JP2007335707A - Carrier tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier tool that suppresses contamination in a semiconductor wafer caused by the occurrence of cut refuse from a formed frame when removing an excess section of a dicing tape by using an edge tool, and reduces a possibility that the cut refuse adheres to a mark cut by the edge tool. <P>SOLUTION: The carrier tool has a hollow frame 1 for storing the semiconductor wafer thinned by backgrinding, and a dicing tape 10 that is bonded onto a backside 4 of the frame 1 and adheres and holds the semiconductor wafer. A soft cut refuse occurrence prevention layer 20 bonded to the dicing tap 10 is laminated onto the backside 4 of the frame 1 for suppressing and preventing the occurrence of the cut refuse following the removal of an excess section 11 of the dicing tape 10 by the cut refuse occurrence prevention layer 20. A cutter edge 31 comes into contact with, not the frame 1, but the cut refuse occurrence prevention layer 20 for protecting the backside 4, and no foreign matters occur, thus preventing the backside 4 of the frame 1 from being cut with the cutter edge 31. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a carrier jig used in a dicing process of a semiconductor wafer.

  In the semiconductor wafer dicing process, a carrier jig for protecting and fixing the semiconductor wafer is used. Although not shown, this carrier jig includes a frame for housing the semiconductor wafer thinned by back grinding, The semiconductor wafer is separated into individual chips by a blade that rotates at high speed (see Patent Documents 1 and 2).

  The frame is formed into a hollow ring using a material such as SUS, and has a weight of about 300 g. The dicing tape is made of, for example, a UV tape that is cured by irradiation with ultraviolet rays or has a reduced adhesive force, and is peeled off from the back surface of the frame after use.

When manufacturing such a carrier jig, a frame is set on a dicing tape attaching device, the dicing tape is bonded to the back surface thereof, and the excess portion of the dicing tape protruding from the outer peripheral portion of the back surface of the frame is dicing tape. If it cuts and removes with the cutter blade of a sticking apparatus, a carrier jig can be manufactured.
JP 2005-251986 A Japanese Patent Laid-Open No. 2005-203540

  The conventional carrier jig is configured as described above, and the frame is manufactured using heavy SUS or the like that adversely affects the communication characteristics. Therefore, the cassette for housing the semiconductor wafer is heavy as a whole (for example, about 18 kg). In addition, there is a problem that history management cannot be performed using an RFID system that has been attracting attention in recent years.

  To solve this problem, the frame may be molded from a molding material containing resin, but in simple molding, when cutting the excess part of the dicing tape that protrudes from the outer periphery of the back surface of the frame with a cutter blade, the frame In this case, a large problem arises in that cutting is generated by the cutter blade, and chips are generated to cause contamination of the semiconductor wafer. Further, when the used dicing tape is peeled off, there is a high possibility that the cutting waste adheres to the cutting trace by the cutter blade.

  In addition, the frame is reused in some cases, but when reused, the adhesive of the dicing tape applied to the cutting trace by the cutter blade bites into the cutting trace, and the adhesive remains on the cutting trace when the used dicing tape is peeled off. May occur. This residual adhesive may cause poor adhesion of the dicing tape, or may be transferred to the surface of the frame when it is overlapped and adhered as a foreign matter on the semiconductor wafer. For this reason, there is a problem that the frame once used must be cleaned with a brush or the like every time it is reused to remove the adhesive residue.

  The present invention has been made in view of the above, and when removing the excess portion of the dicing tape with a blade, it can suppress the generation of cutting waste from the molded frame and contaminate the semiconductor wafer, and the blade. An object of the present invention is to provide a carrier jig that is less likely to cause cutting scraps to adhere to the cutting trace by the above.

