JP2007324245A - Manufacturing method and transporting container of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device whereby, when protecting a semiconductor wafer by the protective tape having an ultraviolet-ray-cured type adhesive, the carriage and transportation, etc. of the semiconductor wafer can be made easy. <P>SOLUTION: The manufacturing method of a semiconductor device is the one wherein, when grinding with a grinding stone 12 the rear surface opposed to the front surface of the side of a circuit surface 2 of a semiconductor wafer 1, a protective tape 3 is so stuck on the front surface as to protect the semiconductor device. As the protective tape 3, an ultraviolet-ray-cured type adhesive 5 is provided on the front surface of a base material 4, and the size of the used protective tape 3 is made larger than the semiconductor wafer 1. Further, after sticking the protective tape 3 on the front surface of the semiconductor wafer 1, ultraviolet rays 11 are so irradiated from the rear surface of the semiconductor wafer 1 as to reduce the adhering force of the adhesive 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a semiconductor device and a transport container therefor, and more particularly to a manufacturing method capable of protecting a semiconductor wafer when the back surface of the semiconductor wafer is ground and a transport container for a protected semiconductor wafer.

Usually, a semiconductor wafer having an electronic circuit formed on the front surface is formed to a predetermined thickness by grinding the back surface thereof.
Recently, in order to reduce the thickness of a semiconductor device (a so-called semiconductor chip), it is required to grind the back surface of the semiconductor wafer until the thickness becomes extremely thin, such as 100 μm or 50 μm or less. ing.

Conventionally, when grinding the back surface of a semiconductor wafer, a protective tape is applied to the circuit surface side to protect the circuit surface and fix the semiconductor wafer.
However, if the semiconductor wafer is ground very thinly, the strength of the semiconductor wafer is remarkably lowered, and the semiconductor wafer is damaged even by a slight impact.

For example, after the grinding of the back surface is completed, the semiconductor wafer is transferred to a subsequent process. However, the transfer between the processes is often performed manually in a state of being stored in a cassette.
During this manual transfer, the semiconductor wafer may come into contact with the side wall of the cassette and the end thereof may be chipped or the semiconductor wafer may be cracked. For example, a protective tape is applied to the semiconductor wafer. Such a protective structure has been proposed (see, for example, Patent Document 1).

In this protective structure, a portion of the protective tape that protrudes from the outer periphery of the wafer becomes a cushioning material by attaching a protective tape having a diameter larger than the outer diameter of the semiconductor wafer.
JP 2004-146761 A

  By the way, the protective tape used in the protective structure of the semiconductor wafer is composed of a base material and an adhesive, and the adhesive is made of an acrylic synthetic resin. It is said that it may be an energy ray curable pressure-sensitive adhesive whose bonding state in the resin is changed due to the above, or a re-peeling general-purpose pressure-sensitive adhesive such as rubber.

Further, the area of the adhesive may be the same as that of the base material, or may be substantially the same as that of the wafer.
The manufacturing method when the area of the adhesive is the same as that of the base material is that the part that protrudes from the wafer is applied after the protective tape on which the adhesive is uniformly formed on the base material is affixed to the surface of the semiconductor wafer. Cut it out.

  However, in order to make the area of the adhesive equal to that of the semiconductor wafer, it is necessary to form an adhesive having the same shape as that of the semiconductor wafer on the base material. It is necessary to perform alignment accurately. For this reason, compared with the case where the adhesive is uniformly formed on the base material, the number of steps for manufacturing is increased, the cost is increased, and facilities for aligning the semiconductor wafer and the adhesive are necessary. It will lead to cost increase.

  For this reason, a protective tape having the same adhesive area as that of the base material is used, while the adhesive is required to have a high adhesive strength that does not peel off during grinding as described above. Since it is desired that the adhesive force is low when peeling from a semiconductor wafer, an ultraviolet ray curable adhesive that is an energy ray curable adhesive is generally used.

  However, when using a protective tape in which the area of the adhesive is the same as that of the base material, when the semiconductor wafer is transported, for example, when the back surface of the semiconductor wafer is lifted by a suction pad, the portion protruding from the semiconductor wafer When sucked to the suction pad or touches the side wall of the cassette, the adhesive adheres to the suction pad or the side wall (sticks), and the subsequent transport, that is, the subsequent manufacturing cannot be continued. is there.

