JPH0760580A - Fa system - Google Patents

Abstract

PURPOSE:To eliminate an error or the like of an ID by mounting a radio tag, comprising a memory for recording fully or partly information of working condition or the like of a workpiece and a circuit for exchanging the information of this memory with a radio wave, to each workpiece, and receiving this radio wave to control a working device. CONSTITUTION:A semiconductor wafer 1, which is a workpiece, is held in the central part of an almost ring-shaped frame 2 through a synthetic resin-made thin adhesive tape 3, but to an important position of the frame 2, a radio tag 4 formed to be sealed in capsule or the like is bonded. This radio tag 4 has a memory for recording fully or partly information, circuit for converting the information of this memory into a radio wave and a coil, to record, in addition to the ID information, key pattern information, x, y axis street space information, street width information, etc. The radio wave generated from the radio tag 4 at cutting work (dicing) time is received by a radio reader provided with an antenna, to control a dicing device based on a received data.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an FA system for processing equipment such as dicing equipment.

[0002]

2. Description of the Related Art For example, in an FA system for cutting a semiconductor wafer with a dicing machine, an identification display showing the ID (identification) of the semiconductor wafer is attached to a key portion of a frame for holding the semiconductor wafer, and the cutting process is performed. At that time, the identification display is read by the detecting means and input to the control device, and a command signal (previously stored in the host computer) corresponding to the information signal is output to the dicing device, whereby the semiconductor wafer is automatically Can be cut (for example, Japanese Patent Publication No. 64-12094).

[0003]

A bar code, for example, is used as the identification display means of the FA system, and the bar code display is attached to the end of the frame or the like and read by a well-known bar code reader. If the surface of the display object is dirty or scratched, it may not be read correctly and may be misidentified. There is also an attachment method such as tying with a string etc. without sticking the bar code display object to the frame, but it may become obstructive in the previous process etc. and may be dropped or damaged and become unreadable. is there. The present invention has been made in order to solve such a conventional problem, and has been improved so that misidentification of an ID of a semiconductor wafer does not occur due to dirt or damage of a bar code display object. To provide the FA system of.

[0004]

Means for Solving the Problems As a means for technically solving the above problems, the present invention provides a memory for recording all or part of information such as processing conditions of a workpiece, and information in the memory. A radio wave tag consisting of a circuit that converts the radio waves into radio waves is attached to each work piece via a frame, etc., and the reader receives the radio waves generated by the radio wave type tag to control the processing device. The FA system is the main point.

[0005]

[Operation] The ID display of the work piece has been replaced with a radio frequency tag so that the ID can be confirmed without contact, so misidentification due to dirt and scratches is eliminated, and the information stored in the radio tag memory is saved. It is possible to read and control the processing equipment directly without going through the host computer.

[0006]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a semiconductor wafer as a workpiece, which is held in the center of a substantially ring-shaped frame 2 via a thin adhesive tape 3 made of synthetic resin.

Reference numeral 4 denotes a radio wave type tag formed by encapsulating in a capsule or the like, which is a main part of the frame 2 (in the illustrated example, an inner portion of the cutout end portion 2a near the orientation flat portion 1a of the semiconductor wafer 1). , Or on the adhesive tape 3). As shown in FIG. 2, this radio wave tag 4 has a memory 4a for recording all or a part of information, a circuit 4b for converting the information in this memory into a radio wave, and a coil 4c,
At least ID information about the semiconductor wafer 1 is registered.

An ID is stored in the memory 4a of the radio tag 4.
In addition to the information, for example, key pattern information of the semiconductor wafer 1, street spacing information on the x-axis and y-axis, street width information, defective chip information, information on the function and property of the chip, information on the shape such as wafer diameter and thickness. Conventionally, it is possible to write various information, such as history information of a production process and a production factory, which should be registered in a host computer, for each process, and it is also possible to write a processing result. Of course, only the ID may be recorded in the memory 4a and other information may be recorded in the host computer.