In order to solve the above-described problems, the present invention includes a hollow frame that accommodates a semiconductor wafer, and a dicing tape that is attached to the back surface of the frame and holds the semiconductor wafer in an adhesive manner. Is to be removed by
The frame is molded from a resin-containing molding material, and a soft cutting dust generation prevention layer is provided on the back of the frame. This cutting dust generation prevention layer suppresses the generation of cutting scraps due to the removal of excess parts of the dicing tape. It is characterized by doing so.
Note that a stepped portion for avoiding the cutter is formed by cutting out the outer peripheral portion of the back surface of the frame, and a cutting waste generation preventing layer is provided on at least the inner peripheral portion of the inner peripheral portion and the stepped portion of the rear surface of the frame. it can.

Also, a hollow frame for accommodating the thinned semiconductor wafer and a dicing tape for adhering and holding the semiconductor wafer accommodated in the hollow portion of the frame, and a surplus portion by attaching the dicing tape to the back surface of the frame Is removed with a blade,
The frame is molded from a molding material containing resin, and a soft cutting dust generation prevention layer that sticks to the dicing tape is provided on the back surface of the frame, and this cutting dust generation prevention layer allows cutting accompanying removal of excess portions of the dicing tape. It may be characterized by suppressing generation of waste.

Also, manufacturing a carrier jig that attaches a dicing tape that adheres and holds a back-ground semiconductor wafer to the back surface of a hollow frame molded from a resin-containing molding material, and removes excess portions of the dicing tape with a blade. A method,
A soft cutting dust generation preventing layer that sticks to the dicing tape may be provided on the back surface of the frame, and the generation of cutting scraps associated with the removal of excess portions of the dicing tape may be suppressed by the cutting dust generation preventing layer.

An RF tag of the RFID system can be attached to the frame.
Moreover, a flame | frame and the cutting waste generation prevention layer can be integrated by insert molding.
Moreover, the cutting waste generation preventing layer can be formed using a soft vinyl chloride resin, a polyolefin-based elastomer, and / or a urethane-based elastomer.
Furthermore, it is preferable that the Shore A hardness of the cutting waste generation preventing layer is 70 Hs or less.
Furthermore, it is possible to endlessly form the cutting waste generation preventing layer.

  Here, the frame in the claims may be a ring shape or a frame shape as long as it is hollow. Further, the semiconductor wafer is not particularly limited to 200 mm, 300 mm, 450 mm type and the like. A dicing tape does not ask | require in particular types, such as a PVC type | mold type and an ultraviolet curing type. In addition to the resin, various fillers such as an antistatic agent can be added to the molding material as necessary.

  According to the present invention, since the frame is formed of a molding material containing a resin that does not adversely affect the communication characteristics, it is possible to reduce the weight of the cassette when storing the semiconductor wafer, and to effectively utilize the RFID system. History management can be performed. In addition, when cutting the excess part of the dicing tape with a blade, the blade contacts the soft cutting dust generation prevention layer that protects the back surface of the frame, not the frame, thus preventing the generation of foreign substances such as cutting dust. it can.

  ADVANTAGE OF THE INVENTION According to this invention, when removing the excess part of a dicing tape with a cutter, there exists an effect that it can suppress that a cutting waste generate | occur | produces from the shape | molded flame | frame and contaminates a semiconductor wafer. In addition, it is possible to reduce the risk of cutting chips adhering to the cutting trace by the blade. Further, since the adhesive remaining on the dicing tape can be prevented, it is not necessary to clean the frame each time it is used.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, a carrier jig in the present embodiment includes a frame 1 for housing a thinned semiconductor wafer W, and A dicing tape 10 for holding the semiconductor wafer W accommodated in the frame 1 is provided, and a cutting dust generation preventing layer 20 made of a soft material is laminated on the back surface 4 of the frame 1.

  The semiconductor wafer W is, for example, sliced into a round shape with a diameter of 300 mm (12 inches), and a circuit pattern is drawn and formed on the surface. Is sliced to a thickness of

  As shown in FIGS. 1 to 3, the frame 1 is injection-molded into a hollow flat substantially ring shape larger than the semiconductor wafer W by a molding material containing a predetermined resin, and a rectangular storage hole 2 is recessed on a flat surface. The RFID tag RF tag 3 of the RFID system that is formed flush with the surface of the housing hole 2 is attached.