  Also, when grinding the backside of a semiconductor wafer with a protective tape attached, there is a UV-curable adhesive with high adhesive strength on the protective tape that protrudes beyond the outer diameter of the semiconductor wafer, so the protective tape adheres to the grindstone. Thus, there is a problem that a protective tape is wound between the grindstone and the semiconductor wafer.

  In addition, when transporting a semiconductor wafer with a protective tape attached or a semiconductor wafer ground on its back to another factory, it is necessary to store the semiconductor wafer in a transport container. If there is an adhesive on the protruding protective tape, the protective tape will adhere (stick), adhere to the interlayer paper inserted between the semiconductor wafers, or adhere to the transport container. It becomes difficult to take out the semiconductor wafers one by one from the container, and in the worst case, there is a problem that the thinly ground semiconductor wafer is damaged.

  Furthermore, since the protective tape has a circular shape larger than the outer shape of the semiconductor wafer, there is a problem that the semiconductor wafer rotates due to vibration during transportation, and the back surface thereof is scratched or soiled.

  Accordingly, the present invention relates to a method of manufacturing a semiconductor device and a transport container for the same that can facilitate transport and transportation and prevent damage to the semiconductor wafer when protecting the semiconductor wafer with a UV-curable adhesive-coated protective tape. The purpose is to provide.

In order to solve the above-mentioned problems, a method for manufacturing a semiconductor device according to claim 1 of the present invention is characterized in that when a back surface opposite to a circuit surface side of a semiconductor wafer is ground, a protective tape is applied to the surface. A method of manufacturing a semiconductor device that protects the semiconductor device,
As the protective tape, with a UV curable adhesive and larger than the semiconductor wafer,
In this method, the protective tape is applied to the front surface of the semiconductor wafer and then irradiated with ultraviolet rays from the back surface of the semiconductor wafer.

According to a second aspect of the present invention, there is provided a method for manufacturing a semiconductor device, wherein when a back surface opposite to a circuit surface side of a semiconductor wafer is ground, a protective tape is attached to the surface of the semiconductor device. A method of manufacturing a semiconductor device to be protected,
As the protective tape, with a UV curable adhesive and larger than the semiconductor wafer,
Affix the protective tape to the surface of the semiconductor wafer,
Next, after a part of the outer peripheral portion of the protective tape is cut along a linear cutting line, ultraviolet rays are irradiated from the back surface of the semiconductor wafer.

Furthermore, a transport container for a semiconductor device according to claim 3 of the present invention is a transport container for transporting a semiconductor wafer to which a protective tape obtained by the manufacturing method according to claim 1 is attached,
A container body capable of holding a plurality of semiconductor wafers in a stacked state; and
A lid that covers the outer periphery of the container body from above;
A needle-like fixing member that is inserted through the lid body from the outside in a state where the container body is covered with the lid body and that can penetrate the outer peripheral portion of the protective tape attached to each semiconductor wafer in the laminated state. It is a thing.

Furthermore, a transport container for a semiconductor device according to claim 4 of the present invention is a transport container for transporting a semiconductor wafer to which a protective tape obtained by the manufacturing method according to claim 2 is attached,
A container main body provided with an abutting member capable of holding a plurality of semiconductor wafers in a stacked state and contacting a linear cut surface of a protective tape attached to each semiconductor wafer to prevent its movement;
And a lid that covers the outer periphery of the container body from above.

  According to the manufacturing method of each semiconductor device described above, when grinding a semiconductor wafer, a protective tape larger than the semiconductor wafer is applied to the surface of the circuit surface side, and then the ultraviolet light is irradiated from the back surface to protrude the semiconductor wafer. Since the adhesive strength of the outer peripheral portion is reduced, a carrier such as a suction pad or a transport container, for example, does not adhere to the protective tape at the time of grinding and subsequent transport, transport, etc. It is possible to prevent the wafer production from being interrupted.

  In addition, according to the transport container of each semiconductor device, when the semiconductor wafer is housed in the container and transported, the outer peripheral portion of the protective tape is fixed in a skewered state by a needle-shaped fixing member, or Since the cut surface of the protective tape is brought into contact with the contact member, the semiconductor wafer can be prevented from moving even if the transport container is shaken when transported by hand, for example. It is possible to prevent the wafer from being damaged.

