JP5002350B2 - 回路装置 - Google Patents

回路装置 Download PDF

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Publication number
JP5002350B2
JP5002350B2 JP2007170561A JP2007170561A JP5002350B2 JP 5002350 B2 JP5002350 B2 JP 5002350B2 JP 2007170561 A JP2007170561 A JP 2007170561A JP 2007170561 A JP2007170561 A JP 2007170561A JP 5002350 B2 JP5002350 B2 JP 5002350B2
Authority
JP
Japan
Prior art keywords
wiring
insulating layer
metal substrate
circuit device
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007170561A
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English (en)
Japanese (ja)
Other versions
JP2009010192A5 (enExample
JP2009010192A (ja
Inventor
真弓 中里
洋 高野
徹郎 澤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2007170561A priority Critical patent/JP5002350B2/ja
Publication of JP2009010192A publication Critical patent/JP2009010192A/ja
Publication of JP2009010192A5 publication Critical patent/JP2009010192A5/ja
Application granted granted Critical
Publication of JP5002350B2 publication Critical patent/JP5002350B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2007170561A 2007-06-28 2007-06-28 回路装置 Expired - Fee Related JP5002350B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007170561A JP5002350B2 (ja) 2007-06-28 2007-06-28 回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007170561A JP5002350B2 (ja) 2007-06-28 2007-06-28 回路装置

Publications (3)

Publication Number Publication Date
JP2009010192A JP2009010192A (ja) 2009-01-15
JP2009010192A5 JP2009010192A5 (enExample) 2010-08-26
JP5002350B2 true JP5002350B2 (ja) 2012-08-15

Family

ID=40324983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007170561A Expired - Fee Related JP5002350B2 (ja) 2007-06-28 2007-06-28 回路装置

Country Status (1)

Country Link
JP (1) JP5002350B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046617A1 (ja) * 2011-09-28 2013-04-04 三洋電機株式会社 素子搭載用基板、半導体モジュールおよび素子搭載用基板の製造方法
KR101204564B1 (ko) * 2011-09-30 2012-11-23 삼성전기주식회사 전력 모듈 패키지 및 그 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316592A (ja) * 1995-05-23 1996-11-29 Fujitsu Ltd 回路基板及びその製造方法
JP2002280686A (ja) * 2001-03-15 2002-09-27 Nippon Avionics Co Ltd メタルコアプリント配線板およびその製造方法
TWI267173B (en) * 2004-03-29 2006-11-21 Sanyo Electric Co Circuit device and method for manufacturing thereof
JP2006100753A (ja) * 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 半導体モジュールおよびその製造方法

Also Published As

Publication number Publication date
JP2009010192A (ja) 2009-01-15

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