. 1 to 5, the frame 1 is injection-molded into a hollow flat substantially ring shape larger than the semiconductor wafer W by a molding material containing a predetermined resin, and a rectangular storage hole 2 is recessed on a flat surface. The RFID tag RF tag 3 of the RFID system that is formed flush with the surface of the housing hole 2 is attached.

  The predetermined resin is not particularly limited, and examples thereof include PPS, PA, PEI, PAI, PEEK, PES, LCP, and PBT which are excellent in mechanical strength. The resin is blended with fillers such as glass fiber, carbon fiber, calcium carbonate and the like to ensure strength and rigidity as necessary.

  The RFID system is a reader that controls communication between the RF tag 3, an RF tag 3 that moves with the frame 1 when an internal memory is accessed by radio waves, an antenna unit that transmits and receives radio waves and power between the RF tag 3, and the RF tag 3. / Writer and a computer that controls the reader / writer. The antenna unit and the reader / writer are configured separately, but are integrated as necessary. If the reader / writer control is not hindered, various controllers are used instead of the computer.

  As shown in FIGS. 1, 4, and 5, the dicing tape 10 is made of, for example, a flexible UV tape that is cured by irradiation of ultraviolet rays or has a reduced adhesive force, and is larger than the semiconductor wafer W. The semiconductor wafer W is adhered to the inner peripheral portion of the back surface 4 of the frame 1, holds the semiconductor wafer W accommodated in the hollow portion of the frame 1, and peels from the frame 1 after use.

  As shown in FIGS. 3 to 5, the stepped portion 20 is flat because the outer peripheral portion of the inner peripheral portion and the outer peripheral portion of the back surface 4 of the frame 1 is notched in the thickness direction by cutting or laser processing. The dicing tape 10 functions to form a gap with the cutter blade 31 of the existing dicing tape attaching device 30 when the dicing tape 10 is cut.

  In the above, when manufacturing the carrier jig, the frame 1 formed in the existing dicing tape attaching device 30 is set, and the back surface 4 and the stepped portion 20 are directed upward (see FIG. 3), and this exposure is performed. Then, a large dicing tape 10 is bonded to the inner peripheral portion of the back surface 4, and then the surplus portion 11 of the dicing tape 10 protruding from the inner peripheral portion of the back surface 4 is cut by the cutter blade 31 of the dicing tape attaching device 30 (see FIG. 4), the carrier jig can be manufactured (see FIG. 5). The cutter blade 31 is supported by the dicing tape attaching device 30 so as to move along the inner peripheral portion of the back surface of the frame 1.

  According to the above configuration, the frame 1 is not manufactured using heavy SUS or the like, but is thinly and lightly injection-molded with a molding material containing an insulating resin. (For example, about 13 kg), and history management can be performed by effectively utilizing the RFID system.

  Further, when the unnecessary surplus portion 11 of the dicing tape 10 protruding from the frame 1 is cut by the cutter blade 31, the cutter blade 31 does not come into contact with the recessed stepped portion 20. Cutting with the blade 31 is prevented, and the generation of foreign matter can be prevented. Accordingly, it is possible to extremely effectively suppress and prevent the cutting dust from being attached to the cutting trace by the cutter blade 31 when the cutting waste is generated to cause contamination of the semiconductor wafer W or when the used dicing tape 10 is peeled off. it can.

  In addition, since the step portion 20 is not formed on the back surface 4 of the thin frame 1, there is nothing structurally different from the conventional one, so that it can be effectively used as it is without improving the existing dicing tape attaching device 30 and the post-processing device. It becomes possible. Furthermore, since the RF tag 3 of the RFID system can be adhered to the surface of the frame 1 so as to be flush with each other, the smoothness of the frame 1 can be maintained and improved. It becomes possible to use it repeatedly while sticking.

  Next, FIG. 6 shows a second embodiment of the present invention. In this case, a substantially ring-shaped cutting waste that is bent at the inner peripheral portion and the step portion 20 on the back surface 4 of the frame 1 is prevented. The layer 40 is laminated and bonded, and the dicing tape 10 is bonded to a part of the cutting dust generation preventing layer 40, in other words, the bonding portion of the cutting dust generation preventing layer 40 to the inner peripheral portion of the back surface of the frame 1. ing.