Hereinafter, a method for manufacturing a semiconductor device and its transport container according to an embodiment of the present invention will be described.
The semiconductor device manufacturing method includes a number of processes. The gist of the present invention is to protect the circuit surface when grinding (polishing) the back surface of the semiconductor device, that is, the semiconductor wafer, Since this semiconductor wafer is related to protection when it is transported in a transport container, in the following embodiments, description will be given focusing on this part.
[Embodiment 1]
Hereinafter, a method for manufacturing a semiconductor device and a transport container thereof according to the first embodiment will be described with reference to FIGS.

First, a method for manufacturing a semiconductor device will be described with reference to FIGS.
As shown in FIGS. 1A and 1E, a protective tape 3 is attached to the surface of the circular semiconductor wafer 1 on the circuit surface 2 side. The protective tape 3 is circular, and the size (outer diameter) is larger than the outer shape (outer diameter) of the semiconductor wafer 1.

  As shown in FIG. 1 (a), this protective tape 3 is one in which an adhesive 5 such as an acrylic synthetic resin is provided on the surface of a substrate 4 such as PET or polyolefin. Of course, the adhesive 5 is a semiconductor. The wafer 1 is in close contact with the surface of the circuit surface 2 side. In addition, this adhesive 5 has the characteristic that the bonding state in resin changes with ultraviolet irradiation, and adhesive force (adhesive force) falls.

Next, as shown in FIG. 1B, the semiconductor wafer 1 to which the protective tape 3 is attached is irradiated with ultraviolet rays 11 from the back side.
Thus, when the ultraviolet rays 11 are irradiated from the back surface, the adhesive force of the outer peripheral portion (so-called exposed portion) 3a protruding from the wafer of the protective tape 3 attached to the front surface of the semiconductor wafer 1 is reduced. .

  Therefore, when the semiconductor wafer 1 is held between, for example, suction pads (transport tools) and transported between processes, the outer peripheral portion 3a of the protective tape 3 is sucked by the suction pads when the back surface is sucked by the suction pads, There is no concern that the adhesive 5 of the protective tape 3 adheres to the suction pad (sticks or sticks) and hinders wafer conveyance.

  Next, as shown in FIG. 1C, the back surface of the semiconductor wafer 1 is ground by using a grindstone 12 for back grinding so that the semiconductor wafer 1 having a predetermined thickness as shown in FIG. A device is obtained.

  As described above, when grinding the semiconductor wafer 1, the protective tape 3 larger than the semiconductor wafer 1 was attached to the surface on the circuit surface 2 side, and then the ultraviolet rays 11 were irradiated from the back surface to protrude the surface. Since the adhesive force of the outer peripheral portion 3a is reduced, a carrier such as a suction pad or a transport container, for example, does not adhere to the protective tape 3 at the time of grinding and subsequent transport, transport, etc. It is possible to prevent the production of the semiconductor wafer 1 from being interrupted.

  In addition, the manufacturing method which concerns on the summary of this invention is shown with a flowchart in the flowchart of FIG. Simply put, a protective tape affixing process for affixing a protective tape to the surface of a semiconductor wafer, an ultraviolet irradiation process for irradiating the semiconductor wafer with the protective tape affixed in this affixing process from the back surface, and this ultraviolet irradiation process And a wafer grinding step of grinding the back surface of the semiconductor wafer after being irradiated with the wafer. Of course, a predetermined pre-process is provided before the protective tape attaching process, and a predetermined post-process is also provided after the wafer grinding process.

Next, a transport container and a transport method for transporting the semiconductor wafer 1 with the protective tape 3 attached thereto, for example, to another factory will be described.
First, the transport container will be described with reference to FIG.

  As shown in (a) to (c) of FIG. 3, the transport container 21 is a container main body 22, a lid body 23, and the container main body 22 covered (covered) with the lid body 23. It is comprised from the holder 24 for hold | maintaining (fixing) the cover body 23 to the container main body 22. FIG. The holder 24 has a U-shape in a side view, and is provided at a plurality of locations (for example, 2 to 4 locations) around the holder 24 so as to integrally grip both from above and below.

