JP2009010192A5 - - Google Patents

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Publication number
JP2009010192A5
JP2009010192A5 JP2007170561A JP2007170561A JP2009010192A5 JP 2009010192 A5 JP2009010192 A5 JP 2009010192A5 JP 2007170561 A JP2007170561 A JP 2007170561A JP 2007170561 A JP2007170561 A JP 2007170561A JP 2009010192 A5 JP2009010192 A5 JP 2009010192A5
Authority
JP
Japan
Prior art keywords
wiring
circuit device
metal substrate
insulating layer
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007170561A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009010192A (ja
JP5002350B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007170561A priority Critical patent/JP5002350B2/ja
Priority claimed from JP2007170561A external-priority patent/JP5002350B2/ja
Publication of JP2009010192A publication Critical patent/JP2009010192A/ja
Publication of JP2009010192A5 publication Critical patent/JP2009010192A5/ja
Application granted granted Critical
Publication of JP5002350B2 publication Critical patent/JP5002350B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007170561A 2007-06-28 2007-06-28 回路装置 Expired - Fee Related JP5002350B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007170561A JP5002350B2 (ja) 2007-06-28 2007-06-28 回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007170561A JP5002350B2 (ja) 2007-06-28 2007-06-28 回路装置

Publications (3)

Publication Number Publication Date
JP2009010192A JP2009010192A (ja) 2009-01-15
JP2009010192A5 true JP2009010192A5 (enExample) 2010-08-26
JP5002350B2 JP5002350B2 (ja) 2012-08-15

Family

ID=40324983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007170561A Expired - Fee Related JP5002350B2 (ja) 2007-06-28 2007-06-28 回路装置

Country Status (1)

Country Link
JP (1) JP5002350B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046617A1 (ja) * 2011-09-28 2013-04-04 三洋電機株式会社 素子搭載用基板、半導体モジュールおよび素子搭載用基板の製造方法
KR101204564B1 (ko) * 2011-09-30 2012-11-23 삼성전기주식회사 전력 모듈 패키지 및 그 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316592A (ja) * 1995-05-23 1996-11-29 Fujitsu Ltd 回路基板及びその製造方法
JP2002280686A (ja) * 2001-03-15 2002-09-27 Nippon Avionics Co Ltd メタルコアプリント配線板およびその製造方法
TWI267173B (en) * 2004-03-29 2006-11-21 Sanyo Electric Co Circuit device and method for manufacturing thereof
JP2006100753A (ja) * 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 半導体モジュールおよびその製造方法

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