  The cutting waste generation preventing layer 40 is formed flat using a predetermined metal material or soft material, and is bonded to an area extending from the inner peripheral portion to the step portion 20 on the back surface 4 of the frame 1 via an adhesive. Adhering to the peripheral edge of the facing surface of the dicing tape 10. Examples of the predetermined metal material of the cutting dust generation preventing layer 40 include stainless steel and titanium, and examples of the predetermined soft material include a soft vinyl chloride resin having a Shore A hardness of 70 Hs or less, a polyolefin-based elastomer, and a urethane-based elastomer. Etc.

  In the above, when manufacturing the carrier jig, the frame 1 formed in the dicing tape attaching device 30 is set, and the stepped portion 20 and the cutting waste generation preventing layer 40 are directed upward to generate the exposed cutting waste. After the large dicing tape 10 is bonded to a part of the prevention layer 40, the surplus portion 11 of the dicing tape 10 that protrudes from a part of the cutting dust generation prevention layer 40 is cut by the cutter blade 31 of the dicing tape attaching device 30. If removed, the carrier jig can be manufactured. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above embodiment can be expected, and a separate cutting waste generation preventing layer 40 is bonded to the back surface 4 of the frame 1 for protection. Obviously, the cutter blade 31 can be reliably prevented from coming into contact with the stepped wall 21 and the stepped portion 20 between the stepped portion 20 and the stepped portion 20.

Next, FIG. 7 shows a third embodiment of the present invention. In this case, a flat adhesive capturing layer 41 for cutting waste is bonded on the stepped portion 20 of the frame 1 in a substantially ring shape. Like to do.
The adhesive capturing layer 41 is formed by using a urethane-based or polyolefin-based self-adhesive layer, an acrylic-based or silicone-based adhesive applied and drying, or a urethane-based or silicone-based adhesive layer. used. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Even in this embodiment, the same effect as the above embodiment can be expected, and even when cutting the surplus portion of the dicing tape 10, even if the cutter blade 31 comes into contact with the recessed step portion 20 to generate cutting waste, it is adhesive. It is obvious that the cutting scraps can be prevented from being transferred to the dicing tape 10 or the semiconductor wafer W with a simple configuration because the cutting scraps are stuck to the trapping layer 41 and do not diffuse.

  In the above embodiment, the cutting dust generation preventing layer 40 is bonded to the back surface 4 of the frame 1, but the present invention is not limited to this. For example, the frame 1 and the cutting waste generation preventing layer 40 may be integrated by insert molding to simplify manufacturing. Further, the dicing tape attaching device 30 may be automatic or semi-automatic.

It is a perspective explanatory view showing typically an embodiment of a carrier jig concerning the present invention. It is a back view which shows typically the flame | frame in embodiment of the carrier jig | tool which concerns on this invention. It is a section explanatory view showing typically the frame in the embodiment of the carrier jig concerning the present invention. FIG. 4 is a cross-sectional explanatory view schematically showing a state in which a dicing tape is attached to the back surface of the frame of FIG. 3 and the excess portion is cut with a cutter blade. FIG. 5 is a cross-sectional explanatory view schematically showing a state where an excess portion of the dicing tape of FIG. 4 is removed. It is a section explanatory view showing typically a 2nd embodiment of a career jig concerning the present invention. It is a section explanatory view showing typically a 3rd embodiment of a carrier jig concerning the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Frame 2 Storage hole 3 RF tag 4 Back surface 10 Dicing tape 11 Excess part 20 Step part 21 Step part wall 30 Dicing tape sticking apparatus 31 Cutter blade (cutlery)
40 Cutting waste generation prevention layer 41 Adhesion capture layer W Semiconductor wafer

Claims (1)

A hollow frame that accommodates a semiconductor wafer sliced to a thickness of 100 μm or less, and a dicing tape that is attached to the frame and that holds the semiconductor wafer in an adhesive manner are attached to the back surface of the frame. A carrier jig that removes surplus portions protruding from the frame with a blade,
The frame is molded from a resin-containing molding material, and a hole for attaching an RF tag is recessed on the surface, and the outer periphery of the back surface of the frame is cut away in the thickness direction to form a step for cutting the blade. In addition, a cutting dust generation prevention layer made of a soft material is bonded to a region extending from the inner periphery of the back surface of the frame to the step portion, and dicing is performed on the bonding portion of the cutting dust generation prevention layer bonded to the inner periphery of the back surface of the frame. The tape is bonded, and the excess portion of the dicing tape that protrudes outward from the bonded portion of the cutting dust generation prevention layer is cut and removed with a blade that moves along the inner peripheral portion of the back surface of the frame. Carrier jig to be used.

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