  The container main body 22 includes a circular bottom plate (also a support plate) 31 and a holding member (also referred to as a positioning member) having an arc shape in a plan view standing on the left and right sides of the upper surface of the bottom plate 31 with a predetermined height. 32. A plurality of semiconductor wafers 1 are stacked and accommodated inside these holding members 32, and therefore the distance (diameter) between the inner surfaces thereof is larger than the outer shape (outer diameter) of the semiconductor wafer 1. It is also a little bigger.

  The lid body 23 has a circular lid plate 35 and a cylindrical side wall member provided on the lower surface of the lid plate 35 so as to surround the left and right holding members 32 from the outside over the entire circumference. 36. Note that the side wall member 36 has substantially the same height as the holding member 32 of the container body 22.

  Further, the transport container 21 is inserted into the transport container 21 at a position corresponding to the outer peripheral portion 3a of the protective tape 3 and from the hole 35a formed in the cover plate 35 toward the bottom plate 31. A needle-like fixing member 25 for fixing the semiconductor wafer 1 through the outer peripheral portion 3a of the tape 3 is provided.

Next, a method for transporting a semiconductor device, that is, a semiconductor wafer, for example, to another factory using the transport container will be described with reference to FIG.
First, as shown in FIG. 4A, an empty container body 22 is prepared, and then, as shown in FIGS. 4B and 4F, the upper surface of the bottom plate 31 (the bottom surface in the container). After the circular lower cushion material 41 made of polyethylene foam is disposed for preventing cracking, both holding members 32 are arranged so that the protective tape 3 attached to the surface of the semiconductor wafer 1 is on the lower side. , 32 and a plurality of them are stored.

  Next, as shown in FIG. 4C, a circular upper cushion material 42 is disposed on the upper surface of the uppermost stacked semiconductor wafer 1, and then the entire semiconductor wafer 1 is covered with a lid body 23 (lid body). ). Of course, the lid body 23 is arranged so that the side wall member 36 covers the outer circumferences of the holding members 32.

Next, as shown in FIG. 4 (d), the lid body 23 is fixed (gripped) to the container body 22 by a plurality of fixtures 24.
Finally, as shown in FIG. 4E, the needle-like fixing member 25 is inserted inward from the hole 35a formed in the cover plate 35, and the protective tape 3 of the laminated semiconductor wafer 1 is provided. Are sequentially penetrated, and the lower end portion thereof is pierced (inserted) into the lower cushion material 41 to form a skewered state, whereby the semiconductor wafers 1 are brought to the transport container 21 side via the protective tape 3. Fix it.

An interlayer paper may be inserted between the stacked semiconductor wafers 1 and 1 in order to protect the back surface of the semiconductor wafer 1.
Of course, when the semiconductor wafer 1 is taken out from the transport container 21, the fixing member 24 may be removed after the needle-like fixing member 25 is extracted.

  As described above, when the plurality of semiconductor wafers 1 are transported in the stacked state in the transport container 21, the adhesive force of the outer peripheral portion 3 a of each protective tape 3 is reduced by the ultraviolet irradiation. 1 or the semiconductor wafer 1 and the transport container 21 do not adhere to each other. To be precise, the protective tapes 3 and 3 or the protective tape 3 and the transport container 21 do not adhere to each other. 1 can be removed from the transport container 21 without any problem.

Further, when the semiconductor wafer 1 is transported, the outer peripheral portion 3a of the protective tape 3 is fixed in a skewered state by the needle-shaped fixing member 25, so that the transport container 21 is shaken when transported by hand, for example. Even in this case, it is possible to prevent the semiconductor wafer 1 from moving (including rotating), and therefore, it is possible to prevent the semiconductor wafer from being damaged.
[Embodiment 2]
Next, a method for manufacturing a semiconductor device and its transport container according to the second embodiment will be described with reference to FIGS.

  Note that the difference between the second embodiment and the first embodiment described above is the way to fix the semiconductor wafer in the transport container, so in this second embodiment, pay attention to this part. In addition, the same components as those in the first embodiment are denoted by the same member numbers, and the description thereof is omitted.

  Briefly speaking, in the first embodiment, when the semiconductor wafer is transported, the outer peripheral portion of the protective tape is fixed by skewering with a needle-shaped fixing member, but in the second embodiment, A part of the outer peripheral portion of the protective tape is cut into a straight line, and the semiconductor wafer is prevented from moving (including rotating) through the cut surface.