  The predetermined resin is not particularly limited, and examples thereof include PPS, PA, PEI, PAI, PEEK, PES, LCP, and PBT which are excellent in mechanical strength. The resin is blended with fillers such as glass fiber, carbon fiber, calcium carbonate and the like to ensure strength and rigidity as necessary.

  The RFID system is a reader that controls communication between the RF tag 3, an RF tag 3 that moves with the frame 1 when an internal memory is accessed by radio waves, an antenna unit that transmits and receives radio waves and power between the RF tag 3, and the RF tag 3. / Writer and a computer that controls the reader / writer. The antenna unit and the reader / writer are configured separately, but are integrated as necessary. If the reader / writer control is not hindered, various controllers are used instead of the computer.

  As shown in FIGS. 1 and 3, the dicing tape 10 is made of, for example, a flexible UV tape that is cured by irradiation of ultraviolet rays or has a reduced adhesive force. The dicing tape 10 is a flat circular thin film larger than the semiconductor wafer W. It is formed and bonded to the flat back surface 4 of the frame 1 through a cutting waste generation preventing layer 20 to stick and hold the semiconductor wafer W accommodated in the hollow portion of the frame 1 and to generate cutting waste of the frame 1 after use. It peels from the prevention layer 20.

  As shown in FIG. 2 and FIG. 3, the cutting waste generation preventing layer 20 is formed into a flat planar substantially ring shape using, for example, a soft vinyl chloride resin having a Shore A hardness of 70 Hs or less, a polyolefin elastomer, or a urethane elastomer. Then, it is bonded to the back surface 4 of the frame 1, in other words, to the cutter blade contact region of the back surface 4 via an adhesive, and is bonded to the peripheral portion of the facing surface of the dicing tape 10.

  In the above, when manufacturing the carrier jig, the frame 1 formed in the existing dicing tape attaching device 30 is set, the back surface 4 and the cutting dust generation preventing layer 20 are directed upward, and the exposed frame A large dicing tape 10 is bonded to the back surface 4 of 1 through a flat cutting waste generation preventing layer 20, and then the surplus portion 11 of the dicing tape 10 protruding from the outer periphery of the back surface of the frame 1 is attached to the dicing tape attaching device 30. The carrier jig can be manufactured by cutting and removing with the cutter blade 31. The cutter blade 31 is supported by the dicing tape attaching device 30 so as to move along the peripheral surface of the frame 1.

  According to the above configuration, the frame 1 is not manufactured using heavy SUS or the like, but is thinly and lightly injection-molded with a molding material containing an insulating resin. (For example, about 13 kg) can be achieved, and the history can be managed by effectively utilizing the RFID system.

  Further, when the unnecessary surplus portion 11 of the dicing tape 10 that protrudes from the frame 1 is cut by the cutter blade 31, the cutter blade 31 is not the back surface 4 of the resin frame 1 but a separate cutting waste covering the back surface 4. Since no foreign matter is generated in contact with the generation preventing layer 20, the back surface 4 of the frame 1 is not cut by the cutter blade 31. Accordingly, it is possible to extremely effectively suppress and prevent the cutting dust from being attached to the cutting trace by the cutter blade 31 when the cutting waste is generated to cause contamination of the semiconductor wafer W or when the used dicing tape 10 is peeled off. it can.

  In addition, since the cutting dust generation prevention layer 20 is laminated and bonded to the back surface 4 of the thin frame 1, there is nothing structurally different from the conventional one, so that the existing dicing tape attaching device 30 and the post-processing device are improved. It is possible to use it as it is. Further, since the RF tag 3 of the RFID system can be attached to the surface of the frame 1 so as to be flush with each other, the smoothness of the frame 1 can be maintained and improved. It becomes possible to use it repeatedly while sticking.