In this way, the semiconductor wafer 1 having the radio frequency tag 4 attached to the frame 2 is cut (diced) by a dicing device, and the radio wave emitted from the radio frequency tag 4 at the time of this cutting is an antenna. The dicing device is controlled by receiving at least the ID information and the processing information stored in the memory 4a,
It is possible to accurately cut along the streets of the semiconductor wafer 1. Unlike conventional barcodes, it is non-contact and does not cause misidentification due to dirt or scratches.

FIG. 3 shows an embodiment applied to a dicing system in which a plurality of dicing devices and a conveying path are combined, and a frame on which a semiconductor wafer, which is a workpiece, is placed is carried out to the conveying path by a carrying-out means. Then, when it is transported to the required dicing device, the frame is picked up by the wafer transfer means and supplied to the dicing device, and after the cutting processing by this dicing device, the frame is returned to the transfer path again by the previous wafer transfer means, The frame is configured to be carried to the next step by this carrying path.

This dicing system will be described in more detail. As shown in FIG. 3, the first dicing device 10 and the second dicing device 10 are used.
And the dicing device 11 of FIG. 1 are installed in parallel with each other at an appropriate interval, and are formed by a plurality of belt conveyors.
The first radio wave reader 13 receives the information of the radio wave type tag 4 from the frame 2 conveyed along the line 2, and the first dicing device 10 stops the one to be processed by the first stopper means 14, While being supplied to the first dicing device 10 by the first transfer means 15, those not processed by the first dicing device 10 are passed through as they are.

In the passed frame, the information of the radio wave type tag is received by the second radio wave reader 16 and the second radio wave reader 16 receives the information of the radio wave type tag as described above.
Stop by the stopper means 17 of the second transfer means 18
Is supplied to the second dicing device 11 and processed. After the processing, it is returned to the carrying path 12 and conveyed to the next step. 19 is a semiconductor wafer 1 which is a workpiece
Reference numeral 20 denotes a supply unit for supplying the frame 2 on which is mounted, and reference numeral 20 is a reception unit for receiving the frame after the dicing process.

In this way, the frame sent from the carrier path at a constant speed is supplied to the dicing device to be processed while receiving the information of the radio wave type tag by the radio wave reader and performing the predetermined processing. Can perform efficiently and smoothly. In this case, an example of two dicing devices has been described, but the present invention is not limited to this, and it is also possible to incorporate and implement more dicing devices.

[0014]

As described above, according to the present invention,
In the FA system of processing equipment such as dicing equipment, the ID display of the work piece is replaced with a radio wave type tag and the ID is contactless.
Since it is possible to check the ID, there is no problem of ID misidentification due to dirt or scratches on the bar code display as in the past, and the information stored in the memory of the radio frequency tag is read without using the host computer. It is possible to obtain excellent effects such as direct control of the processing equipment.

[Brief description of drawings]

FIG. 1 is a plan view showing a state in which a radio frequency tag according to the present invention is attached to a frame that holds a semiconductor wafer.

FIG. 2 is an explanatory diagram showing a configuration of a radio tag.

FIG. 3 is an explanatory diagram showing an embodiment of the FA system of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer 1a ... Orifla part 2 ... Frame 2a ... Notch edge part 3 ... Adhesive tape 4
… Radio wave tag 4a… Memory 4b… Circuit 4
c ... Coil 10 ... First dicing device 11 ... Second dicing device 12 ... Conveyance path 13 ... First radio wave reader 14 ... First stopper means 15 ... First shifting means 16 ... Second radio wave reader 17 ... second stopper means 18 ... second transition means 19 ... supply section 20 ... reception section

Claims (1)

[Claims] 1. A radio-wave tag comprising a memory for recording all or a part of information such as processing conditions of a workpiece and a circuit for converting the information in the memory into a radio wave, a frame or the like for each workpiece. An FA system that is installed via a reader and controls the processing equipment by the reader receiving the radio waves generated by the radio tag.