  That is, as shown in FIGS. 5A and 5B, a part of the outer peripheral portion 3a of the protective tape 3 attached to the surface on the circuit surface 2 side of the semiconductor wafer 1 according to the second embodiment is a straight line. It was cut in the shape of a split circle along the cutting line.

Here, a method of manufacturing the semiconductor device will be described with reference to FIG.
First, as shown in FIG. 6A, after the protective tape 3 is attached to the surface of the semiconductor wafer 1 on the circuit surface 2 side, a part of the outer peripheral portion 3a (shown by an imaginary line) is a straight cutting line. Cut it out.

Next, as shown in FIG. 6B, the semiconductor wafer 1 to which the protective tape 3 is attached is irradiated with ultraviolet rays 11 from its back surface to reduce the adhesive strength of the outer peripheral portion 3a.
Next, as shown in FIG. 6 (c), the back surface of the semiconductor wafer 1 is ground using a back grinding wheel 12 so that the semiconductor wafer 1 having a predetermined thickness as shown in FIG. A device is obtained.

Of course, the semiconductor device manufactured in this way can achieve the same effects as those of the first embodiment.
Next, a transport container and a transport method for transporting the semiconductor wafer 1 with the protective tape 3 attached thereto, for example, to another factory will be described.

First, the transport container will be described with reference to FIG.
As shown in FIG. 7, the transport container 21 includes a container body 22, a lid body 23, and the container body 22 covered (covered) with the lid body 23. It is comprised from the holder 24 for hold | maintaining (fixing). The holder 24 has a U-shape in a side view, and is provided at a plurality of locations (for example, 2 to 4 locations) around the holder 24 so as to integrally grip both from above and below.

  The container main body 22 includes a circular bottom plate (also a support plate) 31 and a holding member (also referred to as a positioning member) having an arc shape in a plan view standing on the left and right sides of the upper surface of the bottom plate 31 with a predetermined height. 32, which is also erected on the top surface of the bottom plate 31 and near one holding member 32, and contacts the cut surface S of the protective tape 3 of the semiconductor wafer 1 stacked between the holding members 32, 32 ( And a plate-like contact member 33 that can prevent the movement of the semiconductor wafer 1.

  As with the first embodiment, the lid body 23 is provided on a circular lid plate 35 and a lower surface of the lid plate 35 so as to surround the left and right holding members 32 from the outside over the entire circumference. It is comprised from the cylindrical side wall member 36 made. Further, the side wall member 36 is substantially level with the holding member 32 of the container body 22. Unlike the first embodiment, the cover plate 35 is not formed with a hole for inserting the needle-like fixing member 25.

Next, a method for transporting a semiconductor device, that is, a semiconductor wafer by the transport container to, for example, another factory will be described with reference to FIG.
First, as shown in FIGS. 8A and 8E, an empty container body 22 is prepared. Next, as shown in FIG. 8B, the upper surface of the bottom plate 31 (also referred to as the inner bottom surface of the container). After the circular lower cushion material 41 made of polyethylene foam or the like is arranged for preventing cracking, the protective tape 3 is placed so that the protective tape 3 attached to the surface of the semiconductor wafer 1 is on the lower side. A plurality of the cut surfaces S are stacked and stored between the holding members 32 and 32 so that the cut surfaces S come into contact with the surface 33 a of the contact member 33.

  Next, as shown in FIG. 8C, a circular upper cushion material 42 is disposed on the upper surface of the uppermost stacked semiconductor wafer 1, and then the entire semiconductor wafer 1 is covered with the lid body 23 (the lid body). ). Of course, the lid body 23 is arranged so that the side wall member 36 covers the outer circumferences of the holding members 32.

Next, as shown in FIG. 8 (d), the lid body 23 is fixed (gripped) to the container body 22 by a plurality of fixtures 24.
Of course, in this case, interlayer paper may be inserted between the stacked semiconductor wafers 1 and 1 in order to protect the back surface of the semiconductor wafer 1.

  As described above, when the plurality of semiconductor wafers 1 are transported in the stacked state in the transport container 21 as in the first embodiment, the adhesive force of the outer peripheral portion 3a of each protective tape 3 is reduced by the ultraviolet irradiation. Therefore, the semiconductor wafers 1 and 1 or the semiconductor wafer 1 and the transport container 21 do not adhere to each other. To be precise, the protective tapes 3 and 3 or the protective tape 3 and the transport container 21 are mutually attached. Therefore, the semiconductor wafer 1 can be taken out from the transport container 21 without any trouble.