  Further, when the frame 1 is reused, the adhesive of the dicing tape 10 applied next to the cutting trace by the cutter blade 31 bites in, and when the used dicing tape 10 is peeled off, the adhesive remains in the cutting trace. Can be effectively prevented. Therefore, the adhesion of the dicing tape 10 does not occur with the remaining adhesive, and it does not adhere to the semiconductor wafer W as foreign matter. Furthermore, it is not necessary to wash the used frame 1 with a brush or the like every time it is reused, and to remove the adhesive residue.

  Next, FIG. 4 shows a second embodiment of the present invention. In this case, a stepped portion 5 for avoiding a cutter blade is formed flat by cutting out the outer peripheral portion of the back surface of the frame 1, and this frame. The cutting waste generation preventing layer 20 is laminated and bonded to the inner peripheral portion of the inner peripheral portion and the recessed step portion 5 on the back surface 4 of 1. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected. Moreover, when the dicing tape 10 is cut by the cutter blade 31, the cutter blade 31 does not come into contact with the stepped portion 5 that is recessed. It is clear that the cutter blade 31 does not cut. In addition, since it is only necessary to adhere the cutting dust generation preventing layer 20 only to the inner peripheral portion of the back surface of the frame 1, it is obvious that the material saving of the cutting dust generation preventing layer 20 can be achieved.

Next, FIG. 5 shows a third embodiment of the present invention. In this case, a stepped portion 5 for avoiding a cutter blade is formed flat by cutting out the outer peripheral portion of the back surface of the frame 1, and this frame. The bent cutting waste generation preventing layer 20 is laminated and bonded to the inner peripheral portion and the recessed step portion 5 on the back surface 4 of the first substrate. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same effects as those of the above-described embodiment can be expected, and that the shape of the cutting waste generation preventing layer 20 can be diversified.

  In the above embodiment, the cutting waste generation preventing layer 20 is bonded to the back surface 4 of the frame 1, but the present invention is not limited to this. For example, the frame 1 and the cutting waste generation preventing layer 20 may be integrated by insert molding to simplify the production. Moreover, although the cutting waste generation | occurrence | production prevention layer 20 may be formed using a single soft material, you may form in a multilayer structure using a multiple types of soft material. Further, the dicing tape attaching device 30 may be automatic or semi-automatic.

It is a perspective explanatory view showing typically an embodiment of a carrier jig concerning the present invention. It is a back surface explanatory view showing typically an embodiment of a career jig concerning the present invention. It is a section explanatory view showing typically an embodiment of a carrier jig concerning the present invention. It is a section explanatory view showing typically a 2nd embodiment of a career jig concerning the present invention. It is a section explanatory view showing typically a 3rd embodiment of a carrier jig concerning the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Frame 2 Storage hole 3 RF tag 4 Back surface 5 Step part 10 Dicing tape 11 Excess part 20 Cutting waste generation prevention layer 30 Dicing tape sticking apparatus 31 Cutter blade (cutlery)
W Semiconductor wafer

Claims (2)

A carrier jig for removing a surplus portion of the dicing tape with a blade, comprising a hollow frame for housing the semiconductor wafer and a dicing tape that is attached to the back surface of the frame and holds the semiconductor wafer in an adhesive manner.
The frame is molded from a resin-containing molding material, and a soft cutting dust generation prevention layer is provided on the back side of the frame. This cutting dust generation prevention layer suppresses the generation of cutting scraps due to the removal of excess parts of the dicing tape. A carrier jig characterized by that.   2. A step for avoiding the cutter is formed by cutting out the outer peripheral portion of the back surface of the frame, and a cutting dust generation preventing layer is provided on at least the inner peripheral portion of the inner peripheral portion and the step portion of the rear surface of the frame. Carrier jig.

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