  Further, when the semiconductor wafer 1 is transported, the cut surface S of the outer peripheral portion 3a of the protective tape 3 is in contact with the surface 33a of the contact member 33. Even when the semiconductor wafer 1 is shaken, the semiconductor wafer 1 can be prevented from moving (including rotating), and thus the semiconductor wafer can be prevented from being damaged.

  According to the method of manufacturing a semiconductor device according to the present invention, the adhesive force of the portion of the protective tape with an ultraviolet curable adhesive that is attached to a semiconductor wafer is reduced from the wafer. It can prevent the protective tape from adhering to the grinding tool, transport tool, transport container, etc. during transportation, so when semiconductor wafer is thinly ground, or when transporting or transporting thin semiconductor wafer, etc. Useful.

FIG. 5 is a diagram illustrating the steps of the method for manufacturing the semiconductor device according to the first embodiment of the present invention, in which (a) to (d) are cross-sectional views and (e) is a plan view of (a). It is a flowchart which shows the manufacturing method. It is a figure which shows the transport container which concerns on Embodiment 1 of this invention, (a) is whole sectional drawing, (b) is a top view of a container main body, (c) is sectional drawing of a container main body. It is process drawing explaining the transportation method which concerns on Embodiment 1 of this invention, (a)-(e) is sectional drawing, (f) is a top view of (b). It is a figure which shows the semiconductor device which concerns on Embodiment 2 of this invention, (a) is sectional drawing, (b) is a top view. It is sectional drawing which shows the process of the manufacturing method of the same semiconductor device. It is a figure which shows the transport container which concerns on Embodiment 2 of this invention, (a) is whole sectional drawing, (b) is a top view of a container main body, (c) is sectional drawing of a container main body. It is process drawing explaining the transportation method which concerns on Embodiment 2 of this invention, (a)-(d) is sectional drawing, (e) is a top view of (b).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Circuit surface 3 Protection tape 3a Perimeter part 4 Base material 5 Adhesive 11 Ultraviolet ray 21 Transport container 22 Container main body 23 Cover body 24 Fixing tool 25 Fixing member 31 Bottom plate 32 Holding member 33 Contact member 33a Surface 35 Cover plate 35a Hole 36 Side wall member

Claims (4)

When grinding the back surface opposite to the circuit surface side of the semiconductor wafer, a semiconductor device manufacturing method in which a protective tape is attached to the surface to protect the semiconductor device,
As the protective tape, with a UV curable adhesive and larger than the semiconductor wafer,
A method of manufacturing a semiconductor device, comprising: attaching the protective tape to a surface of a semiconductor wafer, and then irradiating ultraviolet rays from the back surface of the semiconductor wafer. When grinding the back surface opposite to the circuit surface side of the semiconductor wafer, a semiconductor device manufacturing method in which a protective tape is attached to the surface to protect the semiconductor device,
As the protective tape, with a UV curable adhesive and larger than the semiconductor wafer,
Affix the protective tape to the surface of the semiconductor wafer,
Next, a part of the outer peripheral portion of the protective tape is cut along a linear cutting line, and then irradiated with ultraviolet rays from the back surface of the semiconductor wafer. A transport container for transporting a semiconductor wafer to which a protective tape obtained by the manufacturing method according to claim 1 is attached,
A container body capable of holding a plurality of semiconductor wafers in a stacked state; and
A lid that covers the outer periphery of the container body from above;
A needle-like fixing member that can pass through the outer peripheral portion of the protective tape attached to each semiconductor wafer in a stacked state while the cover body is inserted from the outside while the container body is covered with the lid body. A transport container for a semiconductor device. A transport container for transporting a semiconductor wafer to which a protective tape obtained by the manufacturing method according to claim 2 is attached,
A container main body provided with an abutting member capable of holding a plurality of semiconductor wafers in a stacked state and contacting a linear cut surface of a protective tape attached to each semiconductor wafer to prevent its movement;
A transport container for a semiconductor device, comprising: a lid body configured to cover the outer periphery of the container body from above.

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